Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Takaaki Higashida

Kaori Toyoda

Takashi Kubo

Shinji Kadoriku

Hiroshi Yutani

Yoshio Maruyama

Satoshi Maeshima

Daisuke Suetsugu

Kenichi Yamamoto

Yoshihisa Ohido

Kazuhiro Nishikawa

Akira Kabeshita

Takahiro Matsuo

Takao Naito

Hiroyuki Otani

Hiroaki Onishi

Mamoru Inoue

Kazuyuki Sawada

Koichi Kumagai

Munekazu Nishihara

Takashi Imanaka

Toshiyuki Fujioka

Shigeru Namiki

Shoji Sato

Tetsuo Imada

Tokiharu Nakagawa

Takahiko Iwaki

Kenichi Sato

Kazuo Inoue

Shuhei Nakatani

Hisao Nagai

Takafumi Okuma

Yasushi Taniguchi

Hiroshi Hayata

Hirotaka Hisamura

Toshinari Nitta

Jun Katsube

Yoshie Iwane

Yoshihiro Kawasaki

Akinobu Katayama

Shinsuke Itoi

Tadao Murata

Hisayoshi Watanabe

Miyuki Nagaoka

Kazunori Kurumaya

Nobuaki Hirata

Osamu Sengoku

Toru Uchida

Keizo Matsumura

Seiji Nakashima

A thermoelectric conversion module and a thermoelectric conversion apparatus in which a thermoelectric conversion element can be flexibly attached to heat sources having various shapes in high density are provided. The thermoelectric conversion module includes a first thermoelectric conversion element configured of a cylindrical thermoelectric conversion material having a hollow portion and a second thermoelectric conversion element configured of a thermoelectric conversion material having a different conductive type from that of the first thermoelectric conversion element and fixed in the hollow portion.

Thermoelectric conversion module and thermoelectric conversion apparatus

A thermoelectric conversion module includes p-type and n-type thermoelectric conversion elements arranged between two stacked substrates. The p-type and n-type thermoelectric conversion elements include columnar p-type and n-type thermoelectric conversion portions, insulators provided in side surfaces of the p-type and n-type thermoelectric conversion portions, and diffusion preventing films provided on top surface, the top surface different from the side surface of the p-type and n-type thermoelectric conversion portions. Each stacked substrate includes an interconnecting layer that electrically connects the p-type and n-type thermoelectric conversion portions through the diffusion preventing films, and a jointing material that joins the diffusion preventing films and the interconnecting layer. Top surfaces of the diffusion preventing films are projected from upper and lower top surfaces of each insulator in a direction connecting the upper and lower top surfaces of the p-type and n-type thermoelectric conversion portions, and gap is provided on each insulator in the direction.

Thermoelectric conversion module

The invention provides a thermoelectric conversion element having a lot of pn junction pairs per unit area and having a thermoelectric material chip which is hardly broken, and a producing method thereof. In the thermoelectric conversion element of the invention, plural substrates in each of which a film-shaped thermoelectric material is formed in a surface thereof are disposed. As a result, because the number of pn junction pairs per unit area is increased, a high output can be obtained. Because the thermoelectric material is formed into the film shape, reliability degradation caused by a breakage of the thermoelectric material can be prevented, even in the thermoelectric material having many pn junction pairs per unit area, namely, a sectional area is small.

Thermoelectric conversion element and producing method thereof

The present invention provides a thermoelectric conversion element, a thermoelectric conversion element module, and a method of manufacturing the same that can easily realize high-density arrangement of thermoelectric conversion elements and securement of connection reliability. The thermoelectric conversion element has, for example, rod-shaped thermoelectric conversion material, tube that has an insulation property and an adiabatic property and houses thermoelectric conversion material, and electrodes that are in close adhesion to the end surfaces of thermoelectric conversion material and tube. A surface roughness Ra of the end surfaces is larger than 0.8 micrometers. In the present invention, the thermoelectric conversion elements can be arranged at a high density such that tubes are in close adhesion to each other. Also, since the close adhesion surface of electrodes on the end surfaces is large, the connection reliability of electrodes is further improved.

Thermoelectric conversion element, thermoelectric conversion element module, and method of manufacturing the same

The present invention relates to an apparatus and a method for manufacturing a thermoelectric conversion element. The present invention provides an apparatus for manufacturing a thermoelectric conversion element that can easily realize a high-density array of thermoelectric conversion elements and secure connection reliability. This is an apparatus for manufacturing a thermoelectric conversion element that sucks a p-type or n-type thermoelectric conversion material into heat-resisting insulating tubeand includes preheating apparatusthat can heat tubeto a predetermined temperature before sucking the melted thermoelectric conversion element. Tubewhose temperature condition is adjusted by being heated by preheating apparatusis inserted into crucibleand the molten thermoelectric conversion material is sucked into tubeby decompression apparatus

Apparatus for manufacturing thermoelectric conversion element

The present invention provides a thermoelectric conversion element module and a manufacturing method thereof capable of easily realizing a high-density array and securing connection reliability. The module includes a thermoelectric conversion element group made up of P-type elements and N-type elements alternately arranged in a first direction and a heat-resistant insulating member filling the periphery of the thermoelectric conversion materials, wherein the P-type elements and the N-type elements are connected via connection electrodes on a side portion of the group along the first direction, and connection electrodes at other parts of the group along a second direction crossing the first direction. The module is manufactured by forming a connection electrode layer that extends to the side portion of the group on the surface of the group and cutting this connection electrode layer between the thermoelectric conversion elements along the first direction and the second direction.

Thermoelectric conversion element module and method of manufacturing the same

The invention provides a thermoelectric conversion module, which can implement a high power generation capacity and high reliability of electric connection between thermoelectric conversion elements and meet various diameters and lengths of a tube as a heat source. The thermoelectric conversion module includes a straight-chain module unit. In the module unit, plural P-type elements and plural N-type elements, which are alternately arrayed, are electrically connected in series by a braided wire A and a braided wire B. The braided wire A connects one end surface of the P-type element and one end surface of the N-type element. The braided wire B connects the other end surface of the P-type element and the other end surface of the N-type element. The braided wire B is shorter than the braided wire A. The thermoelectric conversion module including only the module unit is spirally wound around a tube as a heat source.

Thermoelectric conversion module and method of manufacturing thereof

Disclosed is an organic EL device which comprises: a pixel electrode that is arranged on a substrate; a hole injection layer that is arranged on the pixel electrode and has a photocatalytic function; an organic functional layer that is formed on the hole injection layer by a coating method; a bank made of a fluorine-containing resin and defines the region where the organic functional layer is arranged; and a counter electrode that is arranged so as to cover the bank and the organic functional layer. Due to the photocatalytic function of the hole injection layer, the bank residuals can be removed by low-energy ultraviolet light that has a longer wavelength (300-400 nm) than conventional high-energy ultraviolet light that has a short wavelength (254 nm or 172 nm).

Organic EL device and method for manufacturing same

A production method of an ink composition for organic EL devices comprises preparing a composition containing a polymer organic EL material and an organic solvent; and applying an electric field to the composition. Preferably, a composition containing a polymer organic EL material prepared by a coupling reaction between a halogenated aromatic compound and an aromatic boron compound in the presence of palladium catalyst or nickel catalyst, an organic solvent, and an aromatic carboxylic acid contained in an amount of 0.01-1 wt % based on the total amount of the organic solvent and aromatic carboxylic acid is prepared.

Ink composition for organic electroluminescent device and production method thereof

There is provided a display apparatus configured by stacking a drive circuit substrate and a light-emitting substrate. Electrodes of the substrates are accurately aligned to be electrically connected to each other. A display apparatus is configured by stacking a drive circuit substrate having a drive circuit and a light-emitting substrate having a light-emitting unit including a pixel electrode to cause the drive circuit substrate and the light-emitting substrate to face each other, wherein on a stacked plane between the drive circuit substrate and the light-emitting substrate, an intermediate electrode connected to the light-emitting unit of the light-emitting substrate and a connection electrode connected to the drive circuit and the drive circuit substrate are electrically connected to each other, and the intermediate electrode is elongated in a direction parallel to or perpendicular to a longitudinal direction of the pixel electrode on the stacked plane.

Display apparatus

A connecting structure includes a circuit board with a first connection land having a plurality of conductor patterns on the surface thereof, a second connection land disposed in a position opposite to the first connection land of the circuit board, and a flexible board including an insulating layer formed so as to surround at least a part of outer periphery of the second connection land. The first connection land and the second connection land are bonded to each other with a bonding member, and the insulating layer is thicker than the total thickness of the second connection land and the first connection land. It is possible to obtain an electronic circuit connecting structure which is free from short-circuit due to running of the bonding member such as solder even with the connecting land greatly reduced in size, and its connecting method.

Electronic circuit connecting structure, and its connecting method

A circuit substrate has a flexible thin film, electric wires supported on the film, and an electronic component supported on the film and positioned between the wires so that the wires and the component are electrically connected serially. Also, a thickness of the component is less than that of the electric wires.

Circuit substrate and its manufacturing method

A method of manufacturing a semiconductor mounting board includes providing a base member and linear conductive members formed of metallic wires. The conductive members are constructed so that they extend linearly between a semiconductor element-mounting face and a circuit board-mounting face of a base member, and are integrally molded within the base member. For this purpose, a resin material for forming the base member is injected into a mold wherein the conductive members are linearly arranged beforehand.

Method of manufacturing a semiconductor element-mounting board

An optical disk molding apparatus and method are provided which prevent data formed on a molded object from being damaged and prevent quality deterioration of the molded object. There are provided a mold moving device, a first gas supply device, and a controller, whereby a first release space part is formed by opening molds from a mold clamp state by a movement distance not damaging a data transferred face of the optical disk, and a gas is supplied to the first release space part at a point in time when the first release space part is formed, thereby totally separating the optical disk and a stamper from each other. No damage is caused to a data transferred face at the point in time when the first release space part is formed. Since separation between the optical disk and the stamper is performed via pressure of the gas after the first release space part is formed, data is prevented from being damaged over the data transferred face of the optical disk in its entirety.

Optical disk molding apparatus and method

Process and apparatus of producing optical disk and process of producing substrate

Growing community of inventors

Osaka, Japan

Takaaki Higashida