Tdk Corporation

Takaaki Domon

Koji Shimazawa

Kosuke Tanaka

Makoto Yoshida

Kenichi Yoshida

Takashi Ota

Tohru Inoue

Katsunori Osanai

Yutaka Sato

Tsutomu Yasui

Toshiaki Kikuchi

Ryoichi Kondo

Yoshio Kaita

Hirotada Furukawa

Toshiyuki Nagatsuka

A high-frequency transmission line in which the alternating-current resistance is low is provided. A high-frequency transmission lineis a high-frequency transmission lineto transmit an alternating-current electric signal, and contains metal and carbon nanotube, and the carbon nanotube is unevenly distributed at a peripheral partof a cross-section that is of the high-frequency transmission lineand that is perpendicular to a transmission direction of the alternating-current electric signal.

High-frequency transmission line, antenna and electronic circuit board

A high-frequency transmission line in which the alternating-current resistance is low and that is hard to disconnect is provided. A high-frequency transmission lineis a high-frequency transmission lineto transmit an alternating-current electric signal, and contains metal and carbon nanotube, and the carbon nanotube is unevenly distributed at a central partof a cross-section that is of the high-frequency transmission lineand that is perpendicular to a transmission direction of the alternating-current electric signal.

An electronic component module is configured by a passive component mounted on a built-in IC substrate. The passive component is provided with a passive element inductor, and a mounting surface for mounting on a substrate. Concavities are respectively provided at parts of two opposed borders in the mounting surface, and a terminal electrode is provided at the bottom part of the concavities. Since the passive component has a concavity within the mounting surface and the terminal electrode is incorporated within this concavity, the passive component can be mounted low on the substrate surface. Since the terminal electrode is incorporated in the concavity, solder is prevented from spreading fillet-like at the periphery of the inductor, thus increasing the mounting density of the passive component. There is increased freedom for mounting the passive component because the passive component is mounted on the built-in IC substrate in which the IC is embedded in the substrate.

Passive component and electronic component module

A thermally assisted magnetic head has a slider having a medium-facing surface, and a light source unit having a light source support substrate, and a light source disposed on the light source support substrate; the slider has a slider substrate and a magnetic head portion disposed on a side surface of the slider substrate; the magnetic head portion has a magnetic recording element for generating a magnetic field, first and second waveguides, for receiving light through an end face and guiding the light to the medium-facing surface, and a near-field light generator disposed on an end face; the light source support substrate is fixed to a surface of the slider substrate so that light emitted from the light source can enter the end face of the first waveguide.

Thermally assisted magnetic head

A thermally assisted magnetic head has a slider substrate having a first surface located on the opposite side to a medium-facing surface, and side surfaces located between the medium-facing surface and the first surface; a magnetic head portion having a waveguide having a light exit face on the medium-facing surface side, and a magnetic recording element disposed in proximity to the light exit face, the magnetic head portion being fixed to one of the side surfaces of the slider substrate; a light source support substrate having a second surface facing the first surface; a light emitting element facing a light entrance face of the waveguide and fixed to the light source support substrate; and an adhesive interposed between the first surface and the second surface; at least one of the first surface and the second surface has a recess and the adhesive is disposed in the recess.

Thermally assisted magnetic head, head gimbal assembly, and hard disk drive

A laser diode is fixed to a light source support substrate and a first surface of a slider substrate is fixed to a second surface of the light source support substrate; therefore, the slider substrate and the laser diode are kept in a fixed positional relation. Since the laser diode faces a light entrance face of a core, long-distance propagation of light as in the conventional technology does not occur, and light emitted from a light emitting element is guided well to a medium-facing surface while permitting some mounting error and coupling loss of light. A spot size w of a light intensity distribution along the X-axis in the XY plane including an incident-light centroid position on the light entrance face is set larger than a thickness of the core, whereby variation in incidence efficiency is well suppressed against positional deviation.

A thermally assisted magnetic head has a slider having a medium-facing surface, and a light source unit having a light source support substrate, and a light source disposed on the light source support substrate. The slider has a slider substrate and a magnetic head portion disposed on a side of the medium-facing surface in the slider substrate; the magnetic head portion includes a magnetic recording element for generating a magnetic field, and a waveguide for receiving light through an end face opposite to the medium-facing surface, and guiding the light to the medium-facing surface; the light source support substrate is fixed to a surface opposite to the medium-facing surface in the slider substrate so that light emitted from the light source can enter the end face of the waveguide.

A circuit device includes at least one under bump metal formed on a surface of a substrate and a connection bump provided on the uppermost layer of the under bump metal. At least one laminated metallic film is formed on part of or all of wiring pattern formed on the surface of the substrate, so that the laminated metallic film formed consists of the same material and has the same thickness as the under bump metal.

Growing community of inventors

Tokyo, Japan

Takaaki Domon