Hewlett-packard Company

Agilent Technologies, Inc.

Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies Fiber IP (singapore) Pte. Ltd

Avago Technologies International Sales Pte. Limited

Tak Kui Wang

Chung-Yi Su

James W Baker

James A Matthews

Phillip W Barth

Annette Claire Grot

Robert E Wilson

Ye Chen

Terry A Berger

Brenton Arthur Baugh

Kendra J Gallup

Edwin E Wikfors

James Howard Williams

Frank David Yashar

Ramana M V Murty

Stephen M Craig

Frank Z-y Hu

Storrs Townsend Hoen

Christopher L Coleman

Robert C Henderson

Richard P White

Paul B Welsh

Laura M Giovane

Clayton E Law

Ronnie Paul Varghese

Peisheng Sheng

Michel G Goedert

Nick Jordache

Chi K Lo

Rodney L Alley

A vertical-cavity surface-emitting laser (VCSEL) device includes a first distributed Bragg reflector (DBR) structure of a first conductivity type, and a second DBR structure of a second conductivity type. The second conductivity type is different than the first conductivity type. The VCSEL includes a cavity positioned between the first DBR structure and the second DBR structure. The cavity includes at least one quantum well structure to generate light. The VCSEL includes a first thermal buffer layer positioned between the cavity and the first DBR structure, and a second thermal buffer positioned between the cavity and the second DBR structure.

Optical device and system having thermal buffers

Optical devices and systems are depicted and described herein. One example of the optical system is disclosed to include a semiconductor layer, a first metal strip positioned adjacent to a first surface of the semiconductor layer, a second metal strip positioned adjacent to a second surface of the semiconductor layer that opposes the first surface of the semiconductor layer, and a third metal strip positioned adjacent to the second surface of the semiconductor layer. In one example, the first metal strip includes a first aperture positioned adjacent to a first active region in the semiconductor layer and second aperture positioned adjacent to a second active region in the semiconductor layer. The second metal strip overlaps the first metal strip in proximity with the first active region and not the second active region and the third metal strip is oriented substantially parallel with the second metal strip.

Optical device and system having an array of addressable apertures

A passive alignment system is provided that comprises one or more first meltable elements disposed on a surface, one or more second meltable elements disposed on a surface and one or more first standoff devices. The first and second meltable elements transition from first and second pre-molten states, respectively, to first and second molten states, respectively, when subjected to first and second temperatures, respectively. In the first molten state, the first meltable elements control relative alignment between the surfaces in first and second dimensions. In the second molten state, the second meltable elements and the first standoff devices control relative alignment between the surfaces in a third dimension. The passive alignment system is suitable for use in a parallel optical communications module to precisely passively align ends of a plurality of optical fibers or waveguides with respective light sources or light detectors of the module.

Passive alignment system and an optical communications module that incorporates the passive alignment system

An optical chip-scale package (CSP) is provided for use in a high channel density, high data rate communications system that has optical I/O ports and that is capable of being housed in a standard rackmount-sized box. The optical I/O ports comprise a bulkhead of multi-optical fiber (MF) adapters installed in a front panel of a switch box that houses the communications system. The adapters have first and second receptacles that are adapted to mate with first and second MF connectors, respectively. The communications system comprises a single-harness optical subassembly that uses a plurality of the optical CSPs that interface with a switch IC chip of the communications system to perform electrical-to-optical and optical-to-electrical conversion.

Optical chip-scale package for use in a high channel density, high data rate data communications system having optical input/output (I/O) ports

A wavelength division multiplexing and demultiplexing (WDM) assembly is provided that is also capable of performing bidirectional communications. The WDM assembly comprises a WDM module and an adapter for use with the WDM module. The adapter has first and second receptacles in front and back ends thereof, respectively, that are configured to mate with a multi-fiber (MF) connector and with the WDM module, respectively. The MF connector holds ends of M optical fibers and the WDM module has M lenses. The WDM module holds ends of N optical fibers, where N is equal to or greater than 2M. When the MF connector and the WDM module are mated with the first and second receptacles, respectively, the ends of the M optical fibers held in the MF connector are in optical alignment with M lenses, respectively, disposed in the WDM module.

Multi-channel optical wavelength division multiplexing/demultiplexing (WDM) assembly and methods

A constructed photodetector, an optical receiver, and a receiver unit in an optical communication system are disclosed. One example of the disclosed constructed photodetector includes an optoelectronic element having an active area that converts light having a wavelength of interest into electrical signals and a substrate on a face that opposes the active area, where the substrate is non-transparent to light having the wavelength of interest. The constructed photodetector further includes a lens-chip that is at least partially transparent to light having the wavelength of interest, where the lens-chip includes a first side and an opposing second side, where the first side of the lens-chip includes an integrated lens, and where the second side of the lens-chip includes one or more electrical traces. The constructed photodetector further includes at least one connector that provides a physical and electrical connection between the optoelectronic element and the lens-chip.

Optical receiver using a photodetector with a self-aligned lens

An optical communications system and a pluggable optical communications module for use in the system are provided. The configuration of the pluggable optical communications module is such that no optical turn in any light path is required. Embodiments of the optical communications module include an EMI shielding solution and an electrical interface for electrically interfacing an electrical subassembly (ESA) of the module with a system printed circuit board (PCB) in a way that obviates the need for an optical turn.

Pluggable optical communications module and system with aligned ESA axis

A wafer-to-wafer bonded arrangement is provided comprising a VCSEL wafer and a highly thermally-conductive (HTC) wafer that are bonded together with the front side of the VCSEL wafer bonded to the HTC wafer. The VCSEL wafer is fabricated to include, at least initially, a native substrate. The HTC wafer includes a thermally-conductive, non-native substrate. All or a portion of the native substrate may be removed after performing wafer-to-wafer bonding. In effect, the HTC wafer becomes the substrate of the bonded pair. During operation of VCSEL dies diced from the bonded wafer, heat generated by the dies flows into the non-native substrate where the heat spreads out and is dissipated. Laser light generated by the VCSEL die is emitted through the back side of the VCSEL die.

Back-side-emitting vertical cavity surface emitting laser (VCSEL) wafer bonded to a heat-dissipation wafer, devices and methods

An optical mask can be made by providing a transparent mask substrate; depositing a first layer of opaque material, forming an aperture in the first layer; depositing a second layer of transparent material, depositing a third layer of transparent material; patterning the third layer to produce a disc-shaped region, heating the third layer until the disc-shaped region reflows into a lens-shaped region and cross-links, depositing a fourth layer, patterning the fourth layer to produce a cavity extending to the surface of the lens-shaped region, and dry etching the end of the cavity until the second layer develops a shape corresponding to the lens-shaped region.

Device and method for making photomask assembly and photodetector device having light-collecting optical microstructure

Known semiconductor wafer process technologies are used to manufacture an optical MUX/DeMUX with very precise dimensional control. The manufacturing process eliminates the need to polish optical surfaces of the MUX/DeMUX, which reduces the overall manufacturing costs and the amount of time that is required to manufacture the MUX/DeMUX.

Optical multiplexer and demultiplexer and a method for fabricating and assembling the multiplexer/demultiplexer

A plurality of flip-chips, each having a plurality of optoelectronic elements formed therein, are flip-chip mounted on a top surface of a substrate that is comprised of a material that is transparent to the operating wavelength of the light produced by optoelectronic elements of the flip-chips. The combination of flip-chips comprises an array of precisely-aligned optoelectronic elements. When the substrate comprising the array of optoelectronic elements is mounted on a PCB, electrical contact pads disposed on the bottom and/or top surface of the substrate are in contact with the respective electrical contact pads disposed on the top surface of the PCB to electrically interconnect the PCB with the flip-chips. Mating features on the substrate that have been precisely positioned by semiconductor fabrication steps are disposed for mating with respective mating features of a multi-optical fiber ferrule device that have been precisely formed in the ferrule device at precise locations.

Flip-chip assembly comprising an array of vertical cavity surface emitting lasers (VCSELSs), and an optical transmitter assembly that incorporates the flip-chip assembly

An opto-electronic system includes a system substrate, a lens, a bridging device, and an opto-electronic chip mounted in a cavity in the system substrate. The bridging device, which can be another chip, a lens block, or an interposer, is mounted in flip-chip orientation to the opto-electronic chip and provides electrical interconnection with signal conductors of the system substrate.

Opto-electronic system having flip-chip substrate mounting

In a method of forming a device so as to include a reflective surface at a specific angle to an incident optical axis, a region of a first major surface of a substrate is exposed to an anisotropic etchant to form a surface having the specific angle with respect to the first major surface, but the etched surface is then used as a mounting surface. That is, rather than anisotropically etching a reflective surface, the etching provides the mounting surface and the second major surface of the substrate functions as the reflective surface when the fabricated device is properly mounted. The substrate may be a &#x3c;100&#x3e; silicon wafer having a 9.74 degree off-axis cut. Then, a 45 degree mirror is formed by the process. When the reflector is used in an optical device, the &#x3c;111&#x3e; crystalline plane will be generally parallel to the surface of the support.

Method of forming and mounting an angled reflector

An optical package includes a sub-mount, an edge-emitting laser mounted on the sub-mount, a collimating ball lens mounted on the sub-mount adjacent to the edge-emitting laser, a mirror mounted on the sub-mount adjacent to the collimating ball lens. The sub-mount is made of a bottom wafer. A lid is bonded to the sub-mount to form the laser package. The lid is made of a middle wafer bonded to a top wafer. The middle wafer defines an opening that accommodates the edge-emitting laser, the collimating ball lens, and the mirror. The opening is defined by vertical sidewalls. The top wafer further includes a lens above the mirror.

Silicon optical package with 45 degree turning mirror

A wafer-level device fabrication process forms standing structures around emitting areas of multiple VCSELs. The standing structures can be shaped to hold ball lenses or other optical elements for respective VCSELs or can include platforms on which optical elements are formed. Ball lenses that are attached to the standing structures either during chip-level or wafer-level processes fit into the standing structures and are automatically aligned. Wafer level fabrication of optical elements can align the optical elements with accuracies associated with photolithographic processes. The optical elements can be formed using a molding or replication process, a printing method, or surface tension during a reflow of lithographically formed regions.

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Saratoga, CA, United States of America

Tak Kui Wang