Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies Fiber IP (singapore) Pte. Ltd

Tak Kai Wang

Chung-Yi Su

Bing Shao

Ronald T Kaneshiro

Ye Chen

Christopher L Coleman

Craig T Cummings

Storrs Townsend Hoen

Laurence Ray McColloch

Frank David Yashar

Farid Matta

Jesse Chin

A known flip-chip assembly manufacturing process is augmented by process steps of the invention to create a VCSEL flip-chip assembly comprising a plurality of semiconductor devices having respective arrays of a small number of VCSELs thereon, which are mounted on a substrate to form a large array of VCSELs that are precisely optically aligned with their respective optical coupling elements.

Flip-chip assembly comprising an array of vertical cavity surface emitting lasers (VCSELs)

A connector assembly is provided that has optical communications capabilities and high data rate electrical communications capabilities and that is backwards compatible with one or more USB standards. A socket of the connector assembly has high data rate electrical connections and USB electrical connections such that it is capable of supporting high data rate signaling protocols for high data rate devices as well as USB signaling protocols. A plug of the connector assembly has high data rate electrical connections, USB electrical connections, and an optical-to-electrical (OE)/electrical-to-optical (EO) conversion module. The socket can be mated with the plug of the invention and with USB plugs that are compliant with existing USB plugs. Thus, both the socket and the plug have backwards compatibility with one or more existing USB standards.

Connector assembly that has optical and high data rate electrical capabilities and that is backwards compatible with earlier universal serial bus (USB) standards

An optics system module for use in an optical communications module is provided that can be more easily aligned with the module during the mounting process, that reduces the possibility of the fiber ends being damaged when they are connected to the respective optical ports of the optics system, and that eliminates or reduces the occurrence of Fresnel losses at the interfaces between the fiber end faces and the optical ports. The optical ports have non-round shapes that are symmetrical to the shapes of the fibers in the transverse direction, i.e., in the direction that is transverse to the optical axes of the fibers. The non-round, symmetrical shape of the optical ports reduces the amount of force that the optical ports exert on the respective optical fibers.

Optics system module for use in an optical communications module, an optical communications system, and a method

An adapter is provided that has both an electrical coupling configuration that complies with the RJ-45 wiring standard for electrical communications and an optical coupling configuration for optical communications. The adapter is configured as an interface for at least two modular connector assemblies to enable the modular connector assemblies to communicate with each other either optically or electrically, depending on whether the plugs of the assemblies are configured to have optical or electrical communications capabilities.

Adapter configured with both optical and electrical connections for providing both optical and electrical communications capabilities

A modular connector assembly is provided that has both an electrical coupling configuration that complies with the RJ-45 wiring standard and an optical coupling configuration that provides the assembly with optical communications capabilities. In addition, the modular connector assembly is configured to have backwards compatibility with existing 8P8C jacks and plugs that implement the RJ-45 wiring standard. Consequently, the modular connector assembly may be used to communicate optical data signals at higher data rates (e.g., 10 Gb/s and higher) or to communicate electrical data signals at lower data rates (e.g., 1 Gb/s).

Modular plug and jack connector assembly

A thin hybrid plug, a thin hybrid receptacle that mates with the thin hybrid plug, and a thin hybrid connector assembly comprising the thin hybrid receptacle mated with the thin hybrid plug are provided. A method for configuring a thin hybrid plug so that an optical surface of the plug is disposed for easy cleaning is also provided. An optics system of the hybrid plug has an optical surface that is substantially flush with an end face of a molded plug body of the hybrid plug to allow the optical surface to be easily wiped clean. In addition, the electrical contacts system and the optics system of the hybrid plug are arranged to enable the optical surface of the optics system to be easily wiped with a cleaning device, such as a cotton-tipped swab, for example. An optics system of the hybrid receptacle has an optical surface that is also disposed to be easily wiped with a cleaning device, such as a cotton-tipped swab, for example.

Thin connector assembly that has optical and electrical capabilities and that includes a plug having an optical surface that can be easily wiped clean

In a connector system, a first connector is mechanically and optically mateable with a second connector to form one or more optical signal communication links. A wiping cleaner is included on at least one of the first and second connectors for cleaning an optical port of the other of the first and second connectors when the connectors are plugged together. The first and second connectors can further be electrically mateable to provide both optical and electrical signal communication links.

Connector system having electrical and optical links with optical link cleaner

Modular connector assembly configured with both optical and electrical connections for providing both optical and electrical communications capabilities, and a system that incorporates the assembly

A hybrid RJ-45 plug is provided that has both an electrical coupling configuration and an optical coupling configuration. The electrical coupling configuration is an 8P8C electrical wiring configuration that complies with the RJ-45 electrical wiring standard. The optical coupling configuration includes an optics system that provides the plug with optical communications capabilities. The hybrid RJ-45 plug is backwards compatible with an existing RJ-45 jack that implements an RJ-45 electrical wiring standard. However, the hybrid RJ-45 plug is also configured to mate with an optical jack that has only optical communications capabilities and to mate with a hybrid RJ-45 jack that has both optical and electrical communications capabilities.

Hybrid 8P8C RJ-45 modular plug configured with both optical and electrical connections for providing both optical and electrical communications capabilities, and a method

An opto-electronic module connector system is mountable on a system substrate, such as a printed circuit board, in a variety of configurations or orientations and includes an electromagnetic interference (EMI)-shielding enclosure, a connector assembly, and a socket. The connector assembly includes a connector body, a connector printed circuit board, a substantially planar contact holder, electrical contact fingers mounted on the contact holder, and an opto-electronic module. When the EMI-shielding enclosure and socket are mounted on the system substrate, a user can readily insert the connector assembly into the EMI-shielding enclosure and plug it into the socket. A user can likewise readily remove the connector assembly from the EMI-shielding enclosure and socket for maintenance, cleaning, repair or other purposes.

Modular connector system having electrical and optical links

A USB connector is provided that has an OE module and high-speed electrical connections integrated therein. The OE module includes an optical module, at least one laser diode, at least one photodiode, an optical transceiver IC, and a PCB. The optical module, the laser diode, the photodiode, and the IC are mounted on a surface of the PCB. The OE module is secured within the USB connector. The PCB includes conductive traces and electrical contact pads. The conductive traces electrically connect the IC with the contact pads. The contact pads are electrically connected via through holes formed in the PCB to the high-speed electrical connections, which, in turn, are electrically connected to conductive traces of a motherboard or a computer.

Universal serial bus (USB) connector having an optical-to-electical/electrical-to-optical conversion module (OE module) and high-speed electrical connections integrated therein

A reflector for use in an optical transceiver module and methods for making and using the reflector are provided. The methods for making the reflector reduce the amount of processing and handling of the wafer that are required, thereby reducing manufacturing costs and increasing yield. The reflector may have a diffraction-inducing structure formed thereon such that light received from the light source is redirected in a plurality of directions, including toward a lens that couples light into an end of a transmit fiber and in at least one other direction for being sensed by a detector that converts the detected light into electrical energy.

Optical transceiver module having a front facet reflector and methods for making and using a front facet reflector

In an optical transceiver module, the bottom surface of the lid is temporarily attached to the top surface of the submount assembly in a pre-alignment position prior to performing the solder flowing process in order to prevent the lid from shifting position during the solder flowing process. The solder flowing process is then performed to melt the solder. When the solder melts, the surface tension of the melted solder pulls the lid into its ultimate, or permanent, aligned position. The solder is then cooled, causing it to harden, thereby securing the lid to the submount assembly in its ultimate, permanently aligned position. The hardened solder between the top surface of the submount assembly and the bottom surface of the lid forms a hermetic seal that encloses components on the transmit side of the transceiver module in a hermetically-sealed environment.

Methods and apparatuses for providing a hermetic sealing system for an optical transceiver module

Disclosed are various embodiments of systems, devices and methods for forming an hermetic seal between a lid and a submount for an electronics module or package. At least one thieving pad is connected to a metallized ring formed about or near the circumference of an upper surface of the submount. A corresponding metallized ring is disposed about the lower perimeter of the lid. Solder paste is placed between the two metallized rings and melted, preferably under a reducing atmosphere. Excess molten solder controllably flows towards the at least one thieving pattern while the lid is being hermetically sealed and soldered, avoiding the formation of undesired wayward solder balls inside the package.

Growing community of inventors

Saratoga, CA, United States of America

Tak Kai Wang