Samsung Electronics Co., Ltd.

Tak-hyung Lee

Byung-hoon Ko

Kun-soo Shin

Youn-ho Kim

Jong-pal Kim

A bioelectric signal measurement apparatus includes a first interface configured to detect a bioelectric signal of a testee through electrical interfacing with a skin of the testee; a second interface configured to detect a signal different from the bioelectric signal through electrical interfacing with the skin, the second interface electrically interfacing with the skin in a state that is different from a state in which the first interface electrically interfaces with the skin; and a signal processor configured to remove, from the detected bioelectric signal, a motion artifact between the first interface and the skin using the detected signal different from the bioelectric signal.

Apparatus and method for measuring bioelectric signals

A biosignal measuring apparatus and a method of measuring a biosignal is provided. A biosignal measuring apparatus includes a first interfacing unit including two or more first interfaces configured to detect first signals from a subject, a second interfacing unit including two or more second interfaces and a connecting unit, the second interfaces being configured to detect noise from the subject, the connecting unit being configured to connect the second interfaces, and a biosignal extracting unit configured to extract a biosignal of the subject from the first signals by using signals output from the second interfacing unit.

Biosignal measuring apparatus and method of measuring biosignal

An electrode for measuring a bio potential includes a conductive adhesive having one side configured to have at least two metal electrodes attached thereto while the electrode is being used, and another side configured to be attached to a living body while the electrode is being used, the conductive adhesive having a predetermined area and a predetermined thickness; and a supporting element configured to support the conductive adhesive while the conductive adhesive is attached to the living body; wherein an impedance is formed between the at least two metal electrodes while the at least two metal electrodes are attached to the side of the conductive adhesive, the impedance depending on a thickness of the conductive adhesive and having a value that prevents the at least two metal electrodes from being shorted together.

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Seoul, South Korea

Tak-hyung Lee