Idemitsu Petrochemical Co., Ltd.

Taizou Sugioka

Shinobu Yamao

Masami Mihara

Shinichi Miura

Masahiro Nakamichi

Provided is a syndiotactic polystyrenic resin composition, of which the resin moiety comprises any of (A) a syndiotactic styrenic polymer (B) a rubber-like elastomer having affinity for the component (A), (E) a polymer having compatibility with or affinity for the component (A) and having a polar group, (F) a thermoplastic resin except (A), and (G) a polyolefin having MI of at most 25, and which contains from 10 to 350 parts by weight, relative to 100 parts by weight of the resin moiety, of (C) a fibrous filler, and from 10 to 350 parts by weight, relative to the same, of (D) a tabular filler having a mean grain size of from 4 to 700 &mgr;m and a mean aspect ratio of from 12 to 120. Moldings of the composition have good impact resistance and warp little, still having good heat resistance and other good properties intrinsic to styrenic resins.

Styrenic resin composition and semiconductor carrier device

There are provided a prepreg for a printed circuit board which comprises a glass cloth impregnated with a flame retardative resin composition comprising a (A) resin composed of a (a) styrenic polymer having syndiotactic configuration, a (b) polymer having compatibility with or affinity for the component (a) and further containing polar group, and a (c) thermoplastic resin other than the components (a) and (b) and/or a rubbery elastomer; a (B) halogenated polystyrene in which the amount of halogen atoms contained in halogen compounds generated under specific conditions is at most 1000 ppm by weight; a (C) flame retardant aid; an (D) organic filler or inorganic filler; and the above glass cloth, and also a substrate for printed circuit which comprises the prepreg or a laminate comprising a plurality of the prepregs laminated on each other, at least one side of the prepreg or laminate being laminated with a metallic layer. The above substrate is greatly improved in resistance to electrolytic corrosion and imparted with high reliability, and thus can cope with high density commercial devices.

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Ichihara, Japan

Taizou Sugioka