Kabushiki Kaisha Toshiba

Toshiba Energy Systems & Solutions Corporation

Taizo Tomioka

Kazuo Shimokawa

Tomohiro Iguchi

Kazuhito Higuchi

Tatsuya Yamada

Yusaku Asano

Yoshiki Endo

Osamu Usuda

Masahiro Urase

Toshihisa Inoue

Kazuhiko Kurahashi

Takahiro Suzuki

Kenji Ito

Takashi Ito

Yasuhito Saito

Ikuo Mori

Masayuki Arakawa

Yukihiro Ikeya

Takahiro Aizawa

Kentaro Suga

Mutsumi Suematsu

Yukinori Aoki

Hiroyuki Tokubo

A method for joining dissimilar metals according to the embodiment is a method for butt-joining, using frictional heat, a first member having a plate shape and containing first metal and a second member having a plate shape and containing second metal having a melting point higher than that of the first metal. The method for joining dissimilar metals includes: overlapping an end portion of the second member on an end portion of the first member; and pressurizing the second member toward the first member by bringing a rotating joining tool having a protruding portion at a tip end into contact with an overlapping portion of the second member with the first member. When the second member is pressurized toward the first member, the tip end of the rotating joining tool is not in contact with the first member.

Method for joining dissimilar metals, joined body, and joining apparatus

A stator winding includes: a plurality of stator bars and a connection structure. Each of the stator bars penetrates each of the stator slots and includes at least one hollow element wire, wherein inside the at least one hollow element wire a flow hole for a cooling medium is formed. A connection structure includes: a sleeve whose axial one end is fitted to a vicinity of an end of the stator bar; a closing plate disposed at another end of the sleeve; and a hollow extension pipe. The hollow extension pipe is disposed in a space defined by the sleeve and the closing plate at the end of the stator bar, and makes the flow hole of the hollow element wire and an outside of the space communicate each other. A brazing material is filled in the space.

Stator winding, generator, and connection method of stator winding conductor

The abutment portion touches with a shoulder surface of a joining tool for friction stir welding. The tip portion is freely movable in a first direction connecting a surface of the workpiece and the shoulder surface in a state of contacting the surface of the workpiece. The detector is configured to detect a position of the tip portion in the first direction. The output unit is configured to output a data of the position of the tip portion in the first direction detected by the detector. The controller is configured to calculate a position of the tip portion to the abutment portion from the data of the position output from the output unit, and to calculate a distance between the shoulder surface of the joining tool and the surface of the workpiece.

Distance measuring device, friction stir welding apparatus, and friction stir welding method

A friction stir welding equipment according to an embodiment includes a spindle unit, a holder, and a moving part; the spindle unit is capable of rotating a tool; the holder is connectable to the tool via a radial bearing and is capable of holding at least one of a side surface of a processing member or a rim of an upper surface of the processing member; and the moving part is capable of changing relative positions of the tool and the holder with respect to the processing member.

Friction stir welding equipment

A friction stir welding method includes joining a first metal member, a second metal member, and a third metal member by pressing a tool onto a joining member while rotating the tool. The tool has a protrusion at a tip of the tool. The joining member includes the first metal member, the second metal member, and the third metal member. A major element of the second metal member is the same as a major element included in the first metal member. The third metal member is sandwiched between at least a portion of the first metal member and at least a portion of the second metal member. A major element of the third metal member is the same as the major element included in the first metal member and the second metal member. A crystal grain size of the third metal member is 20 &#x3bc;m or less.

Friction stir welding method and joined body

A method of manufacturing a semiconductor chip according to an embodiment includes forming on a semiconductor substrate a plurality of etching masks each including a protection film to demarcate a plurality of first regions of the substrate protected by the plurality of etching masks and a second region as an exposed region of the substrate, and anisotropically removing the second region by a chemical etching process to form a plurality of grooves each including a side wall at least partially located in the same plane as an end face of the etching mask and a bottom portion reaching a back surface of the substrate, thereby singulating the semiconductor substrate into a plurality of chip main bodies corresponding to the plurality of first regions.

Method of manufacturing semiconductor chip, semiconductor chip, and semiconductor device

The present invention provides a battery including a container, an electrode group including a positive electrode and a negative electrode, multiple current collecting tabs being extended from any one of the positive electrode and the negative electrode of the electrode group, and overlapped with one another; a lead bonded to at least one of the current collecting tabs by ultrasonic bonding, a lid configured to close an opening portion of the container, and an external terminal provided on the lid and connected to the at least one current collecting tab via the lead, in which the lead has a cross-sectional area that is increased in a middle of extension of the lead from an ultrasonic-bonded portion to the at least one of the current collecting tabs to the external terminal.

Battery and ultrasonic bonding method for battery

A luminescent device including a die pad lead composed of an inner lead and an outer lead, a case for uniting the inner lead, a light emitting diode chip mounted on a first predetermined position of one main surface of the inner lead, and a transparent sealing material portion for sealing the light emitting diode chip and a part of the one main surface. The case seals the inner lead other than an area sealed by the transparent sealing material portion, and the inner lead of the die pad lead has bending portions at least two places including a first bending portion and a second bending portion. A rear of the first predetermined position in the inner lead of the die pad lead is exposed outside the case, and the second bending portion is formed in the case so that the outer lead extends from a side of the case.

Luminescent device and method for manufacturing the same

An optical semiconductor device includes: a base substrate which has a concave portion; a light-emitting element which is provided in the concave portion, and which emits light; a prevention member which is provided to the base substrate in a manner of covering a side surface of the concave portion, and which prevents the light emitted by the light-emitting element from being incident on the side surface of the concave portion; and a translucent member which is provided in the concave portion, and which seals the light-emitting element.

Optical semiconductor device and method for manufacturing optical semiconductor device

A semiconductor device comprises a plurality of semiconductor chips each having a surface bonded to a wiring board and being electrically connected thereto, a plurality of metal plates each having a one-end portion bonded to the other surface of each of the plurality of semiconductor chips and having an other-end portion bonded to the wiring board to make electric connection therebetween, thermoplastic resin which seals the metal plates integrally as one body, such that a surface opposing the surface bonded to the semiconductor chip, of each of the metal plates, is exposed to outside, and thermosetting resin which seals an outer peripheral portion of the thermoplastic resin, and the semiconductor chips.

Semiconductor apparatus and method of manufacturing the same

According to a method of manufacturing a semiconductor wafer and a semiconductor device, a rear surface of the semiconductor wafer is ground, and is dry- or wet-etched so that rear surfaces of semiconductor chips on the segmented semiconductor wafer have substantially equal surface roughness. The semiconductor chips are bonded onto a lead frame via bumps using thermo-compression and ultrasonic vibrations.

Method of manufacturing semiconductor wafer and method of manufacturing semiconductor device

Three chips, i.e., an LED, photovoltaic IC, and MOS-FET, are mounted on a silicon substrate having two projections arranged substantially parallel to each other. Each projection has a side surface formed by an inclined surface including a curve having an inflection point. The LED is mounted on an LED mounting electrode formed between the two projections, and connected, by a gold wire, to an LED connecting electrode formed between the projections. The photovoltaic IC is placed on the front-side surfaces of the projections so as to oppose the LED, and connected via gold bumps.

Growing community of inventors

Yokohama, Japan

Taizo Tomioka