Fuji Electric Co., Ltd.

Taizo Asano

Masashi Akahane

A semiconductor module with temperature characteristics adjustable through a measurement device. The semiconductor module includes a mounting board having a semiconductor chip and an integrated circuit mounted thereon. The semiconductor chip includes a switching device and a diode for temperature detection, a forward voltage of the diode being measurable by the measurement device. The integrated circuit includes a correction circuit that generates a corrected reference voltage, and a control circuit that receives the corrected reference voltage and a drive signal, and controls the switching device based on the corrected reference voltage and the drive signal. The mounting board includes a pad to be coupled to the diode with a wire. The pad has an area larger than a sum of a first area to be coupled to the wire and a second area to be in contact with the probe of the measurement device for measuring the forward voltage.

Semiconductor module and method of manufacturing semiconductor module

An integrated circuit, including: a first current source; a second current source provided in parallel to the first current source; a first resistor with one end coupled to an output of the first current source; a first bipolar transistor that is diode-connected and is coupled to the other end of the first resistor; a second bipolar transistor that is diode-connected and is coupled to an output of the second current source; a second resistor coupled to the second bipolar transistor; and an output circuit configured to output a voltage based on a first voltage outputted from the first current source and a second voltage outputted from the second current source.

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Matsumoto, Japan

Taizo Asano