Fujitsu Corporation

Taizan Kobayashi

Yukio Ozaki

Toshinori Kasuga

Eiji Takada

Kazuyuki Ikura

Jun Matsueda

Katsuki Shirai

Yasuyuki Masuda

Kouji Uesaka

Masanori Fukushi

Tohru Harada

Makoto Kuboyama

Hirofumi Ohsawa

Reizo Nakamura

An information processing apparatus includes: a memory configured to store data generated in a manufacturing line where a product is manufactured in a state in which the data is linked to information in a tree structure in which elements related to manufacture of the product assigned as nodes; and a processor configured to: determine, when data of a prototype is stored to the memory, whether information of an element out of the elements corresponding to an uppermost node out of the nodes is linked to the data of the prototype; link, when the information of the element corresponding to the uppermost node is not linked, as the information of the element corresponding to the uppermost node of the data of the prototype, information distinguishable from information of the element corresponding to the uppermost node linked to the data of the product; and store the data of the prototype.

Information processing apparatus, information processing method, and recording medium recording information processing program

An optical rotary encoder includes a light source, a rotation body including a reflecting diffraction grating, a light receiving unit including a plurality of light receiving elements, a synthetic unit that combines output signals output from the plurality of light receiving elements to obtain a signal, which represents a fringe pattern component at a certain cycle, included in a light reflected by the reflecting diffraction grating and, and a detection unit that detects a direction based on a first signal and a second signal, the direction being a direction in which a distance between the rotation body and the light receiving unit varies, the first signal and the second signal being obtained by the synthetic unit, the first signal indicating a fringe pattern component having a cycle shorter than the certain cycle, the second signal indicating a fringe pattern component having a cycle longer than the certain cycle.

Optical rotary encoder with correction method reducing variation of a distance between a rotation body and a light receiving unit

A method is provided for detecting an orientation of an optical fiber including a flat surface as a part of a surface of the maintaining member. The method includes directing collimated light to the optical fiber through the flat surface of the maintaining member, receiving reflected light of the collimated light by using an optical sensor device, generating a brightness distribution image according to an output signal from the optical sensor device, identifying a reference point on a brightness distribution line appearing on the generated brightness distribution image, according to a position of the brightness distribution line in relation to a target orientation for the optical fiber, the brightness distribution line detectable on the brightness distribution image in correspondence to the reflected light received by the optical sensor device, and detecting the orientation of the optical fiber according to a coordinate of the reference point on the brightness distribution image.

Optical fiber orientation detection method and apparatus

A displacement measurement device includes a plurality of light receiving elements each of which outputs a signal corresponding to illuminance of interference fringe, the elements being arranged in a range of two periods of the interference fringe and arranged with an interval based on the period of the interference fringe in a movement direction of the interference fringe, a differential processing unit configured to perform differential processing on predetermined combinations of the signals output from the elements to generate four signals, a phase calculation unit configured to calculate a phase of the interference fringe on the basis of the signals output from the elements; and an output signal selection unit configured to select two signals from among the four signals on the basis of the phase of the interference fringe and select a signal of which absolute value is larger from among the two selected signals.

Displacement measurement device, displacement measurement method, and displacement measurement program

An ultrasonic bonding apparatus includes an ultrasonic bonding unit, and a wiping unit configured to wipe out pre-cured underfill that has adhered to a tool surface of a head, by using a wiping member. The ultrasonic bonding unit includes a first driver configured to drive the head to press an electronic component upon a substrate, and an ultrasonic generator. The wiping unit includes a wiping table used to wipe out the tool surface, a feed mechanism configured to supply a wiping member to the wiping table and to roll up the wiping member, a cartridge configured to house the wiping table and the feed mechanism, and a second driver configured to drive the cartridge in the plane. The first driver is configured to press the head upon the wiping member on the wiping table.

Ultrasonic bonding apparatus

An ultrasonic bonding apparatus for manufacturing an electronic device that includes a substrate, an electronic component, and an underfill filled between the electronic component and the substrate includes a head that includes a tool surface configured to mount the electronic component, a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with the substrate and to press the head against the wiping member on the wiping table, a detector configured to detect a first pressure applied between the wiping member on the wiping table and the tool surface when the wiping unit provides wiping, and a controller configured to control a second pressure applied by the ultrasonic bonding unit, based on a detection result by the detector.

An ultrasonic bonding apparatus includes a head that includes a tool surface configured to mount an electronic component, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with a substrate, and a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table. The wiping unit includes a solvent supply unit configured to supply a solvent configured to powder the underfill, to the wiping member on the wiping table, a sealed cartridge configured to house the wiping table and a feed mechanism configured to supply the wiping member to the wiping table and to roll up the wiping member from the wiping table, and a cartridge support member that includes a motor configured to drive the feed mechanism, and is detachably attached to the cartridge.

A working machines includes an identifying unit. A force sensor detachably supports a working head in the identifying unit. A controller circuit is designed to identify the working head based on the load detected at the force sensor. When the working head is replaced with another one, the load changes in the force sensor in the identifying unit. In general, the individual working head has the specific weight. The working heads can thus be differentiated from each other based on the weight. Accordingly, the controller circuit is allowed to reliably identify the working head after the replacement with a higher accuracy based on the detected load.

Identifying unit for working machine and pressure apparatus

A contact member is supported on the support shaft. A force sensor is coupled to the support shaft. A movable member is coupled to the force sensor. The pressure apparatus allows the movable member to cause the axial movement of the support shaft. A first guide serves to guide the axial movement of the support shaft. The first guide is supported on the support member. The support member stands still during the movement of the movable member. Accordingly, the movement of the movable member is restrained in the axial direction. The contact member is thus prevented from suffering from a swinging movement around the force sensor. Servo control of a higher frequency bandwidth can be applied to the movement of the contact member. The contact member moves at a higher velocity. Occurrence of resonance is still avoided in the contact member. The tact time can be shortened.

Pressure apparatus and chip mounter

A vibration extraction processing unit extracts a deflection component synchronous with a rotation from a clock signal of a non-contact sensor so as to correct a clock jitter. A clock generating unit generates a clock signal of any format frequency preliminarily set up according to the clock signal from the vibration extraction processing unit. A sector correction processing unit measures an error due to the frequency deflection so as to correct the writing start position for the format pattern signal of each sector containing a servo frame signal stored in a memory according to the measured error. Writing processing units read out the corrected format pattern signal from the memory according to a synchronous signal corresponding to a single turn of a disc and a format frequency clock signal and then writes into a disc medium face.

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Kawasaki, Japan

Taizan Kobayashi