Casio Computer Co., Ltd.

Taisuke Koroku

Osamu Okada

Junji Shiota

Osamu Kuwabara

Nobumitsu Fujii

Takeshi Wakabayashi

Masao Sambongi

Satoru Watanabe

A central transmits, to a peripheral connected with the central, re-connection information indicating a timing of a re-connection after a disconnection. Subsequently, the central executes a connection discontinuing process based on the re-connection information. In addition, the central controls power supply for wireless communication at a timing determined based on the re-connection information. Thereafter, the central executes a re-connection process with the peripheral based on the re-connection information shared therewith prior to the disconnection.

Wireless communication device, electronic watch, wireless communication method, non-transitory recording medium, and wireless communication system

A communication system includes a first electronic device and at least one second electronic device. The second electronic device has a communication function section having a function for performing communication and an identification image presentation section which provides, at a position that can be captured from outside, an identification image having device information including the type of a communication standard for the communication to be performed by the communication function section. The first electronic device has a control section and a display section, and the control section acquires the device information from a captured image of the identification image, and causes a combination image that is a combination of an image of the second electronic device and image information correspond to the device information to be displayed on the display section.

Communication system, control method for electronic device and communication system, and computer-readable storage medium

A low dielectric constant film/wiring line stack structure made up of a stack of low dielectric constant films and wiring lines is provided in a region on the upper surface of the semiconductor substrate except for the peripheral part of this surface. The peripheral side surface of the low dielectric constant film/wiring line stack structure is covered with a sealing film. This provides a structure in which the low dielectric constant films do not easily come off. In this case, a lower protective film is provided on the lower surface of a silicon substrate to protect this lower surface against cracks.

Semiconductor device having low dielectric constant film and manufacturing method thereof

In this manufacturing method of a semiconductor device, after a sealing film is applied over an entire surface of a semiconductor wafer and hardened, a second groove for forming a side-section protective film is formed in the sealing film and on the top surface side of the semiconductor wafer. In other words, the sealing film is formed in a state where a groove that causes strength reduction has not been formed on the top surface side of the semiconductor wafer. Since the second groove is formed on the top surface side of the semiconductor wafer after the sealing film is formed, the semiconductor wafer is less likely to warp when the sealing film, made of liquid resin, is hardened.

Growing community of inventors

Sagamihara, Japan

Taisuke Koroku