Murata Manufacturing Co., Ltd.

Taisuke Kanzaki

Shoichiro Suzuki

Koichi Banno

Akihiro Shiota

Masanori Nakamura

Masahiro Otsuka

Kosuke Onishi

Satoshi Muramatsu

Akitaka Doi

Akio Masunari

Takayuki Yao

Makoto Matsuda

Megumi Fukuda

Seiichi Jono

A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.

Multilayer ceramic electronic component

A multilayer ceramic electronic component includes a multilayer body and external electrodes provided on opposing end surfaces of the multilayer body. Each external electrode includes an underlying electrode layer including metal components and ceramic components, and plating layers on the underlying electrode layer. A metal of the plating layer on the underlying electrode layer diffuses into the underlying electrode layer, and exists at an interface where the metal components included in the underlying electrode layer are in contact with each other and an interface where the metal component and the ceramic component included in the underlying electrode layer are in contact with each other.

Multilayer ceramic electronic component including multilayer external electrodes with diffused metal in an underlying electrode layer

A multilayer ceramic electronic component includes a multilayer body and external electrodes provided on opposing end surfaces of the multilayer body. Each external electrode includes an underlying electrode layer including metal components and ceramic components, and plating layers on the underlying electrode layer. A metal of the plating layer on the underlying electrode layer diffuses into the underlying electrode layer to extend from a surface layer of the underlying electrode layer to an interface of the multilayer body, and exists at an interface where the metal components included in the underlying electrode layer are in contact with each other, an interface where the metal component and the ceramic component included in the underlying electrode layer are in contact with each other, and an interface between the metal component included in the underlying electrode layer and the multilayer body.

Multilayer ceramic electronic component including multilayer external electrodes

A three-terminal multilayer ceramic capacitor includes a capacitor including a ceramic layer, first and second internal electrodes, first and second end surface electrodes, and first and second side surface electrodes, and has a lengthwise dimension of about 1300 &#x3bc;m or more and about 1500 &#x3bc;m or less, a widthwise dimension of about 1000 &#x3bc;m or more and about 1200 &#x3bc;m or less, a heightwise dimension of about 570 &#x3bc;m or more and about 680 &#x3bc;m or less, and a capacitance of about 12 &#x3bc;F or more and about 32 &#x3bc;F or less. The first and second end surface electrodes, and the first and second side surface electrodes include a Ni underlying electrode layer and at least one plating electrode layer. The first and second end surface electrodes have a thickness of about 0.73% or more and about 3.00% or less relative to the lengthwise dimension.

Three-terminal multilayer ceramic capacitor and method for manufacturing three-terminal multilayer ceramic capacitor

A multilayer ceramic capacitor includes a capacitive element including a stack of ceramic layers and internal electrodes, and external electrodes on a surface of the capacitive element. Each of the external electrodes includes a base electrode layer on the surface of the capacitive element and a Cu-plated electrode layer on a surface of the base electrode layer and including an edge portion facing the surface of the capacitive element. Sn is provided between the edge portion of the Cu-plated electrode layer and the surface of the capacitive element. On a surface of the Cu-plated electrode layer, at least one second plated electrode layer including an edge portion facing the surface of the capacitive element is provided.

Multilayer ceramic capacitor and method of manufacturing multilayer ceramic capacitor

A multilayer ceramic capacitor includes a capacitive element including ceramic layers and internal electrodes, and external electrodes on the capacitive element. The external electrodes include a Ni underlying electrode layer mainly made of Ni, a Cu plating electrode layer, and at least one second plating electrode layer. The Cu plating electrode layer includes a Ni diffused Cu plating electrode layer on a side closer to the Ni underlying electrode layer and including Ni diffused therein and a non-Ni diffused Cu plating electrode layer on a side closer to the second plating electrode layer and not including Ni diffused therein. The Cu plating electrode layer has a thickness of about 3 &#x3bc;m or more and about 12 &#x3bc;m or less and the non-Ni diffused Cu plating electrode layer has a thickness of about 0.5 &#x3bc;m or more.

Multilayer ceramic capacitor and method for manufacturing multilayer ceramic capacitor

A multilayer ceramic capacitor includes a ceramic multilayer body including dielectric ceramic layers and inner electrodes laminated with the dielectric ceramic layers interposed therebetween, wherein the dielectric ceramic layers include a perovskite compound containing Ba and Ti, and the inner electrodes (a) contain Ni as a main component, (b) include segregation with the perovskite compound containing Ba and Ti, which is scattered in the inner electrodes and embedded in the inner electrodes, in amount equal to or higher than about 2%, and (c) include columnar segregation with the perovskite compound containing Ba and Ti, which penetrates through the inner electrodes from one main surface side to the other main surface side, in an amount equal to or lower than about 5%, or do not include the columnar segregation. Further, an average thickness of the inner electrodes is equal to or smaller than about 0.4 &#x3bc;m.

Multilayer ceramic capacitor including a perovskite compound

A laminate body includes a plurality of ceramic layers and capacitor conductors embedded in the laminate body so as to be opposed to each other via one of the ceramic layers. The capacitor conductors are made of an Al-based material, and the capacitor conductors include narrow portions, respectively, which function as fuse elements. The narrow portions have an average width smaller than an average width of portions of the capacitor conductors other than the narrow portions. As a result, the electronic component has an improved capability to protect its function as a capacitor when a short circuit occurs between capacitor conductors.

Electronic component

A multilayer ceramic capacitor includes a ceramic body, and external electrodes on opposite side surfaces of the ceramic body. The ceramic body includes an inner layer portion including a plurality of ceramic layers, and first and second internal electrodes each arranged at interfaces between the ceramic layers defining the inner layer portion, and also includes outer layer portions arranged on an upper surface and a lower surface of the inner layer portion. The ceramic layers defining the inner layer portion include as a main component a perovskite-type compound containing Ba and Ti. The amount of Mg contained in the ceramic layers defining the inner layer portion preferably is 0 to about 0.4 part by mole per 100 parts by mole of Ti, for example. The thickness of the ceramic layers defining the inner layer portion preferably is not more than about 0.55 &#x3bc;m, for example.

Multilayer ceramic capacitor

A multilayer ceramic capacitor that includes dielectric layers made mainly of a perovskite compound containing Ba and Ti and optionally Zr and Hf, and inner electrodes having an average thickness of approximately 0.5 &#x3bc;m or less. The Mg content of the dielectric layers is approximately in the range of 0&#x2266;Mg&#x2266;0.4 (parts by mole) based on a total of 100 parts by mole of Ti, Zr, and Hf. The proportion of Mg-containing defects in the inner electrodes is approximately 20% or more.

A multilayer ceramic electronic component achieves a high electrostatic capacitance and includes an Al inner electrode superior in smoothness and conductivity. The multilayer ceramic electronic component includes a multilayer body including a plurality of stacked ceramic layers and a plurality of inner electrodes arranged along certain interfaces between the ceramic layers and containing Al as a main component, and an outer electrode located on an outer surface of the multilayer body. A surface of the inner electrode is covered with a layer including a noble metal or Ti as a main component.

Multilayer ceramic electronic component and method for manufacturing multilayer ceramic electronic component

A dielectric ceramic that can be sintered at a sufficiently low temperature and has a desired specific resistance at a high temperature, and a multilayer ceramic electronic component (a multilayer ceramic capacitor and the like) using the dielectric ceramic are provided. The multilayer ceramic capacitor includes a multilayer body having a plurality of laminated dielectric ceramic layers, and a plurality of internal electrodes at interfaces between the dielectric ceramic layers; and external electrodesandon outer surfaces of the multilayer body. The composition of the multilayer body includes a perovskite-type compound containing Ba and Ti (where a part of Ba may be substituted by Ca, and a part of Ti may be substituted by Zr) as a primary ingredient, and further includes M (where M is at least one of Cu, Zn, Li, K, and Na) and Bi. The total content of M and Bi is equal to or greater than 3 molar parts when the total content of Ti and Zr is 100 molar parts. The crystal particle size of the dielectric ceramic is 30 nm or more and 150 nm or less.

Multilayer ceramic capacitor, dielectric ceramic, multilayer ceramic electronic component, and method for manufacturing multilayer ceramic capacitor

Provided in a dielectric ceramic having flat capacitance characteristics and a high dielectric constant, and a multilayer ceramic electronic component (such as a multilayer ceramic capacitor) in which the dielectric ceramic is used. A multilayer ceramic capacitor includes a multilayer body having a plurality of dielectric ceramic layers and a plurality of internal electrodes, and external electrodes formed on the multilayer body. The composition of the multilayer body includes any of a bismuth layered compound containing Sr, Bi and Ti, a bismuth layered compound containing Sr, Bi and Nb, and a bismuth layered compound containing Ca, Bi and Ti as a primary ingredient, Bi and at least one of Cu, Ba, Zn and Li, and satisfies the conditions that if the Ti content is 400 molar parts or the Nb content is 200 molar parts, then (Bi content-Ti content) or (Bi content-Nb content) is equal to or greater than 1 molar part and less than 7.5 molar parts and the total content of Cu, Ba, Zn and Li is equal to or greater than 1 molar part and less than 10 molar parts.

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Nagaokakyo, Japan

Taisuke Kanzaki