Fujitsu Corporation

Taisuke Iwai

Yoshitaka Yamaguchi

Shinichi Hirose

Daiyu Kondo

Yukie Sakita

Yohei Yagishita

Ikuo Soga

Masaaki Norimatsu

Shintaro Sato

Masataka Mizukoshi

Yoshihiro Mizuno

Seiki Sakuyama

Koji Asano

Yuji Awano

Takumi Miyashita

Mizuhisa Nihei

Akio Kawabata

Tomoji Nakamura

Shuichi Tanaka

A heat dissipation material includes a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part; a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects; and a filler layer configured to be permeated between the plurality of linearly-structured objects.

Heat dissipation material and method of manufacturing thereof, and electronic device and method of manufacturing thereof

The graphite structure includes a plurality of domains of graphite where a layer body of graphene sheets is curved in domelike, wherein the plurality of domains are arranged in plane, and the domains adjacent each other are in contact with each other.

Graphite structure, electronic component and method of manufacturing electronic component

An electronic device includes: a semiconductor device; a heat-conductive resin, disposed above the semiconductor device, including a heat conductor and a resin; a linear carbon piece, disposed above the heat-conductive resin, to be thermally in contact with the heat conductor; and a heat spreader, disposed above the linear carbon piece, including a depressed portion having the heat-conductive resin.

Electronic device and method of manufacturing the same

A sheet structure has: a bundle structure including a plurality of linear structures made of carbon which are oriented in a predetermined direction; a covering layer covering the plurality of linear structures made of carbon; and a filling layer provided between the plurality of linear structures made of carbon covered with the covering layer. The thickness of the covering layer is not uniform in a direction crossing the predetermined direction.

Sheet structure, method of manufacturing sheet structure, and electronic device

Particles having a property of absorbing carbon at a particular temperature or higher are deposited on a graphene. The particles are heated to a temperature equal to the particular temperature or higher to make the particles absorb carbon from portions of the graphene under the particles. The particles are removed. Consequently, a graphene nanomesh is obtained.

Method of manufacturing graphene nanomesh and method of manufacturing semiconductor device

The electronic device includes a heat generator, a heat radiator, and a heat radiation materialdisposed between the heat generatorand the heat radiatorand including a plurality of linear structuresof carbon atoms and a filling layerformed of a thermoplastic resin and disposed between the plurality of linear structures

Heat radiation material, electronic device and method of manufacturing electronic device

In order to achieve a thermoelectric transducer exhibiting a higher conversion efficiency and an electronic apparatus including such a thermoelectric transducer, a thermoelectric conversion device is provided, including a semiconductor stacked structure including semiconductor layers stacked with each other, the semiconductor layers being made from different semiconductor materials, in which a material and a composition of each semiconductor layer in the semiconductor stacked structure are selected so as to avoid conduction-band or valence-band discontinuity.

Thermoelectric conversion device and method of manufacturing the same, and electronic apparatus

A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.

Electronic component and method of manufacturing electronic component

The sheet structure includes a plurality of linear structures of carbon atoms, a filling layer filled in gaps between the linear structures for supporting the plurality of linear structures, and a coating film formed over at least one ends of the plurality of linear structures and having a thermal conductivity of not less than 1 W/m&#xb7;K.

Sheet structure and method of manufacturing sheet structure

The sheet structure includes a plurality of linear structure bundleseach of which comprises a plurality of linear structures of carbon atoms arranged, spaced from each other at a first gap and which are arranged at a second gap which is larger than the first gap; and a filling layerfilled in the first gap and the second gap and supporting the plurality of linear structure bundles

Sheet structure and method of manufacturing the same

Electrodes formed in a partial surface area of a semiconductor substrate and distal ends of conductive nanotubes bristled on a surface of a growth substrate, are bombarded with rare gas plasma. The distal ends of the conductive nanotubes bombarded with the rare gas plasma are brought into contact with the electrodes bombarded with the rare gas plasma to fix the conductive nanotubes to the electrodes. The growth substrate is separated from the semiconductor substrate in such a manner that the conductive nanotubes fixed to the electrodes remain on the electrodes formed on the semiconductor substrate.

Manufacture method for semiconductor device with bristled conductive nanotubes

The sheet structure includes a plurality of linear structure bundles including a plurality of linear structures of carbon atoms arranged at a first gap, and arranged at a second gap larger than the first gap, a graphite layer formed in a region between the plurality of linear structure bundles and connected to the plurality of linear structure bundles, and a filling layer filled in the first gap and the second gap and retaining the plurality of linear structure bundles and the graphite layer.

Growing community of inventors

Kawasaki, Japan

Taisuke Iwai