Oki Data Corporation

Taishi Kaneto

Takahito Suzuki

Mitsuhiko Ogihara

Hiroshi Kurokawa

Kenichi Tanigawa

Satoshi Tanaka

A lens unit according to an embodiment includes: a lens array that includes lens elements each provided with an optical axis and extends in a first direction; a support member that supports the lens array; and an adhesive that bonds the lens array and the support member. The support member includes a first adhesive holding portion with a specified depth in a direction of the optical axis and a second adhesive holding portion shallower than the first adhesive holding portion. The first adhesive holding portion and the second adhesive holding portion are aligned in the first direction. The adhesive is arranged at the first adhesive holding portion and the second adhesive holding portion.

Lens unit, optical head and image formation apparatus

An optical head includes a lens array including resin lenses, a holder that holds the lens array, and a positioning mechanism that positions the holder such that the holder is opposed to a target. The positioning mechanism is configured to change a distance between the lens array and the target depending on a change in at least any one of temperature and humidity.

Optical head, optical print head, image formation apparatus, and image reader

A composite element chip includes a substrate; and a plurality of semiconductor thin-films disposed on the substrate and arranged in a predetermined direction which is a first direction. Each semiconductor thin-film includes an array of a plurality of light emitting portions which are arranged so that adjacent light emitting portions are displaced from each other by a predetermined distance in a second direction which is perpendicular to the first direction, the plurality of light emitting portions being arranged along an imaginary line. Each semiconductor thin-film has a first end that is parallel to the second direction; and a second end that extends along a pattern in which the plurality of light emitting portions are arranged and is parallel to the imaginary line. A semiconductor device and manufacturing method thereof, a printing head, and an image forming apparatus are also disclosed.

Composite element chip, a semiconductor device and manufacturing method thereof, a printing head, and an image forming apparatus

A semiconductor apparatus includes a rectangular plate-like body including a major surface. A plurality of light emitting portions formed in the major surface, and aligned in a straight line. A first terraced portion and a second terraced portion are formed in the major surface except areas in which the plurality of light emitting portions are formed.

Semiconductor apparatus, exposing head, and image forming apparatus

A semiconductor light emitting apparatus includes a substrate. A plurality of first electrode wirings are formed on the surface of the substrate. At least one second electrode wiring is formed on the surface of the substrate. A light emitting section is connected between a corresponding one of the plurality of first electrode wirings and the at least one second electrode wiring. The light emitting section includes a plurality of light emitting elements.

Semiconductor light emitting apparatus, image displaying apparatus, mobile terminal, head-up display apparatus, image projector, head-mounted display apparatus, and image forming apparatus

A semiconductor apparatus includes a substrate; and a plurality of semiconductor thin films formed on said substrate, each of said semiconductor thin films having a pn-junction, and electrodes of p-type and n-type for injecting carriers to the pn-junction, wherein said semiconductor thin films are formed so that all or a part of said pn-junctions are connected serially. As different from a semiconductor thin film constituted of a single pn-junction, the light emission with the invented semiconductor apparatus is the summation of the light emission intensities of the entire pn-junctions, so that the light emitting intensity can be increased largely.

Growing community of inventors

Tokyo, Japan

Taishi Kaneto