Sharp Kabushiki Kaisha Corporation

Other

Sakai Display Products Corporation

Taimi Oketani

Nobutake Nodera

Kazuki Kobayashi

Takao Matsumoto

Yoshiaki Matsushima

Shigeru Ishida

Ryohei Takakura

Tohru Okuda

Tetsuo Aoyama

Yasuhiro Matsushima

Taketo Maruyama

Tsuyoshi Naraki

Hisaki Abe

Yasunori Nishimura

Masahiro Nohara

Masatoshi Hayashi

Atsushi Ban

Masayuki Tsuji

Yoshinori Shimada

Takeshi Ishida

Yasuhisa Itoh

Toshio Yoshida

Jin Nakamura

Shigeyuki Yamada

Yoshihito Ishizue

Tetsuya Karita

Yukihiko Takeuchi

Ryouhei Takakura

Ryou Hashimoto

Yuji Amano

Takeshi Yonezawa

Kazuo Kinose

Tomoo Yamamoto

Kohhei Katsuya

Isao Saraoka

A chip-mounted board including: micro light-emitting chips arranged in a matrix pattern in a light-emitting region; and a conductive line electrically connected to the micro light-emitting chips, the light-emitting region including a first region having a first luminance, a second region having a second luminance lower than the first luminance, and a third region having a third luminance lower than the first luminance and higher than the second luminance, the luminances being values determined with the same magnitude of current supplied to the micro light-emitting chips, the third region being positioned between the first region and the second region and satisfying the following formulas (1) and (2):(1+)/(1&#x2212;)&#x2264;63.895&#xd7;tan(0.5&#xb0;)&#xd7;500/+6.0525&#x2003;&#x2003;(1)2=1&#x2003;&#x2003;(2)wherein L1 represents the first luminance, L2 represents the second luminance, and W represents a width (unit: mm) of the third region.

Chip-mounted board, display device, and method for producing chip-mounted board

In an image display device including an image taking window portion, the image taking window portion for an image taking camera is disposed within the image display region, and an outer diameter of a frame portion is set to satisfy a specific condition based on an angle of view of the image taking camera.

Image display device

There are provided a display apparatus and a method of manufacturing the display apparatus. The display apparatus includes a pixel having a first thin film transistor and a drive circuit having a second thin film transistor and driving the pixel, wherein a first channel region of the first thin film transistor and a second channel region of the second thin film transistor are configured to have different electrical characteristics (for example, electron mobility, thereby enabling the first thin film transistor and the second thin film transistor to function suitably for the each role thereof).

Display apparatus and method of manufacturing display apparatus

The thin film transistor includes: a gate electrode formed on a surface of a substrate; a polysilicon layer formed on an upper side of the gate electrode; an amorphous silicon layer formed on the polysilicon layer so as to cover the same; an n+ silicon layer formed on an upper side of the amorphous silicon layer; and a source electrode and a drain electrode which are formed on the n+ silicon layer, wherein, in a projected state in which the polysilicon layer, the source electrode and the drain electrode are projected onto the surface of the substrate, a part of the polysilicon layer and a part of each of the source electrode and the drain electrode are adapted so as to be overlapped with each other, and in the projected state, a minimum dimension, in a width direction orthogonal to a length direction between the source electrode and the drain electrode, of the polysilicon layer located between the source electrode and the drain electrode is smaller than dimensions in the width direction of the source electrode and the drain electrode.

Thin film transistor and display panel

The method for manufacturing a thin film transistor includes the processes of forming a gate electrode on a surface of a substrate, forming an insulation film on the surface of the substrate on which the gate electrode is formed, forming a first amorphous silicon layer on the surface of the substrate on which the insulation film is formed, annealing a plurality of required places separated from each other on the first amorphous silicon layer by irradiating the same with an energy beam to change the required places to a polysilicon layer, forming a second amorphous silicon layer by covering the polysilicon layer, forming an n+ silicon layer on a surface of the second amorphous silicon layer, etching the first amorphous silicon layer, the second amorphous silicon layer and the n+ silicon layer.

Method for manufacturing thin film transistor, thin film transistor and display panel

The thin film transistor includes a gate electrode formed on a surface of a substrate; a first amorphous silicon layer formed on an upper side of the gate electrode; a plurality of polysilicon layers separated by the first amorphous silicon layer and formed on the upper side of the gate electrode with a required spaced dimension; a second amorphous silicon layer and an n+ silicon layer which are formed on the upper side of the plurality of polysilicon layers and the first amorphous silicon layer; and a source electrode and a drain electrode formed on the n+ silicon layer.

A cleaning agent which comprises 0.1 to 60% by weight of an oxidizing agent and 0.0001 to 5% by weight of a chelating agent. In the process for producing semiconductor integrated circuits, a pattern layer of a photoresist used as an etching mask and residues formed from the photoresist by dry etching can be easily removed with the cleaning agent. In the process for producing substrates for liquid crystal display panels, residues derived from a conductive thin film formed by dry etching can also be easily removed. In the cleaning processes using the cleaning agent, wiring materials or insulating materials in thin film circuit devices or other materials used for producing substrates of semiconductor integrated circuits and liquid crystal panels are not corroded.

Cleaning agent and cleaning process using the same

Exposure method

A cassette for supporting substrates and an elongated rib therefor is described and represents a further improvement in the previously proposed elongated rib systems of the prior art and is designed particularly to preclude deflection and dampen vibrations of loaded substrates. The elongated ribs for the cassette project from side panels utilizing an elongated rib structure including three segments; namely, a base resin body, a bar-like intermediate resin body extending from the base resin body, and a terminal resin body disposed at the forward end of the intermediate resin body. Preferably, the elongated rib structure includes a linearreinforcing member inserted fromthe base resin body to the intermediate resin body or, alternatively, from the base resin body through the intermediate resin body to the terminal resin body.

Elongated rib for cassette and substrate cassette

A resist film removing composition used in the manufacture of a thin film circuit element having an organic insulation film which comprises 50 to 70% by weight of an alkanolamine having 3 or more carbon atoms, 20 to 30% by weight of a water-miscible solvent and 10 to 20% by weight of water. The resist film removing composition can easily remove a resist film remaining after etching, without swelling the organic insulation film.

Resist film removing composition and method for manufacturing thin film circuit element using the composition

Exposure apparatus

A photomask of the present invention is a photomask for use in production of a display device, the photomask having on its surface a plurality of drawn areas and a transitional portion between two adjacent ones of the drawn areas. A pattern is formed on at least one of the drawn areas. A ratio between a pattern pitch and a transitional portion pitch is an integral ratio such that a length defined by a least common multiple of the pattern pitch and the transitional portion pitch is 1 mm or less.

Photomask, method for producing TFT substrate, and method for producing display device

A cleaning apparatus in accordance with the present invention includes a first inflow section, provided on a first side surface of a cleaning tank having a substantially rectangular parallelopiped shape, having two inflow openings, a second inflow section, provided on a second side surface facing the first side surface, having inflow openings, and outflow openings for releasing a cleaning liquid flown in from the first and second inflow sections. The cleaning liquid flowing in from the inflow openings forms complex and strong flows in the cleaning tank, thus removing contaminants on a cleaning target evenly and efficiently without nonuniformity and preventing stagnation of the cleaning liquid in the cleaning tank. The cleaning liquid released in filtered by a circulatory section and is allowed to flow into the cleaning tank again through a pipe. As a result, it is possible to clean evenly and efficiently a large cleaning target such as a glass substrate used for liquid crystal display devices and other devices.

Cleaning method and cleaning apparatus

A cleaning apparatus and method in accordance with the present invention includes a first inflow section, provided on a first side surface of a cleaning tank having a substantially rectangular parallelopiped shape, having two inflow openings, a second inflow section, provided on a second side surface facing the first side surface, having inflow openings, and outflow openings for releasing a cleaning liquid flown in from the first and second inflow sections. The cleaning liquid flowing in from the inflow openings forms complex and strong flows in the cleaning tank, thus removing contaminants on a cleaning target evenly and efficiently without nonuniformity and preventing stagnation of the cleaning liquid in the cleaning tank. The cleaning liquid released in filtered by a circulatory section and is allowed to flow into the cleaning tank again through a pipe. As a result, it is possible to clean evenly and efficiently a large cleaning target such as a glass substrate used for liquid crystal display devices and other devices.

Method of cleaning a substrate in a cleaning tank using plural fluid

A fluid application apparatus of the present invention includes a rotatable substrate holding mechanism (4), a photoresist liquid supply portion (5) and a motor mechanism (26). The photoresist liquid supply portion (5) supplies resist fluid to a region smaller than the entire region of the substrate surface while moving in the horizontal direction relative to the substrate holding mechanism (4). The motor mechanism (26) rotates the substrate holding mechanism (4) to diffuse the resist fluid over the entire surface of the substrate and form a resist layer having a predetermined thickness.

Coating device with movable fluid supply nozzle and rotatable substrate

Growing community of inventors

Sakai, Japan

Taimi Oketani