Shin-etsu Chemical Co., Ltd.

Taiki Katayama

Takafumi Sakamoto

Munenao Hirokami

Tetsuro Yamada

Takahiro Yamaguchi

Masayuki Ikeno

Akira Uta

Isao Iwasaki

Misaki Takai

Shigeki Yasuda

Provided is a primer composition capable of imparting a favorable adhesiveness when bonding a polyolefin resin and a silicone resin such as a cured product (silicone rubber cured product) of a silicone rubber composition selected from a room temperature condensation-curable silicone rubber composition and an addition-curable silicone rubber composition. The primer composition for bonding a silicone resin and a polyolefin resin comprises a copolymer (I) contained in a solvent (II), in which the copolymer (I) at least contains a (meth)acrylate ester monomer unit (A) and a (meth)acrylate ester monomer unit (B).

Primer composition for bonding silicone resin and polyolefin resin, and method for bonding silicone resin and polyolefin resin

A room-temperature-curable organopolysiloxane composition for an oil seal, wherein an organosilane compound containing a specific organo-oxymethyl group and represented by formula (1) below and/or a partial hydrolysis condensate of said compound is used as a curing agent (crosslinking agent), and an organic compound having a guanidine skeleton is added in combination as a curing catalyst. In the formula, each Ris independently a C1-12 unsubstituted or substituted monovalent hydrocarbon group, Ris a C1-12 unsubstituted or substituted monovalent hydrocarbon group, Y is a hydrolyzable group, and n is 0, 1 or 2. It is thus possible to obtain a cured product having good rubber properties, adhesiveness, and engine oil resistance after curing even without containing a metal-based catalyst:

Room-temperature-curable organopolysiloxane composition for oil seal, and automotive part

The present invention is a room temperature curable resin composition comprising: as the main agent, an organic polymer in which both molecular chain terminals are sealed by a silanol group and/or a hydrolyzable silyl group; and an organic silicon compound of a specific structure having, in a molecule, an organosiloxane structure, a hydrolyzable silyl group, and a hindered amine skeleton. This resin composition produces a cured product in which the degradation over time associated with the effects of light such as UV rays can be suppressed.

Room temperature curable resin composition, coating agent, adhesive, sealing agent, and article

The present invention provides: a novel organic titanium compound having an effect as an adhesion promoter by itself; a production method of such organic titanium compound; and a room temperature-curable resin composition containing such organic titanium compound both as a curing catalyst and as an adhesion promoter. Provided are an organic titanium compound represented by an average composition formula (I):Ti(OR)(YSi-A-O&#x2014;CO&#x2014;CH&#x2550;C(O)R)(wherein Rrepresents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms, R represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms, A represents a divalent hydrocarbon group having 3 to 6 carbon atoms, Y represents a hydrolyzable group, and a represents a number satisfying 0&#x3c;a&#x3c;4); a production method of such organic titanium compound; and a room temperature-curable resin composition that contains a room temperature-curable resin.

Moisture and room temperature-curable organopolysiloxane resin composition and method for producing cured product thereof

Provided are an organosilicon compound capable of improving the storage stability of a composition (curability after long-term storage); and a method for producing the same. The organosilicon compound has, in one molecule, at least one carboxylic acid ester group represented by the following general formula (1) and at least one hydrolyzable silyl group represented by the following general formula (2):&#x2014;OC(&#x2550;O)CHR&#x2003;&#x2003;(1)

Organosilicon compound and method for producing same

Provided is a room temperature-curable resin composition containing an aluminum chelate compound. This aluminum chelate compound is an aluminum chelate compound having a &#x3b2;-dicarbonyl compound represented by the following general formula (1): wherein each of Rto Rrepresents a monovalent hydrocarbon group or a halogen atom; Rrepresents a hydrogen atom or a monovalent hydrocarbon group; and A is a group selected from a group represented by the following formula (2) and a group represented by &#x2014;OR: wherein each of Rto Rrepresents a monovalent hydrocarbon group or a halogen atom; and Rrepresents a monovalent hydrocarbon group.

Room temperature-curable resin composition containing an aluminum chelate compound

Provided is a compound for imparting a thermal plasticity to an organic silicon resin. The compound is a novel vinyl silane compound represented by the following formula (1): wherein A independently represents a divalent hydrocarbon group having 1 to 6 carbon atoms; Y independently represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms.

Vinyl silane compound

Provided is an organic silicon compound represented by the following general formula (1) (wherein Rrepresents either an alkyl group that has 1 to 20 carbon atoms and may have a substituted group or a cycloalkyl group that has 3 to 20 carbon atoms and may have a substituted group; Rrepresents either a hydrogen atom or a monovalent hydrocarbon group that has 1 to 20 carbon atoms and may have a substituted group, and Rmay be either identical or different; and each a independently represents an integer of 1 to 3). The novel silicon-containing compound of the present invention provides a cured product of a room temperature-curable organopolysiloxane composition that is particularly superior in fast curability.

Bis (alkoxysilyl-vinylene) group-containing silicon compound and production method of same

The invention is a room-temperature-curable resin composition including a phosphazene skeleton-containing organosilicon compound shown by the following general formula (1). This provides a room-temperature-curable resin composition which is curable in short time, free from generation of an odor due to the catalyst, free from a heavy environmental load; and has sufficient hardness, elongation at shear, and tensile strength after curing. 

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Annaka, Japan

Taiki Katayama