Industrial Technology Research Institute

TaiKang Shing

Justin S Clark

Yeong-Jeong Ou

Ke-Shieng Yang

Jeng-Shie Chung

A micro pressure sensor comprising a glass substrate or a bulk silicon wafer with a rampart protruding from the surface and a plurality of first contacting pads, a thin membrane having a plurality of piezo-resistors, circuit patterns, and a plurality of second contact pads, and conducting lines, wherein the plurality of contact pads are partially exposed to outside. The rampart on the substrate has a cavity formed on the center of the top surface of the rampart. The top surface of the rampart is tightly bonded to the surface of the thin membrane. The piezo-resistors are sealed in the cavity. Preferably, the micro sensor further comprises a plurality of thermo sensors, and a plurality of temperature-controlling elements all enclosed inside the cavity, and additional protective layers formed on the exposure regions of all contact pads.

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Hsinchu, Taiwan

TaiKang Shing