Fujitsu Corporation

Fujitsu Interconnect Technologies Limited

Fict Limited

Taiji Sakai

Masataka Mizukoshi

Seiki Sakuyama

Nobuhiro Imaizumi

Kanae Nakagawa

Kazuaki Kurihara

Takeshi Shioga

Yoshikatsu Ishizuki

John David Baniecki

Taiki Uemura

Toshiki Iwai

Hisashi Yamaguchi

Fumio Yamagishi

Junji Tomita

Daisuke Mizutani

Kazuo Teshirogi

Hideki Kitada

Keishiro Okamoto

Aki Dote

Shigeo Matsunuma

Kenji Iida

Norikazu Ozaki

Takashi Nakagawa

Kenji Takano

The present invention addresses the problem of providing a circuit board for which the manufacturing process is short and which has a laminate surface having uniform flatness. As a solution to the problem, this method for manufacturing a circuit board includes: manufacturing a three-layer metal () having, on one surface thereof, a first metal layer () formed in a pattern shape; manufacturing unit structures () each having the first metal layer (), a cured first insulating base material () filled with a cured first conductive paste (), a second metal layer (), and a semi-cured second insulating base material () filled with a semi-cured second conductive paste (); joining together the first insulating base material () in one unit structure () among a plurality of the unit structures with the second insulating base material () in another unit structure (); and layering the plurality of unit structures ().

Method for manufacturing circuit board

An issue is directed to suppressing light interference occurring between a plurality of waveguides and providing waveguides at high densities. Means for solving the issue includes a plurality of cores () each configured to allow light to be transmitted therethrough, a clad () surrounding the plurality of cores () and smaller in refractive index for light than each of the cores (), and a transmission suppression member () located between mutually adjacent two cores out of the plurality of cores () and configured to suppress transmission of light leaking from each of the cores.

Waveguide member and waveguide layered product

A multilayer substrate includes a plurality of plates laminated in a thickness direction of the multilayer substrate, a resin layer provided between the plurality of plates adjacent in the thickness direction, an internal conductive layer provided between the plurality of plates adjacent in the thickness direction, and an external conductive layer provided over an outer surface of each plate of the plurality of plates located at both ends in the thickness direction, wherein a total thickness of the internal conductive layer and the external conductive layer is equal to or less than 25% of a total thickness of the plurality of plates.

Multilayer substrate

An electronic device includes: a first layer that includes first electronic components in a group and has a first through space between adjacent ones of the first electronic components; and a second layer that is stacked over the first layer and includes second electronic components which are coupled to the first electronic components and a second through space between adjacent ones of the second electronic components, the second through space being partially overlapping with the first through space.

Electronic device, method of manufacturing electronic device, and electronic apparatus

A circuit board includes: a first substrate including a first through hole, a first metal layer formed over an inner wall of the first through hole, and a first conductive composite resin provided on an inner side of the first metal layer of the first through hole; and a second substrate stacked together with the first substrate and including a second through hole that faces the first through hole and has a first open end which is provided on a side of the first through hole and is located on the inner side of the first metal layer, and a second conductive composite resin that is provided in the second through hole and is coupled to the first conductive composite resin.

Circuit board, method of manufacturing circuit board, and electronic device

An electronic apparatus includes a first circuit board, a stacked circuit that is provided on the first circuit board through first coupling terminals and has a structure in which arithmetic elements and memory elements are stacked through inter-element coupling terminals and to which a signal is inputted from the first circuit board, and a second circuit board that is provided on the stacked circuit through second coupling terminals and to which a result of processing is outputted from the stacked circuit, wherein a number of the first coupling terminals and a number of the second coupling terminals are smaller than that of the inter-element coupling terminals.

Electronic apparatus, fabrication method therefor and electronic part

An electronic device includes: a first circuit board; a second circuit board located above a first region of the first circuit board; a first semiconductor element located above a second region of the first circuit board, which is different from the first region, and above a third region of the second circuit board; a first connection interposed between the first semiconductor element and the second region so as to electrically interconnect the first semiconductor element and the first circuit board; and a second connection interposed between the first semiconductor element and the third region so as to electrically interconnect the first semiconductor element and the second circuit board.

Electronic device, method for manufacturing the electronic device, and electronic apparatus

According to this disclosure, a method of manufacturing an electronic device is provided, which includes exposing a top surface of a first electrode of a first electronic component to organic acid, irradiating the top surface of the first electrode exposed to the organic acid with ultraviolet light, and bonding the first electrode and a second electrode of a second electronic component by heating and pressing the first electrode and the second electrode each other.

Method of manufacturing an electronic device, and electronic device manufacturing apparatus

A conductive material includes a first metal part whose main ingredient is a first metal; a second metal part formed on the first metal part and whose main ingredient is a second metal, the second metal having a melting point lower than a melting point of the first metal, which second metal can form a metallic compound with the first metal; and a third metal part whose main ingredient is a third metal, which third metal can make a eutectic reaction with the second metal.

Conductive material, conductive paste, circuit board, and semiconductor device

A semiconductor substrate is secured by suction to a rear face of a supporting face of a substrate supporting table. In this event, the thickness of the semiconductor substrate is made fixed by planarization on the rear face, and the rear face is forcibly brought into a state free from undulation by the suction to the supporting face, so that the rear face becomes a reference face for planarization of a front face. In this state, a tool is used to cut surface layers of Au projections and a resist mask on the front face, thereby planarizing the Au projections and the resist mask so that their surfaces become continuously flat. This can planarize the surfaces of fine bumps formed on the substrate at a low cost and a high speed in place of CMP.

Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus

Electronic device having electrodes bonded with each other

A printed wiring board includes a Cu wiring pattern formed on a substrate. A first metal layer is formed on the Cu wiring pattern. A second metal layer is formed on the first metal layer. The first metal layer has a less reactivity with Cu than the second metal layer. The first metal layer and the second metal layer together cause an eutectic reaction.

Method of manufacturing a printed wiring board

A method for manufacturing an interposer including forming a capacitor over a semiconductor substrate; forming a first resin layer with a first partial electrode buried in over the semiconductor substrate and the capacitor; cutting an upper part of the first partial electrode and the first resin layer with a cutting tool; forming a second resin layer with a second partial electrode buried in over a glass substrate with a through-electrode buried in; cutting an upper part of the second partial electrode and the second resin layer with the cutting tool; making thermal processing with the first resin layer and the second resin layer adhered to each other while connecting the first partial electrode and the second partial electrode to each other; removing the semiconductor substrate; forming a third resin layer over the glass substrate, covering the capacitor; and burying a third partial electrode in the third resin layer.

Method for manufacturing interposer

A method of manufacturing a semiconductor device includes: forming a first layer including crystals by processing a surface of a first electrode of a semiconductor element; forming a second layer including crystals by processing a surface of a second electrode of a mounting member on which the semiconductor element is mounted; reducing a first oxide film present over or in the first layer and a second oxide film present over or in the second layer at a first temperature, the first temperature being lower than a second temperature at which a first metal included in the first electrode diffuses in a solid state and being lower than a third temperature at which a second metal included in the second electrode diffuses in a solid state; and bonding the first layer and the second layer to each other by solid-phase diffusion.

Growing community of inventors

Kawasaki, Japan

Taiji Sakai