Sharp Kabushiki Kaisha Corporation

Taiji Maeda

Motonari Aki

Yasushi Hasegawa

An input side is configured with a pulse generating circuit, a delay circuit, a driving circuit, and two light emitting elements connected to the driving circuit, and an output side is configured with two light receiving elements, connected to a computation circuit, and the pulse generating circuit, and based on a directly connected input signal, a clock pulse signal that is input from the pulse generating circuit, and a delayed input signal that is input from the delay circuit, the driving circuit causes the two light emitting elements to alternately emit light with offset timing. On the other hand, the computation circuit, while synchronizing with the signals from the two light emitting elements, by alternately receiving signals with the two light receiving elements, transmits a signal by pairing these two light receiving elements.

Optical coupling device and electronic apparatus using same that transmits a signal with two light emitting elements and one or two light receiving elements

If external magnetic field(s) (external noise) is/are present, equivalent noise component(s) might be produced at both receiving coil(s) and dummy coil(s), and respective noise components from receiving coil(s) and dummy coil(s) might be made to at least partially cancel out one another at differential amplifier(s), substantially only signal component(s) due to magnetic field(s) from transmitting coil(s) being applied by way of differential amplifier(s) to comparator(s), where same is/are binarized and is/are moreover output by way of output control circuitry and respective transistor(s).

Magnetically coupled device and electronic equipment employing same

An optical semiconductor element includes a light-emitting element, a light-receiving element that is placed opposite to the light-emitting element, and two lead frames on which the light-emitting element and the light-receiving element are respectively die bonded. Shield plates are bent respectively toward the light-emitting element or the light-receiving element at a predetermined angle with respect to the surface of a die bonding region on the periphery of the die bonding region of the lead frames.

Growing community of inventors

Nara, Japan

Taiji Maeda