Sony Corporation

Taiyo Yuden Co., Ltd.

Taiyo Yudenco., Ltd.

Taiji Ito

Yoichiro Sako

Masamichi Asukai

Masaaki Tsuruta

Akane Sano

Akinobu Sugino

Hidehiko Sekizawa

Nozomu Ozaki

Yoshiteru Kamatani

Takayasu Kon

Yasunori Kamada

Mitsuru Takehara

Kazunori Hayashi

Kan Ebisawa

Jin Mikata

Keiji Kimura

Yonetaro Totsuka

Masaya Shimamura

Takehiko Kai

Mikio Aoki

Hirotaka Sakaguchi

Takashi Fukushima

Itaru Kawakami

Kenzo Kitazaki

Miki Abe

Masashi Hattori

Yosuke Onda

Kyohei Iwamoto

Kenichi Shimomai

Mari Saito

Kouichi Matsuda

Yoshihiro Takagi

Takashi Nakao

Hiroaki Kitano

Naoki Nagano

Yasuhiro Sutou

Takeshi Sano

Keiichi Shibata

Tamotsu Ishii

Shinji Ohta

Rio Yamasaki

Tetsu Natsume

Mitsuhiro Ueno

Yasuyuki Takeshita

Koichi Oshima

Hironari Mizumura

Hiromitsu Komatsu

Shotaro Hori

Yasuo Sakuma

Hideko Tabata

An odor is detected with high accuracy. A sensing system includes: a sensor apparatus including a filter to remove an odor-causing substance contained in air and a sensor unit including one or more detection elements to detect an amount of the odor-causing substance contained in air; and an information processing apparatus including a difference calculation unit to calculate a difference between a detection value of each of the one or more detection elements, the detection value indicating an amount of the odor-causing substance contained in air that has passed through the filter and a detection value of each of the one or more detection elements, the detection value indicating an amount of the odor-causing substance contained in air that has not passed through the filter, and a determination unit to determine an odor of air based on the calculated difference.

Sensing system, information processing apparatus, and sensor apparatus

An electronic component module includes: electronic components mounted on a substrate, each of the electronic components having terminals located on a side, upper, and/or lower surface thereof; and a shield that is located on the substrate, has side plates surrounding the electronic components, and is supplied with a ground potential, wherein in an electronic component closest to one side plate of the side plates among one or more electronic components, in each of which at least one terminal of the terminals is located on the side and/or upper surface, a terminal a first distance of which to the one side plate is shortest among the at least one terminal is a first terminal supplied with the ground potential, and a second distance each of second terminals not supplied with the ground potential to the one side plate is greater than the first distance.

Electronic component module

An air conditioning system includes: an air conditioner to regulate a state of air in a room; a sensor device including at least one detector to detect an amount of an odor-causing substance included in the air in the room; and a control device to control operation of the air conditioner. The control device includes: a first acquisition unit to acquire a detected value of each of the at least one detector at a first timing when a person is present in the room; a second acquisition unit to acquire a detected value of each of the at least one detector at a second timing later than the first timing; a difference calculator to calculate a difference between the detected value at the first timing and the detected value at the second timing; and an instruction unit to control operation of the air conditioner based on the difference.

Air conditioning system, vehicle, control device, and control method

An information processing apparatus includes a bio-information obtaining unit configured to obtain bio-information of a subject; a kinetic-information obtaining unit configured to obtain kinetic information of the subject; and a control unit configured to determine an expression or movement of an avatar on the basis of the bio-information obtained by the bio-information obtaining unit and the kinetic information obtained by the kinetic-information obtaining unit and to perform a control operation so that the avatar with the determined expression or movement is displayed.

Information processing apparatus, system, and method for displaying bio-information or kinetic information

Solution is preparing a substrate; covering an electronic component mounting region and an antenna mounting region of the substrate with a resin material having viscosity or fluidity; curing the resin material to form a resin layer, and thereafter performing grinding or polishing so as to substantially flatten a surface of the resin layer on the electronic component mounting region and the antenna mounting region; and covering the flattened resin layer with a shielding material having viscosity or fluidity.

Wireless module and method for manufacturing the same

An optical communication device, for performing communication between spatially separated points by using one or more laser beams, includes an angle correction device that corrects a direction of a light receiving system and an emission optical axis correction device, in which an angle error which is not corrected by the angle correction device is detected by a light receiving angle detection device, and the emission optical axis correction device is controlled according to a detected error amount, and an emission optical axis is corrected.

Optical communication device

An electronic component module includes: a substrate including a conductive pattern; an electronic component provided to the substrate; a sealing portion covering the electronic component and substrate, and having an upper surface and a side surface that form an edge portion; a contact portion configured to be electrically connected with the conductive pattern, the contact portion exposed on a vertical surface continuous with the side surface of the sealing portion; a removal portion formed by removing the predetermined edge portion formed by the upper surface and the side surface of the sealing portion; and a shielding film covering the upper surface, the side surface and the contact portion of the sealing portion. The removal portion is a region allowing a conductive material to pass therethrough so that the contact portion is covered with the shielding film, the conductive material being scattered in vacuum atmosphere lower than atmospheric pressure.

Electronic component module and method of manufacturing the same

There is provided an information processing apparatus, an information processing method, a program, and an information processing system that are capable of proactively supporting continuous communication, the information processing apparatus including: an acquiring unit that acquires a predetermined number of message content items, as candidates to be sent, from a plurality of message content items classified as a category corresponding to an image used for communication among a plurality of categories into which the message content items are classified; and an option creating unit that creates an option for prompting a selection of the message content item to be sent from the predetermined number of message content items acquired by the acquiring unit, and exhibits the option at a predetermined timing. The present technology can be applied to, for example, an information processing apparatus that constitutes a communication support system.

Information processing apparatus, information processing method, program, and information processing system for sending a message with an image attached thereto

A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate and serving as an antenna; a resin layer sealing the electronic circuit in the first region; and a shielding layer formed on a surface of the resin layer and having conductivity.

Wireless module and method for manufacturing wireless module

A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate, the conductive pattern being connected to a radio communication section of the electronic circuit, and the conductive pattern serving as an antenna when transmitting/receiving radio wave, the second region being different from the first region; a resin layer sealing the electronic circuit in the first region; a shielding layer formed on a surface of the resin layer; and a shield disposed in either one of a top layer of the substrate and an inner layer of the substrate, the shield being for shielding noise radiated from the electronic circuit.

A wireless module includes: a rectangular shaped substrate; an antenna element provided in a first region of the substrate; a rectangular shaped integrated circuit element provided in a second region of the substrate, the integrated circuit element including, in a single package, an RF unit to process an RF signal, a baseband unit to process a baseband signal, and a power supply unit; and discrete components provided in a third region of the substrate, the integrated circuit element provided such that two parallel sides of the integrated circuit element are along long sides of the substrate, neither the first region nor the third region being provided between each long side of the substrate and each side of the integrated circuit element along the long side, the first region and the third region being provided to be aligned in a longitudinal direction of the substrate with respect to the second region.

Power control can be performed for electronic apparatuses that are unable to connect to a network. A user accesses the URL of a power supply center, and downloads an application (S). The application is downloaded for each individual electronic apparatus to be controlled. In S, the user makes various settings. After the settings are complete, the power supply centertransmits a power-limiting signal (S), and a communication device receives the power-limiting signal (S). If it is determined in Sthat the power-limiting function is set active, the application is started in S. In S, the kind of the communication that has been set is infrared. If the kind of the communication is infrared, in S, a power-limiting signal is transmitted to a target electronic apparatus via infrared communication.

Power control method, communication device, and power control system

Forming a groove in a dicing region so as to expose a conductive pattern material on a side surface, closer to a first side of each of mounting regions, of a substrate; when forming a first sealing portion enclosing a wireless region and a second sealing portion enclosing an antenna region adjacent to the wireless region on a side of a second side of each of the mounting regions, reducing a thickness in a height direction such that a thickness of the second sealing portion becomes smaller in thickness than a thickness of the first sealing portion; forming a shielding film such that a scattered matter made of a conductive material is allowed to pass through an upper surface of the second sealing portion, to be deposited onto the conductive pattern material exposed on a side surface of the substrate; and separating the substrate into the mounting regions individually.

Method of manufacturing electronic component module

A method of manufacturing a plurality of identical electronic component modules includes: preparing an assembly substrate that includes a plurality of electronic components mounted thereon; digging a first groove along the dicing lines from a top surface of a sealing member that seals each electronic component, the first groove penetrating the sealing member and reaching an intermediate depth within a base substrate; widening an upper portion of the first grove to define a second groove that is continuous with the lower portion of the first groove; forming a shielding film by depositing a film made of a conductive material on the top surface of the sealing member and on inner walls of the first and second grooves that include the sidewalls of the sealing member; and thereafter, cutting the base substrate at a bottom of the lower portion of the first groove along dicing lines.

Method of making plural electronic component modules

Growing community of inventors

Kanagawa, Japan

Taiji Ito