Tokyo Ohka Kogyo Co., Ltd.

Tazmo Co., Ltd.

Tokyo Ohka Kogyo C., Ltd.

Taiichiro Aoki

Akihiko Nakamura

Seiji Ohishi

Hidenori Miyamoto

Toshimasa Nakayama

Koji Ueda

Etsuko Iguchi

Hiroki Endo

Tamotsu Sasaki

Susumu Okano

Hitoshi Obata

Akinori Nishie

Hiroshi Yamabe

A film-forming method is provided in which generation of an edge bead can be prevented even in a case where the thickness of a coating solution is large, and includes the steps of applying a coating solution onto a substrate to be treated such that thickness of the coating solution is 20 &#x3bc;m or more, placing the substrate into a heating space defined within an oven unit in which heating devices are provided in upper and lower portions of the heating space, and heating the substrate at a temperature-rising rate of 80 to 120&#xb0; C./10 min so as to remove a solvent within the coating solution while keeping the substrate in a non-contact state with respect to the heating devices.

Film-forming method

A method for forming a coating film, comprises the steps of: applying a raw material of a low dielectric constant onto a surface of a plate-like material; reducing oxygen concentration in the atmosphere surrounding the plate-like material to be less than or equal to 1% before a surface temperature of said plate-like material to be treated rises to 200&#xb0; C.; thereafter heating said plate-like material to a temperature greater than or equal to 400&#xb0; C.; and then maintaining the oxygen content in the atmosphere to be less than or equal to 1% until the surface temperature of said plate-like material to be treated lowers to 200&#xb0; C. The raw material is an organic SOG obtained by hydrolyzing and condensing at least one alkoxysilane compound into an organic solvent under an acid catalyst.

Method for forming a coating film on a plate-like workpiece

A multi-stage type processing apparatus which can be positioned in a limited space without having a complicated driving mechanism, includes processing units which are stacked in a multi-stage state in the vertical direction. Each processing unit has a cup surrounding a substrate and a chuck for retaining and rotating a substrate, and the cup can be elevated and lowered with respect to the chuck. A cylinder unit is contracted and thereby all the cups are unitarily lowered, so that the top surface of the chuck is located in a slightly upper position with respect to the top surface of the cup. In this state, a substrate is mounted on the chuck and attracted. Next, the cylinder unit is extended and thereby all the cups are unitarily elevated so as to accommodate the substrate therein. In this state, developing liquid is dropped from a nozzle for developing liquid onto the center of the substrate, and a motor is driven to rotate the chuck (the substrate) via a drive shaft and a timing belt to allow the developing liquid to cover the entire surface of the substrate.

Multi-stage type processing apparatus

A tray, used for transferring a substrate and conducting a coating process, includes a recessed portion to accommodate a substrate, the depth of the recessed portion being substantially the same as the thickness of the substrate, and a one-step-lower gutter which is provided on an outer periphery of said recessed portion or inside the outer periphery of said recessed portion. The tray may further comprise a plurality of attracting grooves which are provided concentrically in a surface of said recessed portion; attracting holes which are provided in each attracting groove, respective attracting passages by which said attracting holes are connected to a vacuum source, and a pre-dispensing area which is formed on the same surface as the recessed portion to receive a coating liquid from a nozzle

Tray for substrate

The object of the present invention is to provide an apparatus suitable for forming a thick film having a thickness on a surface of a substrate such as a glass substrate, a semiconductor wafer or the like. In the apparatus according to the present invention, a stock station for a substrate and a treatment station for a substrate are adjacent to each other, portions for coating, film-forming, cleaning and drying are provided in the treatment station, a tray having a concave portion for accommodating a substrate defined on the surface thereof is provided, and a transfer device circulates the tray around the portions for coating, film-forming, cleaning and drying.

Film forming apparatus, film forming method and tray for substrate

A heat treatment apparatus comprises: a chamber; a cooling plate and a heating plate disposed within the chamber vertically spaced from each other; plural lift pins used to support a material to be treated; a supporting member for supporting the plural lift pins; and an elevator member to which the supporting member is attached through a joint so that the supporting member can be selectively made rotatable and can be fixed at any inclined angle, wherein distances of tips of each of the lift pins from the heating or cooling plate are initially adjusted to be uniform through inclination of the supporting member while the tips contact the heating or cooling plate, after which the supporting member is fixed in an adjusted inclined angle and then the material to be treated is lifted up with the plural lift pins to closely approach the heating or cooling plate during heat treatment.

Heat treatment apparatus and method

A processing unit structure,a plurality of processing units,, . . . , assembled together continuously in a horizontal direction, wherein a transfer portion,is provided on the top of each processing unit,, . . . , for transferring the plate-like material to be processed between adjacent one of the processing units. A transfer device, such as a shuttle (SH) is provided in each of the transfer portions,. Each processing unit,performs a series of processes on the plate-like material and is constructed with processing blocks,and,and a transfer portion,in the form of a transfer robot (R) positioned between the processing blocks,and,. Further, each processing unit,. . . is independent from one another so that it is possible to selectively add and remove different ones of the processing units with respect to the processing unit structure

Processing unit and processing unit structure by assembling thereof

The present invention provides a method for the formation of a pattern, which comprises applying an antireflective coating film-forming composition solution comprising (A) a compound which undergoes crosslinking reaction when irradiated with actinic rays and (B) a dye to a substrate to form a coating film thereon, entirely irradiating the coating film with actinic rays to form an antireflective coating film, applying a resist solution to the antireflective coating film, drying the coated material to form a resist layer, and then subjecting the coated material to lithographic treatment to form a resist pattern on the antireflective coating film. The method enables the formation of a resist pattern having an excellent dimensional accuracy and section shape without causing the formation of an intermixed layer between the resist composition and antireflective coating film.

Growing community of inventors

Kanagawa, Japan

Taiichiro Aoki