Asahi Kasei Kabushiki Kaisha

Taihei Inoue

Tomohiro Yorisue

Yoshito Ido

Takahiro Sasaki

Mitsutaka Nakamura

Harumi Matsuda

Tatsuya Hirata

Tomoshige Yunokuchi

Daisuke Sasano

A semiconductor device having a copper wiring and an insulating layer provided on the copper wiring, where after storage in air with a humidity of 5% for 168 hours at 150&#xb0; C., the area of void portion of the copper wiring is 10% or less at the copper wiring surface in contact with the insulating layer. The insulating layer contains at least one polyimide that has (i) a structure derived from 4,4'-oxydiphthalic acid dianhydride and a structure derived from 4,4&#x2032;-diaminodiphenyl ether; or (ii) a structure derived from 3,3&#x2032;4,4&#x2032;-biphenyltetracarboxylic acid dianhydride and a structure derived from 4,4&#x2032;-diaminodiphenyl ether; or (iii) a structure derived from 4,4&#x2032;-oxydiphthalic acid dianhydride and a structure derived from 2,2&#x2032;-dimethyl-4,4&#x2032;-diaminobiphenyl.

Photosensitive resin composition, polyimide production method, and semiconductor device

A negative-type photosensitive resin composition that has a satisfactory imidization rate and can yield a resin layer with high chemical resistance, even under low-temperature curing conditions of 200&#xb0; C. or below, the negative-type photosensitive resin composition containing a photopolymerization initiator (B) in a proportion of 0.1 part by mass to 20 parts by mass with respect to 100 parts by mass of a polyimide precursor (A), the polyimide precursor (A) being a polyamic acid ester or polyamic acid salt with a specific structure, and the weight-average molecular weight (Mw) of the polyimide precursor (A) being 3,000 or greater and less than 16,000, in terms of polystyrene, according to gel permeation chromatography (GPC).

Photosensitive resin composition and method for producing cured relief pattern

A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.

Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus

A photosensitive resin composition, ensuring that after a high-temperature storage test, a void is less likely to be generated at the interface of a Cu layer in contact with a polyimide layer and a high-adhesion polyimide layer is obtained, and a polyimide using the photosensitive resin composition, can be provided. Furthermore, a semiconductor device in which after a high-temperature storage test, a void is less likely to be generated at the interface of a Cu layer in contact with a polyimide layer and short circuiting or disconnection following a high-temperature storage test is unlikely to occur. A photosensitive resin composition is characterized by including a component (A) as a photosensitive polyimide precursor, and a component (B) containing a structure represented by formula (B1). (In formula (B1), Z is a sulfur or oxygen atom, and each of Rto Rindependently represents a hydrogen atom or a monovalent organic group).

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Tokyo, Japan

Taihei Inoue