International Business Machines Corporation

Lenovo (singapore) Pte. Ltd.

Taichiroh Nomura

Yohichi Matsui

Toshiaki Fukushima

Jun Tanaka

Yohichi Miwa

Hiroyuki Takenoshita

Aya Minami

Takeshi Wagatsuma

Kenji Tsuboi

Takuji Matsushiba

Chikashi Hara

Masatake Yamamoto

Kazuyo Hayakawa

Satoru Kumai

Toshio Sakurai

Shigeru Ohshita

Takuroh Kamimura

A circuit module includes: a thermally conductive board forming a part of a housing; a circuit board disposed above the thermally conductive board; a semiconductor chip connected to a plurality of electrode pads on a upper surface of the circuit board through solder; a heat sink connected to a upper surface of the semiconductor chip; a thermally conductive member thermally connecting the thermally conductive board to the semiconductor chip; and a plurality of fasteners passing through the thickness of the circuit board in an area surrounding the semiconductor chip to attach the heat sink to the thermally conductive board.

Circuit module and manufacturing method thereof

A system for cooling interior and external housing surfaces of an electronic apparatus. The apparatus includes at least one electronic component, a heat transfer mechanism for transferring to an external surface of the apparatus heat generated by the electronic component, and a cooling mechanism for cooling the external surface of the apparatus. The cooling mechanism also includes an airflow generation device and an opening that enables airflow to simultaneously flow over at least one electronic component within the apparatus and over the external surface to dissipate the heat generated by the at least one electronic component.

System for cooling interior and external housing surfaces of an electronic apparatus

A program for a setting device for setting a memory control device which, in part, acquires memory attribute information indicating an attribute of the memory module, a data transfer rate setting value as a rate of an upper limit value of a data transfer rate relative to a maximum data transfer rate, an upper limit value of the data transfer rate being at which the memory control device accesses the memory module, and the maximum data transfer rate being at which the memory control device is able to access the memory module. The setting device can appropriately control the heating value and the upper limit temperature for each of the plurality of memory modules mutually different in type though mutually compatible.

Setting device program and method for setting a memory control

A system includes a CPU, a stor for storing a process executed for lowering the temperature of the CPU in association with a set temperature, a first temperature sensor for measuring a measurement temperature of a measurement position in the CPU, a second temperature sensor for detecting that a detection position in the CPU has reached a detection temperature, an offset calculator for calculating an offset as a difference between the detection temperature and the measurement temperature, a set temperature corrector for calculating a correction value of the set temperature stored by the temperature control information stor based on the offset, and a temperature control executor for executing the temperature control process in association with the set temperature in the case where the measurement temperature has reached the correction value of the set temperature. System specific thermal management data is stored in a nonvolatile memory for retrieval following system initialization.

Thermal management set-temperature correction for individual system

A heat sink, cooling member, semi-conductor substrate cooling system, computer and method for providing sufficient cooling performance through a heat sink is provided. In part, there is provided a heat sink having a radiating portion for diffusing the heat conducted from a heat source and a blasting fan for blasting air to a duct-like structure formed by the radiating portion. Moreover, rates of airflows in the duct-like structure are averaged so that air circulates through all portions in the duct-like structure by forming a high-wind-pressure portion and a low-wind-pressure portion having wind pressures different from each other when air is blasted by the blasting fan in the duct-like structure and using the high-wind-pressure portion as a high-density area having a high arrangement density of radiating fins compared to the low-wind-pressure portion.

Heat dissipating device and computer

Growing community of inventors

Sagamihara, Japan

Taichiroh Nomura