Sumitomo Electric Lightwave Corp.

Taichiro Nagao

William E Beasley, Jr

A method of midspan or end entry accessing of one or more selected optical fibers carried by an optical ribbon fiber. The top and bottom surfaces of a first selected span of the optical ribbon fiber are friction abraded to initiate delamination of the bond between the optical fibers and the matrix encapsulant. The delamination is completed by applying a rolling force to the circumference of the first selected span, and the delamination is then propagated by introducing the first selected span into the bore of a die element and urging the die element along a relatively longer second selected span of the optical ribbon fiber. With the delamination completed, the tip of an elongated tool is inserted through the encapsulant within the second selected span and between one or more selected optical fibers and the remaining optical fibers within the optical ribbon fiber. Next, the tip of the elongated tool is lifted from within the encapsulant so as to remove the one or more selected optical fibers from the encapsulant, and the elongated tool inserted between the encapsulant and the one or more selected optical fibers. Finally, the elongated tool is slidably urged along the length of the delaminated second selected span to lift the optical fibers out of the encapsulant for access as necessary.

Method of midspan and/or end entry to access selected optical fibers

A method of removing the encapsulant matrix from a selected span of optical ribbon fiber to provide access to one or more selected optical fibers wherein a strip of adhesive tape having a plastic card element attached to one end thereof is placed on a support surface with an adhesive surface of the strip of tape facing upwardly. A selected span of optical ribbon fiber is placed across the exposed top surface of the strip of tape and across the plastic card element. A selected amount of glue is positioned beneath the span length of the optical ribbon fiber overlaying the plastic card element so as to bond the optical ribbon fiber to a portion thereof. Next, the end of the optical ribbon fiber overlaying the plastic card element is lifted so as to initiate delamination of the encapsulant matrix from the optical fibers of the optical ribbon fiber, and the delamination caused by the tension on the glue bond is propagated by lifting the span length of the optical fiber which overlays the exposed surface of the strip of tape. Thus, the optical fibers contained within the optical ribbon fiber are removed from the encapsulant matrix by applying the delamination procedure to one or both sides of the optical ribbon fiber as may be required.

Growing community of inventors

Durham, NC, United States of America

Taichiro Nagao