Canon Kabushiki Kaisha

Taichi Yonemoto

Yoshinori Tagawa

Kenji Fujii

Hiroyuki Murayama

Junichi Kobayashi

Shuji Koyama

Keisuke Kishimoto

Hiroyuki Abo

Keiji Watanabe

Hideo Tamura

Masaki Ohsumi

Jun Yamamuro

Yoshinobu Urayama

Mitsunori Toshishige

Tadanobu Nagami

Takeshi Terada

Souta Takeuchi

Atsunori Terasaki

Kazuaki Shibata

Makoto Watanabe

Masahisa Watanabe

Takeru Yasuda

Noriyasu Ozaki

Kenta Furusawa

Masataka Kato

Keiji Matsumoto

Aya Yoshihira

Junichiro Iri

Tamaki Sato

Jun Kawai

Masaya Uyama

Isamu Horiuchi

Yoshiyuki Fukumoto

Seiichiro Yaginuma

Atsushi Teranishi

Hiroyuki Shimoyama

Hirohisa Fujita

Masamichi Yoshinari

A liquid ejection head has at least a structure including an ejection orifice forming member having an ejection orifice for ejecting a liquid and a flow path communicating with the ejection orifice and a flow path forming substrate having a liquid introduction flow path communicating with the flow path and supplying the liquid, and includes: a first titanium oxide film with a pure water contact angle of 40° or less; and a second titanium oxide film with a pure water contact angle of 70° or more, wherein the first titanium oxide film covers the structure including inner walls of the flow path and the liquid introduction flow path and is exposed in the flow path and the liquid introduction flow path, and the second titanium oxide film has a portion covering the first titanium oxide film in a vicinity of an opening end.

Liquid ejection head and method for manufacturing the same

A substrate joined body including: a first substrate; a second substrate; an organic film that comprises silicon and carbon and joins the first substrate and the second substrate; and a protective film that comprises an inorganic element and is formed over the organic film from at least a part of the surface of the first substrate and at least a part of the surface of the second substrate, wherein the protective film comprises a region in which the ratio of carbon to silicon based on atomic percentage is from 0.0 to 5.0 in a region within 50 nm in a thickness direction from a surface of the organic film on the protective film side, when the surface is measured by X-ray photoelectron spectroscopy.

Substrate joined body

A liquid ejection head has at least a structure including an ejection orifice forming member having an ejection orifice for ejecting a liquid and a flow path communicating with the ejection orifice and a flow path forming substrate having a liquid introduction flow path communicating with the flow path and supplying the liquid, and includes: a first titanium oxide film with a pure water contact angle of 40&#xb0; or less; and a second titanium oxide film with a pure water contact angle of 70&#xb0; or more, wherein the first titanium oxide film covers the structure including inner walls of the flow path and the liquid introduction flow path and is exposed in the flow path and the liquid introduction flow path, and the second titanium oxide film has a portion covering the first titanium oxide film in a vicinity of an opening end.

A substrate laminated body is formed by joining a first substrate for forming a part of a device and a second substrate for forming another part of the device. The first and second substrates are joined by a method comprising: a temporarily joining step of arranging an adhesive agent outside a device forming region and temporarily joining the device forming regions of the first substrate and the second substrate to be held in a non-contact state, and a finally joining step of forming a film so as to fill a gap between the device forming regions in the non-contact state and finally joining the first substrate and the second substrate by way of the film.

Method of manufacturing substrate laminated body, substrate for liquid ejection head and method of manufacturing substrate for liquid ejection head

Provided is a method of forming a film on a substrate including: forming a protective member on a surface of the substrate; forming an organic structure on the surface of the substrate, at a distance from the protective member; removing the protective member after the formation of the organic structure; and forming a film by CVD in a region of the surface of the substrate from which the protective member is removed.

Method of forming film on substrate and method of manufacturing liquid ejection head

Provided is a liquid ejection head substrate including: a substrate; a liquid ejection element that generates liquid ejection energy on the substrate; and an electrode pad that is electrically connected to the liquid ejection element, in which the electrode pad includes a barrier metal layer and a bonding layer on the barrier metal layer, and an end side surface of the barrier metal layer is covered with a silicon-based film containing carbon.

Liquid ejection head substrate and method for manufacturing the same

An etching method includes etching a silicon substrate with a liquid composition containing an alkaline organic compound, water, and a boron compound with a content in the range of 1% by mass to 14% by mass. The boron compound is at least one of boron sesquioxide, sodium tetraborate, metaboric acid, sodium perborate, sodium borohydride, zinc borate, and ammonium borate.

Liquid composition and etching method for etching silicon substrate

The wall of each supply path formed in a silicon substrate has such a shape that a plurality of regions distinguished from each other due to different inclinations to a first surface of the silicon substrate are connected to each other between the first surface and a second surface of the silicon substrate and the width of the supply path is maintained or expands from the first surface to second surface of the silicon substrate. An internal opening is formed by one of the regions that is most steeply inclined to the first surface of the silicon substrate. A region reducing the squeezing of an adhesive into the internal opening is placed between the internal opening and the second surface of the silicon substrate.

Liquid ejection head substrate, method of manufacturing the same, and method of processing silicon substrate

A method of manufacturing a substrate of a liquid ejection head including: forming a plurality of recesses in a silicon wafer; etching the silicon wafer with etchant to form a depression and a plurality of through holes formed from the plurality of the recesses in the depression; and manufacturing a plurality of substrates of the liquid ejection head from the silicon wafer by dividing the silicon wafer on the basis of through holes.

Forming a liquid ejection head with through holes and a depression

A method for manufacturing a liquid ejection head substrate, including: (1) a step for etching a substrate, which has an energy generating element at a side of a first surface, from a side of a second surface, which is a surface on the opposite side from the first surface, thereby to form at a time at least a part of a liquid supply port and a recess along a cutting section of the substrate; (2) a step for irradiating a laser beam toward the side of first surface from the etched surface of the recess so as to form a reformed portion inside the substrate; and (3) a step for cutting the substrate at the reformed portion.

Method for manufacturing liquid ejection head substrate

A method for manufacturing a liquid discharge includes a process of forming a plurality of blind holes extending from a first surface of the silicon substrate toward a second surface which is a surface opposite to the first surface in the silicon substrate and a process of subjecting the silicon substrate in which the plurality of blind holes are formed to anisotropic etching from the first surface to form a liquid supply port in the silicon substrate, in which, in the process of forming the liquid supply port, the silicon in a region sandwiched by the plurality of blind holes when the silicon substrate is seen from the second surface side is left without being removed by the anisotropic etching to use the left silicon as a beam.

Method for manufacturing liquid discharge head

A substrate for a liquid ejection head, including: forming a sacrifice layer on a first surface of a silicon substrate in a region in which a liquid supply port is to open, the sacrifice layer containing aluminum which is selectively etched with respect to the silicon substrate; forming an etching mask on a second surface which is a rear surface of the first surface of the silicon substrate, the etching mask having an opening corresponding to the sacrifice layer; a first etching step of etching the silicon substrate by using the etching mask as a mask and by using a first etchant containing 8 mass % or more and less than 15 mass % of tetramethylammonium hydroxide; and after the first etching step, a second etching step of removing the sacrifice layer by using a second etchant containing 15 mass % or more and 25 mass % or less of tetramethylammonium hydroxide.

Method of producing substrate for liquid ejection head

Provided is a method of producing a liquid ejection head substrate, the method including, in sequence; grinding a second surface of a silicon substrate, which is an opposite surface of a first surface on which a function element is formed, polishing the ground second surface, etching the polished second surface by reactive ion etching using ion incident energy, forming an etching mask on the second surface after the reactive ion etching, and forming a liquid supply port by subjecting the silicon substrate to wet etching using the etching mask.

Method of producing liquid ejection head

A liquid composition used to carry out crystal anisotropic etching of a silicon substrate provided with an etching mask formed of a silicon oxide film with the silicon oxide film used as a mask includes cesium hydroxide, an alkaline organic compound, and water.

Liquid composition, method of producing silicon substrate, and method of producing liquid discharge head substrate

Provided is a method of manufacturing a substrate for liquid ejection head, including: forming a groove portion by etching on one surface side of a silicon substrate, the groove portion being formed so as to surround a portion at which a liquid supply port is to be formed on an inner side of the groove portion; forming a protective layer on the one surface side of the silicon substrate, the protective layer being formed inside the groove portion and on an outer side of the groove portion; and forming the liquid supply port by subjecting the silicon substrate to crystal anisotropic etching treatment with use of the protective layer as a mask.

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Isehara, Japan

Taichi Yonemoto