Fuji Electric Co., Ltd.

Taichi Itoh

Seiichi Takahashi

Hiroaki Ichikawa

Akio Yamano

Mitsuhiro Kakefu

Takuya Yamamoto

A semiconductor device includes first and second conductive parts, a first bonding wire connecting the first and second conductive parts and having a non-flat portion between opposite ends thereof so that a portion between the opposite ends is away from the first and second conductive parts, a case having a housing space to accommodate the first and second conductive parts, including a sidewall having first to fourth lateral faces surrounding the housing space to form a rectangular shape in a plan view, and a cover disposed on the sidewall, a sealing member filling the case to seal the first bonding wire, and a first stress relaxer for relieving a stress in the first bonding wire. The first bonding wire extends from the second lateral face toward the fourth lateral face, and the first stress relaxer is positioned between the first bonding wire and the first lateral face.

Semiconductor device

A main ceramic circuit board on which a semiconductor element is arranged is separate from a sub-ceramic circuit board on which a connection terminal is arranged. Accordingly, heat generated by the semiconductor element is conducted via the main ceramic circuit board and a base plate arranged thereunder and the sub-ceramic circuit board to the connection terminal. That is to say, it is difficult to conduct heat from the semiconductor element to the connection terminal, compared with a case where the connection terminal and the semiconductor element are arranged over the same ceramic circuit board.

In a semiconductor device, the marginal edge of a resist member on the side closer to a substrate is between first and third positions on a metal base plate. The third position is directly under an outer side surface of a metal plate. The first position is outside the third position and is away from a second position on the metal base plate directly under an outer side surface of the electrical insulating board, by a distance calculated by dividing 'the height from a principal surface of the metal base plate to the front surface of the electrical insulating board' by 'the tangent of the contact angle of solder created by the marginal edge stopping solder flow'. This makes it possible to ensure sufficient insulation distances between conductive patterns and the solder and to reduce creepage distances of the conductive patterns over the electrical insulating board.

Growing community of inventors

Matsumoto, Japan

Taichi Itoh