Samsung Electronics Co., Ltd.

Tai-Hyun Eum

Heeseok Lee

Yonghoon Kim

Seung-Yong Cha

Sung-Woo Park

Keung Beum Kim

Yoonha Jung

Hyunjong Moon

Yung-Cheol Kong

Tongsuk Kim

Ji-Sun Hong

A semiconductor package may include a package substrate with a top surface and a bottom surface opposite to the top surface, the top surface of the package substrate configured to have a semiconductor chip mounted thereon, a power block and a ground block in the package substrate, the power block configured as a power pathway penetrating the package substrate, and the ground block configured as a ground pathway penetrating the package substrate, first vias extended from the power block and the ground block, and the first vias electrically connected to the semiconductor chip, second vias extended from the power block and the ground block toward the bottom surface of the package substrate, and block vias to penetrate the power block and the ground block, the block vias electrically connected to the semiconductor chip and electrically separated from the power block and the ground block.

Semiconductor package

In one embodiment, an image sensor module having an auto-aligned lens includes: a substrate on which an image sensor chip is mounted; a housing which has an opening to expose an upper surface of the image sensor chip, and which is attached onto the substrate; a lens holder which extends the opening vertically and upwardly; and a lens unit incorporating spacers which is fixed to an inner sidewall of the lens holder and is aligned automatically. Friction-caused particles are not produced, and focal alignment is readily automated.

Image sensor module having auto-aligned lens, and method of fabricating the same, and method of automatically controlling focus of lens

Growing community of inventors

Seoul, South Korea

Tai-Hyun Eum