E.i. Dupont De Nemours and Company

Henkel Ag & Company, Kgaa

Tahir Iqbal

John H Cain, Jr

Jack J Slosky

Qiwei He

Kenneth Edward Martin

Ju-Ming Hung

Michael G Harwell

Sam Louis Samuels

Wei Kong

Martin Riswick

Low application temperature thermoplastic hot melt adhesives are particularly useful as elastic attachment adhesives. The adhesives have a viscosity at 275&#xb0; F. of less than about 8,000 cp, a yield stress of less than about than 80 psi and a creep performance for a bond made through strand coating of less than about 15%. Preferred are adhesives that have a creep performance for a bond made through spiral coating of less than about 25%.

Low application temperature elastic attachment adhesive

Adhesives comprising up to about 40 wt % of an ionomer can be applied at low temperatures and exhibit good bond strength. The adhesives are particularly useful as elastic attachment adhesives.

Ionomer-containing hot melt adhesive

An alkali metal salt additive in very low concentration in spandex (e.g., 0.02-0.25%) increases the heat set efficiency of spandex. The anion of the salt is a carboxylate having 1 to 10 carbon atoms or thiocyanate.

Spandex containing certain alkali metal salts

Tris(isonitrile)copper(I) complex salts with anions selected from BF.sub.4, PF.sub.6, ClO.sub.4, I, Br, Cl and CF.sub.3 COO are useful in preparing radionuclide complexes rapidly at room temperature. Preferred isonitrile ligands are ether isonitriles. The tris(isonitrile)copper(I) adducts enable technetium complexes, such as those of Tc99m, to be prepared easily just prior to their use as imaging agents.

Process for preparing Tc-99m tris(isonitrile) copper complexes

Tris(isonitrile)copper(I) adducts for preparing radionuclide complexes

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Tahir Iqbal