Samsung Electronics Co., Ltd.

Taeyoung Jeong

Sangwoo Pae

Hwasung Rhee

Miji Lee

Yoonkyeong Jo

Seungjae Lee

Sungjun Kim

Yeunwook Lim

Jongmu Choi

SeungJae Lee

A semiconductor device includes a lower wiring, an upper wiring on the lower wiring, and a via between the lower wiring and the upper wiring. The lower wiring has a first end surface and a second end surface opposing each other, the upper wiring has a third end surface and a fourth end surface opposing each other, and the via has a first side adjacent to the second end surface of the lower wiring and a second side adjacent to the third end surface of the upper wiring. A distance between a lower end of the first side of the via and an upper end of the second end surface of the lower wiring is less than &#x2153; of a width of a top surface of the via, and a distance between an upper end of the second side of the via and an upper end of the third end surface of the upper wiring is less than &#x2153; of the width of the top surface of the via.

Semiconductor device including via and wiring

An electronic device and method are provided. The electronic device includes a communication module configured to support short-range wireless communication with an external device using a first band and a second band; a processor electrically connected to the communication module; and a memory electrically connected to the processor, wherein the memory, when executed, stores instructions to cause the processor to confirm at least one characteristic of a function and surrounding network environment information in response to a function performance request, and perform the function through one of the first band and the second band of the external device based on at least one of the characteristic of the function and the surrounding network environment information.

Electronic device and method for performing wireless communication of the same

Growing community of inventors

Hwaseong-si, South Korea

Taeyoung Jeong