Hanwha Solutions Corporation

Korea Advanced Institute of Science and Technology

Taeyoung Jang

Jaesong Kim

Yeonran Shin

Kyung-Soo Kim

Sungmin Ryoo

Yeo Jin Kim

Chang-Wan Ha

This invention relates to an aqueous flame retardant adhesive composition that is environment-friendly, reduces cost through replacement of organic flame retardant, improves layer separation of adhesive according to the addition of inorganic flame retardant, and exhibits excellent adhesive strength, low temperature stability, processability and extraction resistance, and a method for preparing the same.

Aqueous flame retardant adhesive composition and method for preparing same

This invention relates to a plasticizer composition that is environment-friendly, exhibits rapid gelling speed, thus improving processability, can give low viscosity of plastisol required for wallpaper and flooring, exhibits low heating loss, has small viscosity change over time, and has excellent migration resistance, and a vinylchloride resin composition comprising the same.

Plasticizer composition and vinylchloride resin composition comprising the same

This invention relates to an aqueous flame retardant adhesive composition that is environment-friendly, can reduce cost of production through replacement of organic flame retardant, improve layer separation of adhesive according to the addition of inorganic flame retardant, and exhibit excellent adhesive force and low temperature stability, and a method for preparing the same.

Aqueous flame retardant adhesive composition and method for preparing the same

Disclosed is an electronic component bonding method which interposes a bonding resin between first and second electronic components to bond the first and second electronic components to each other. The electronic component bonding method includes providing the bonding resin between the first and second electronic components, aligning the first and second electronic components with each other, pre-curing the bonding resin to generate elasticity in the bonding resin, performing a main curing operation to apply vibration energy to the bonding resin, which has elasticity according to pre-curing, to securely fix the first and second electronic component to each other, and control the amplitude of the vibration energy applied during the main curing operation to be restricted within an elastic region of the bonding resin.

Growing community of inventors

Daejeon, South Korea

Taeyoung Jang