Samsung Electronics Co., Ltd.

Taeyeong Kim

Hoechul Kim

Pil-Kyu Kang

Byung Lyul Park

Seokho Kim

Yangwook Kim

Myunghoon Kwak

Ho-jin Lee

Hoonjoo Na

Jihea Park

Ilyoung Han

Hyunju Hong

Kwangjin Moon

Jookwan Lee

Jin Ho An

Gilheyun Choi

Kyu-ha Lee

Jongho Oh

Daehoon Kim

Moonjeong Kim

Hyungjun Jeon

Jun Hyung Kim

Jungmin Yoon

Junhong Min

Soon Chan Kwon

Hakjun Lee

Minsoo Kim

Jinho Park

Jeonggi Jin

Wonkyu Sung

Jae-Hwa Park

Joungmin Cho

Kibeom Kim

Sanghyuk Park

Jumyong Park

Deok-Young Jung

Sunghyup Kim

Taeseong Kim

Jihoon Kang

Sukchul Bang

Jinho Chun

Yeun-Sang Park

Youngrog Kim

Yi Koan Hong

Dosun Lee

Ju-il Choi

Changhan Lee

Seongmin Son

Minsoo Han

Taeyang Song

Nohsung Kwak

SungHee Kang

Hyoju Kim

Sunghwan Park

Joo Hee Jang

Jaegeun Kim

Jaehyun Phee

Ilhyoung Lee

Jonghyuck Yoo

An electronic device is provided. The electronic device includes a housing, a first display slidable through the housing and having at least a portion exposed to the outside through the housing, wherein the area exposed to the outside, of the first display is changeable on the basis of the sliding through the housing, a second display spaced apart from the at least an exposed portion of the first display by a predetermined distance, and disposed on a plane together with the at least an exposed portion, and at least one processor disposed within the housing, wherein the at least one processor is configured to display first content on the first display and display second content on the second display.

Electronic device including plurality of displays and method of operating same

A bonding method for bonding a first substrate to a second substrate includes fixing the first substrate to a first surface of a first bonding chuck and fixing the second substrate to a second surface of a second bonding chuck, the second surface facing the first surface; aligning the second bonding chuck above the first bonding chuck in a vertical direction or in a horizontal direction; bonding the first substrate to the second substrate to make a bonded substrate; and wherein, in the bonding the first substrate to the second substrate, injecting a process gas between the first substrate and the second substrate using a process gas injector surrounding at least one selected from the first bonding chuck and the second bonding chuck in a plan view and injecting an air curtain forming gas to form an air curtain surrounding the first substrate and the second substrate using an air curtain generator are performed in combination.

Method of manufacturing semiconductor device

A substrate bonding method and apparatus are described. The substrate bonding apparatus is used to bond a first substrate to a second substrate. The bonding apparatus includes a first bonding chuck configured to hold the first substrate on a first surface of the first bonding chuck; a second bonding chuck configured to hold the second substrate on a second surface of the second bonding chuck, the second surface facing the first surface of the first bonding chuck; a seal arranged between the first bonding chuck and the second bonding chuck and adjacent to at least one edge of the first substrate and at least one edge of the second substrate; and a process gas supply device configured to supply a process gas to a bonding space surrounded by the seal.

Substrate bonding apparatus and method of manufacturing semiconductor device by using the same

An electronic device identifies an occurrence of a first event for displaying a first notification message on at least a portion of the display module of the first shape, detects a beginning of shape transformation of the display module from the first shape to the second shape, and maintains the display of the first notification message during the shape transformation of the display module.

Method and device for displaying notification message

Various embodiments of the disclosure relate to a device and method for communicating using an avatar in a virtual space. To that end, an electronic device may display a first avatar corresponding to a user of the electronic device in a virtual space, display a first graphic user interface (GUI) resource including at least one device capable of establishing connection with the electronic device and, based on receiving an input on the first GUI resource, display a device icon corresponding to the input device in a matching position of the first avatar.

Communication method and device using avatar in virtual space

An electronic device according to various embodiments may include: a housing, a flexible display having at least a partial area configured to be drawn out from the housing so that a size of a visible area of the flexible display can be changed, a sensor configured to measure a length of the flexible display, a memory, a processor operatively connected to the memory, the sensor, and the flexible display. The processor may be configured to control the electronic device to: display a first content including at least one image in a first area including a partial area of the flexible display in response to an input, measure a length of the flexible display drawn out from the housing using the sensor, based on the length of the flexible display measured using the sensor being a specified first length, determine that the electronic device is in a non-expanded state, and based on the length of the flexible display measured using the sensor being a second length longer than the first length, determine that the electronic device is in an expanded state. In addition, the processor may be configured to control the electronic device to: based on the electronic device being in an expanded state, display the first content in the first area, and display a user interface corresponding to at least one application and/or second content obtained by converting the first content into a form corresponding to a function provided by the at least one application in a second area including a partial area of the flexible display, drawn out from the housing to be visible, and transmit, in response to an input, data corresponding to the first content to a server connected to the at least one application.

Electronic device having extendable display and method for providing content thereof

A wafer bonding apparatus including a first stage having a first surface and being configured to hold a first wafer on the first surface; a second stage having a second surface and being configured to hold a second wafer on the second surface facing the first surface; a first target image sensor on an outer portion of the first stage; a second target image sensor on an outer portion of the second stage; and a target portion on the first or second stage, the target portion having a target plate fixedly installed and spaced apart from the first or second target image sensor by a predetermined distance, wherein, in an alignment measurement of the first and second stages, the first and second stages are movable so that the first and second target image sensors face each other and the target plate is between the first and second target image sensors.

Wafer to wafer bonding apparatus and wafer to wafer bonding method

A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck configured to fix the first substrate to a first surface of the first bonding chuck; a second bonding chuck configured to fix the second substrate to a second surface of the second bonding chuck, the second surface facing the first surface; a process gas injector surrounding at least one selected from the first bonding chuck and the second bonding chuck in a plan view, the process gas injector configured to inject a process gas between the first substrate and the second substrate when respectively disposed on the first bonding chuck and the second bonding chuck; and an air curtain generator disposed at an outside of the process gas injector in the plan view, the air curtain generator configured to inject an air curtain forming gas to form an air curtain surrounding the first substrate and the second substrate.

Substrate bonding apparatus

A substrate bonding apparatus includes a first bonding chuck configured to support a first substrate and a second bonding chuck configured to support a second substrate such that the second substrate faces the first substrate. The first bonding chuck includes a first base, a first deformable plate on the first base and configured to support the first substrate and configured to be deformed such that a distance between the first base and the first deformable plate is varied, and a first piezoelectric sheet on the first deformable plate and configured to be deformed in response to power applied thereto to deform the first deformable plate.

Substrate bonding apparatus and method of manufacturing semiconductor device by using the substrate bonding apparatus

A substrate bonding apparatus includes a lower chuck that receives a lower substrate and an upper chuck disposed above the lower chuck. An upper substrate is fixed to the upper chuck. The upper chuck and the lower chuck bond the upper substrate to the lower substrate. The upper chuck has an upper convex surface toward the lower chuck. The upper convex surface includes a plurality of first ridges and a plurality of first valleys disposed alternately along an azimuthal direction.

Substrate bonding apparatus and bonding method using the same

The present disclosure relates to a pre-5-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4-Generation (4G) communication system such as Long Term Evolution (LTE). The present invention relates to a method and apparatus for channel estimation in a wireless communication system. A method for operating a transmitter comprises the operations of: transmitting a first reference signal through a first antenna; and transmitting a second reference signal through a second antenna, wherein the first reference signal includes a first Golay sequence, and the second reference signal includes a second Golay sequence.

Method and apparatus for channel estimation in wireless communication system

A substrate bonding apparatus for bonding a first substrate to a second substrate includes: a first bonding chuck including: a first base; a first deformable plate provided on the first base to support the first substrate; and a first pneumatic adjustor configured to deform the first deformable plate by adjusting a first pressure in a first cavity formed between the first deformable plate and the first base; and a second bonding chuck including: a second base; a second deformable plate provided on the second base to support the second substrate; and a second pneumatic adjustor configured to deform the second deformable plate by adjusting a second pressure in a second cavity formed between the second deformable plate and the second base. The first deformable plate is deformed such that a first distance between the first base and the first deformable plate is varied based on the first pressure, and the second deformable plate is deformed such that a second distance between the second base the second deformable plate is varied based on the second pressure.

Disclosed are a substrate bonding apparatus and a method of manufacturing a semiconductor device. The substrate bonding apparatus comprises vacuum pumps, a first chuck engaged with the vacuum pumps and adsorbing a first substrate at vacuum pressure of the vacuum pumps, and a pushing unit penetrating a center of the first chuck and pushing the first substrate away from the first chuck. The first chuck comprises adsorption sectors providing different vacuum pressures in an azimuth direction to the first substrate.

Substrate bonding apparatus having adsorption sectors with different vacuum pressures and method of manufacturing semiconductor device using the same

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Suwon-si, South Korea

Taeyeong Kim