Saint-gobain Abrasives, Inc.

Saint-gobain Abrasifs

Taewook Hwang

Ramanujam Vedantham

Srinivasan Ramanath

Thomas Puthanangady

Jianhui Wu

Linda S Bateman

Eric M Schulz

Charles Dinh-Ngoc

Cecile O Mejean

Maureen A Brosnan

John S Hagan

John M Gulcius

Alexandre Temperelli

Rachana Upadhyay

Signo T Reis

J Gary Baldoni

Shivshankar Sivasubramanian

Andrew L Biro

Lisa A Johnson

An abrasive article can include a body including a bond material, abrasive particles, and a plurality of pores, wherein the bond material can comprise a vitreous material. In one embodiment, an average particle size of the abrasive particles can be between 0.1 microns to 5 microns, and a porosity of the body may be between 40 vol % to 70 vol %, wherein the porosity may define an average pore size (D50) of at least 0.1 microns and not greater than 5 microns.

Bonded abrasive article and method of making the same

An abrasive article including a body having a bond material comprising an inorganic material, abrasive particles contained within the bond materials; and pores contained within the bond material defining a porosity of at least 90 vol % and not greater than 97 vol % for a total volume of the body.

Abrasive articles and method of forming same

An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.

Abrasive tool for use as a chemical mechanical planarization pad conditioner

An abrasive tool for conditioning CMP pads includes abrasive grains coupled to a substrate through a metal bond and a coating, e.g., a fluorine-doped nanocomposite coating. The abrasive grains can be arranged in a self-avoiding random distribution. In one implementation, an abrasive tool includes a coated plate and a coated abrasive article that has two abrading surfaces. Other implementations related to a process for producing an abrasive tool that includes a coating at one or more of its surfaces. Also described are methods for dressing a CMP pad.

Corrosion-resistant CMP conditioning tools and methods for making and using same

A study of several key conditioner design parameters has been conducted. The purpose was to improve conditioner performance by considering factors such as wafer defects, pad life, and conditioner life. For this study, several key conditioner design parameters such as diamond type, diamond size, diamond shape, diamond concentration and distribution, were selected to determine their effect on CMP performance and process stability. Experimental validations were conducted. Conditioner specifications were matched to each specific CMP environment (intended application) in order to improve process stability and CMP performance particularly for emerging technology nodes. Several conditioner designs were developed and run successfully in the field. Significant planarity improvement for a 300 mm CMP process was achieved in accordance with one embodiment, and an increase of pad life and wafer polish rate was simultaneously achieved with another embodiment.

Optimized CMP conditioner design for next generation oxide/metal CMP

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Acton, MA, United States of America

Taewook Hwang