Samsung Electronics Co., Ltd.

Lg Display Co., Ltd.

Snu Rdb Foundation

Industry-University Cooperation Foundation Hanyang University

Taewhan Kim

Dongchul Choo

Jungyu Lee

Bonghyun Lee

Jungyun Choi

Hyoun Soo Park

Tak-Yung Kim

Kee Sup Kim

Kyounghwan Lim

Heechun Park

Woo Seong Chung

Chul Rim

Provided is a method of operating a magnetic memory system. The method of operating the magnetic memory system includes: preparing a plurality of magnetic memory cells; classifying the magnetic memory cells into a plurality of magnetic memory cell groups by using program current values of the magnetic memory cells; constructing a magnetic memory system by hierarchizing the magnetic memory cell groups; and primarily performing programming by selecting one magnetic memory cell group from the hierarchized magnetic memory cell groups according to an external temperature.

High-reliability magnetic memory system and method of operating the same

Provided is a manufacturing method for a substrate having a microstructure. The manufacturing method for a substrate having a microstructure comprises the steps of: forming a microstructure on the upper surface of an auxiliary substrate; coating a base solution on the microstructure; forming a base substrate covering the microstructure by heattreating the base solution; and removing the auxiliary substrate from the base substrate.

Substrate including nano/micro structure, method for manufacturing the same, method for refining nano/micro structure, method for manufacturing nano/micro structure network, and manufacturing apparatus therefor

Provided is a manufacturing method for a substrate having a microstructure. The manufacturing method for a substrate having a microstructure comprises the steps of: forming a microstructure on the upper surface of an auxiliary substrate; coating a base solution on the microstructure; forming a base substrate covering the microstructure by heat treating the base solution; and removing the auxiliary substrate from the base substrate.

Refining method for microstructure

The integrated circuit includes first and second vias, a first buffer configured to receive a signal transmitted from the first via, a second buffer configured to receive a signal transmitted from the second via, a first detour circuit configured to receive a signal transmitted through the second buffer, a second detour circuit configured to receive a signal transmitted through the first buffer, a first selector configured to selectively output one of the signal transmitted from the first via and a signal transmitted through the first detour circuit, and a second selector configured to selectively output one of the signal transmitted from the second via and a signal transmitted through the second detour circuit. Each of the first and second buffers and the first and second detour circuits transmits a signal in only one direction.

Integrated circuit having main route and detour route for signal transmission and integrated circuit package including the same

A switching device includes a first switch disposed between a power source voltage and an intermediate node, the first switch forming a current path on the basis of an input signal, a second switch disposed between the intermediate node and a ground, the second switch forming a current path on the basis of a voltage of the intermediate node, and a transmission gate receiving the input signal, the transmission gate outputting the input signal on the basis of the voltage of the intermediate node.

Switching device and semiconductor integrated circuit device including the same

Growing community of inventors

Seoul, South Korea

Taewhan Kim