Semiconductor Components Industries, LLC

Samsung Electronics Co., Ltd.

Samsung Display Co., Ltd.

Sungkyunkwan University

Fairchild Korea Semiconductor Ltd.

Hitachi-lg Data Storage Korea, Inc.

Ajou University Industry-academic Cooperation Foundation

Korea University Research and Business Foundation

Samsung Displayco., Ltd.

Oci Company Ltd.

Taesung Kim

Gwanbon Koo

BongGeun Chung

Hyunmin Cho

Hyunchang Shin

Youngbae Park

Yunjong Yeo

Seunguk Yang

Song Hee Jung

Seung-Uk Yang

Jintae Kim

Dongkyoon Han

Sanggab Kim

Jong-Kon Bae

Songhee Jung

Joungmin Cho

Youngdo Kim

Jiwoong Oh

Donghui Kim

Inki Park

Dong-Jin Park

Hyunho Seok

Hyeong U Kim

Yu-Gwang Jeong

Sang Gab Kim

Hangseok Choi

Sungsoon Im

Hyungsup Byeon

Hyun-Chul Eum

Sangcheol Moon

Young-Jong Kim

In-Ki Park

Seungbo Yoo

Soohyung Kim

Subin Bae

Jinseock Kim

Joohyun Kim

Ji-Beom Yoo

Daewon Choi

Janghwan Kim

Dong-Wook Shin

Bong-Geun Chung

Sooyoung Kim

Jihee Son

Joung-Min Cho

Jaehyun Lee

Eungchul Kim

Jung Hyun Kim

Jeong-Min Park

Jungchul An

Minwoo Lee

Dong Hun Kim

Lei Chen

Byung Hee Hong

Jongkon Bae

Kwang-Tai Kim

Byung Han Yoo

Oh H Kwon

Zhibo Tao

Jin-Tae Kim

Byung Soo So

Junho Huh

Byung-Gook Kim

Seul-Gi Kim

Mun Ja Kim

Wonhee Choe

Byongmo Moon

Sungwon Cho

Heung-Sik Shin

Changju Lee

Hyeong Keun Kim

Minsuk Uhm

Sam-jong Choi

Bonggeun Chung

Yongman Lee

Jin Hong Jeong

Bokwang Song

Byunghak Ahn

Keunsik Lee

Heungsik Shin

Gyusang Cho

Sooyong Kim

Jaeboong Choi

Yeonsook Kim

Munja Kim

Kyoochul Cho

GwanBon Koo

Hunhee Lee

Joonyoung Choi

Hwanchul Jeon

Donghye Cho

Youngjin Hong

SeokHyun Lee

Buyeon Lee

YoonJoo You

Hwan Chul Jeon

Heesung Kim

Atul Kulkarni

Tae-Hyoung Koo

Seokjun Hong

A display panel according to an embodiment includes a substrate, a thin film transistor disposed on the substrate, and a light emitting element electrically connected to the thin film transistor. The substrate includes a first resin layer, a first barrier layer disposed on the first resin layer, a second resin layer including a lower portion disposed on the first barrier layer and an upper portion having a carbon content less than a carbon content of the lower portion, and a second barrier layer disposed on the second resin layer.

Display panel including substrate including resin layer having upper surface modified by a plasma treatment

A method of manufacturing a mask, includes forming an organic material layer on a mask substrate and patterning a hard mask on the organic material layer, etching the organic material layer to form a mask sheet including through holes, removing the hard mask on the mask sheet, forming a conductive material layer on the mask sheet, and etching the conductive material layer to form a conductive layer.

Method of manufacturing mask, mask manufactured by the same, and method of manufacturing display apparatus by using the same

A display apparatus includes: an insulating layer; and a conductive pattern arranged on the insulating layer and including a first layer and a second layer, where the first layer includes at least one selected from indium (In), stannum (Sn) and oxygen (O), the second layer includes silver (Ag), and a lateral surface of the conductive pattern defining an edge portion of the conductive pattern includes silver chloride (AgCl).

Display apparatus and method of manufacturing the same

A display apparatus includes: a substrate; a first semiconductor layer disposed over the substrate; a first insulating layer disposed on the first semiconductor layer; a second insulating layer disposed on the first insulating layer; a first oxide material layer disposed between the substrate and the second insulating layer; and a first conductive layer disposed on the second insulating layer and electrically connected to the first semiconductor layer through a first contact hole defined in the first insulating layer, the second insulating layer, and the first oxide material layer.

An electronic device includes a display panel, a biometric information sensing layer disposed under the display panel and including a sensor, and an optical pattern layer disposed between the display panel and the biometric information sensing layer and including a plurality of transmissive portions and a light blocking portion. The light blocking portion includes a light blocking layer disposed on the biometric information sensing layer, an intermediate layer disposed on the light blocking layer, and a metal layer disposed on the intermediate layer.

Electronic device and method of manufacturing the same

The present disclosure relates to a communication method and system for converging a 4th-Generation (4G) or 5th-Generation (5G) communication system for supporting higher data rates beyond the 4G system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on 5G communication technology and IoT-related technology. A method of a central unit-control plane (CU-CP) included in a secondary node (or secondary gNB (SgNB)) in a wireless communication system supporting evolved universal terrestrial radio access and new radio dual connectivity includes receiving, from a master node (or master eNB (MeNB)), a first message requesting the SgNB to allocate a radio resource for a bearer, and transmitting a second message, including indication information indicating whether a packet data convergence protocol version of the bearer has been changed, to the CU-UP included in the SgNB. The indication information is generated based on the first message.

Method and apparatus for performing dual connectivity in heterogeneous network

A carrier film for performing a semiconductor package process on a mother substrate including a multi-layer circuit, a mother substrate, and a method of manufacturing a semiconductor package, the carrier film including a base material layer having a predetermined stiffness; and an adhesive layer configured to attach the base material layer onto the mother substrate, the adhesive layer including a water soluble material, wherein the carrier film includes a plurality of openings passing therethrough from a top surface to a bottom surface thereof.

Carrier film disposed on a mother substrate and method of manufacturing a semiconductor package

An embodiment of a display device includes a substrate including a display area; an organic layer and having a protrusion protruding in a thickness direction of the substrate and overlapping the display area; a first electrode on the organic layer and overlapping the display area; a pixel defining layer covering the protrusion and an edge of the first electrode and having an opening portion overlapping the first electrode; an emission layer on the first electrode and overlapping the opening portion; and a second electrode on the emission layer, wherein the pixel defining layer includes an inorganic material, and a first distance from an upper surface of the substrate to a lower surface of the first electrode is less than a second distance from the upper surface of the substrate to an upper surface of the protrusion, the lower surface of the first electrode facing the upper surface of the substrate.

Display device and method of manufacturing the display device

The present disclosure relates to a method of producing octahedral transition metal dichalcogenides, including forming a transition metal layer on a substrate and injecting a chalcogenide-containing gas onto the substrate, on which the transition metal layer has been formed, together with a plasma treatment.

Method for producing octahedron transition metal dichalcogenides using plasma

A display driving circuit for receiving image data from a host and driving a display panel, the display driving circuit including: an interface configured to receive the image data from the host; and a timing controller configured to control a first interrupt signal for waking up the host in a low-power mode and to control a second interrupt signal based on a light emission control signal, wherein the light emission control signal is for controlling a light emission time of a pixel included in the display panel, and wherein the timing controller is further configured to control a level of the second interrupt signal based on whether the image data has started to be received from the host in response to the first interrupt signal and the second interrupt signal.

Display driving circuit, a host, a display system including the display driving circuit and the host, and an operation method of the display system

A video decoding apparatus includes a first buffer storing input data received from an entropy decoder, a first motion compensation processor extracting motion compensation reference data based on the input data, and store the motion compensation reference data in a pixel cache, a second buffer, and a controller. The input data comprises one of first data including motion information and second data including intra prediction information. The controller controls the second buffer to store the motion compensation reference data stored in the pixel cache when the input data is the first data, and controls the second buffer to store the second data stored in the first buffer when the input data is the second data.

Video decoding apparatus and video decoding method

The present invention relates to a method for separating and collecting single aggregates from fumed silica, and a method for classifying a shape of the collected single aggregates, and more specifically, includes preparing a slurry in which fumed silica is dispersed in water; aerosolizing the slurry; and collecting single aggregates of the finned silica in the aerosol using the electric field.

Method for separating and collecting single aggregate from fumed silica and method for classifying shape of single aggregate

A chemical mechanical polishing (CMP) apparatus and a CMP pad, the apparatus including a rotating plate; a CMP pad on an upper surface of the rotating plate; a rotating body facing the rotating plate and bringing a wafer into contact with the CMP pad to press the wafer; and a slurry supply configured to supply slurry to the CMP pad, wherein the CMP pad includes a pad body having a circular plate shape; a plurality of circular grooves on a bottom surface of the pad body, the plurality of circular grooves having a circular shape; and a connection groove connecting the plurality of circular grooves, the connection groove having a linear shape.

Chemical mechanical polishing pad and chemical mechanical polishing apparatus including the same

Carrier film, mother substrate, and method of manufacturing semiconductor package by using the carrier film and the mother substrate

Growing community of inventors

Suwon-si, South Korea

Taesung Kim