Lg Electronics Inc.

Lg Display Co., Ltd.

Taesu Oh

Joonkwon Moon

Sungjin Park

Hwankuk Yuh

Bongseok Choi

The embodiment relates to a semiconductor light emitting device package and a display device including the same. Semiconductor light emitting device package according to an embodiment can comprises a light emitting structureincluding a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer; a first electrodeand a second electrodeelectrically connected to the first conductivity type semiconductor layerand the second conductivity type semiconductor layerof the light emitting structure, respectively; an interlayer insulating layer disposed on the side of the light emitting structureand an adhesive layerdisposed on the light emitting structure The first electrodecan include a first reflective electrodeand a first pad electrode, the second electrodealso can include a second reflective electrodeand a second pad electrode, and a cross-sectional shape of the first reflective electrodeand the second reflective electrodecan comprise a cup shape.

Semiconductor light-emitting device package and display device comprising same

A growth substrate including micro-light emitting diode (LED) chips and a method of manufacturing a light emitting diode display using the growth substrate are disclosed. The growth substrate includes LED chips. The LED chips are divided into n groups each including p LED chips, where each of the n and p is an integer equal to or greater than 2. At least two of the n groups are adjacent to each other. Each of the n includes a first LED chip having a directionality toward a first direction and a second LED chip having a directionality toward a second direction different from the first direction.

Growing community of inventors

Paju-si, South Korea

Taesu Oh