Qualcomm Incorporated

Taesik Yang

Mohammad Ali Tassoudji

Jeongil Jay Kim

Jorge Fabrega Sanchez

Kevin Hsi-Huai Wang

Darryl Sheldon Jessie

Seong Heon Jeong

Kevin Hsi Huai Wang

Gurkanwal Singh Sahota

Rajneesh Kumar

Jaehyun Yeon

Suhyung Hwang

Thomas Myers

Neil Burns

Julio Zegarra

Clinton James Wilber

Jeong Il Kim

Jordan Szabo

Assaf Aviv

Chin-Kwan Kim

Alireza Mohammadian

Alberto Cicalini

Kun Fang

Hong-Ming Lee

Mahmoud Niroo Jazi

Jeong Il Jay Kim

An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.

Antenna and device configurations

Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methods. The antenna module includes a radio-frequency (RF) IC (RFIC) package that includes one or more RFICs for supporting RF communications and a package substrate that includes one or more metallization layers with formed metal interconnects for routing of signals between the RFICs and an antenna(s) in the package substrate. The package substrate includes one or more patch antennas that are planar-shaped and vertically integrated in a plurality of metallization layers in the package substrate, behaving electromagnetically as a patch antenna. In this manner, the patch antenna(s) can be formed as a vertically-integrated structure in the package substrate with fabrication methods used for fabricating metal interconnects and vias (e.g., a micro via fabrication process) in package substrates.

Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methods

An antenna system includes: a patch antenna element disposed at a first level of the antenna system; an energy coupler configured and coupled to the patch antenna element to transfer energy between the patch antenna element and a front-end circuit; a ground conductor disposed at a second level of the antenna system, the patch antenna element and the ground conductor being disposed a separation distance away from each other and bounding respective sides of a volume defined by a projection, normal to a surface of the patch antenna element, of the patch antenna element to the ground conductor; and a floating conductor that is displaced from the ground conductor and the patch antenna element, the floating conductor comprising a body extending over a portion of the separation distance outside of, and in close proximity to, the volume.

Antenna system with floating conductor

Methods, systems, and devices for wireless communication are described. According to one or more aspects, the described apparatus includes one or more stacks of patch radiators (such as patch antennas) comprising at least a first patch radiator and a second patch radiator. The first patch radiator is associated with a low-band frequency; the second patch radiator is associated with a high-band frequency. The first patch radiator and the second patch radiator may overlap a ground plane, which may be asymmetric. Some or all patch radiators in a stack may be rotated relative to the ground plane, such that some or all edge of a patch radiator may be nonparallel with one or more edges of the ground plane. Further, each patch radiator stack may include separate feeds for each of at least two frequencies and two polarizations, and thus at least four feeds (one for each frequency/polarization combination) in total.

Patch antenna array

An antenna is described. The antenna includes a first plurality of first elements. Each of the first elements is dual polarized and configured to support a first set of bands and a second set of bands that is mutually exclusive from the first set of bands. The antenna also includes a second plurality of second elements. Each of the second elements is dual polarized and configured to support the second set of bands. The second plurality of second elements is interleaved with the first plurality of first elements.

Multiband antennas

An antenna assembly includes an array of patch antennas arranged above a rectangular ground plane. The patch antennas are arranged in a sequence beginning at a first end of the rectangular ground plane and continuing across a width of the rectangular ground plane to a second end. With regard to this sequence, a plurality of polarization feeds alternate between being adjacent a first corner to being adjacent a second corner of the patch antennas and/or a plurality of via walls alternate in orientation along portions of a first edge of the rectangular ground plane and along portions of a second edge of the rectangular ground plane.

Patch antenna array with improved radiation efficiency

A multi-core broadband printed circuit board (PCB) antenna and methods for fabricating such an antenna are provided. One example antenna implemented with a multi-core PCB generally includes a first core structure, a second core structure disposed above the first core structure, and one or more metal layers disposed above the second core structure or below the first core structure. The first core structure includes a first core layer, a first metal layer disposed below the first core layer, and a second metal layer disposed above the first core layer. The second core structure includes a second core layer, a third metal layer disposed below the second core layer, and a fourth metal layer disposed above the second core layer. The first core layer and the second core layer may have different thicknesses.

Multi-core broadband PCB antenna

Techniques are provided for improving the performance of a multi-band antenna in a wireless device. An example wireless device includes at least one radio frequency integrated circuit, and at least one patch antenna operably coupled to the at least one radio frequency integrated circuit, including a first patch operably coupled to the at least one radio frequency integrated circuit, a ground plane disposed below the first patch, and a plurality of via wall structures disposed around the first patch, wherein each of the plurality of via wall structures is electrically coupled to the ground plane.

Discrete antenna module with via wall structure

An electronic device includes a first antenna, a second antenna, and a device cover. The first antenna may be configured to transmit or receive signals at a first frequency, and the second antenna may be configured to transmit or receive signals at a second frequency. The device cover may be configured to enclose at least a portion of the device, the and may have a first thickness in a first area and a second thickness in a second area. The first area may be substantially aligned with a boresight of the first antenna, and the second area may be substantially aligned with a boresight of the second antenna. The first thickness may be different than the second thickness.

Antenna module configurations

Methods, systems, and devices for wireless communications are described. An antenna structure for wideband coverage may include a first bowtie antenna disposed in a first plane. The first bowtie antenna may be, for example, an elliptical bowtie antenna or a triangular bowtie antenna. The antenna structure may also include a plurality of additional bowtie antennas, each of the plurality of additional bowtie antennas disposed in a different plane parallel to the first plane. The first bowtie antenna and the plurality of additional bowtie antennas may be stacked in a first direction perpendicular to the first plane to form a bowtie antenna stack. The antenna structure may include a plurality of bowtie antenna stacks. The antenna structure may also include a staggered conductive wall.

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San Diego, CA, United States of America

Taesik Yang