Intel Corporation

Ford Global Technolgoies, LLC

Taesha Diggs Beasley

Johanna M Swan

Shawna M Liff

Feras Eid

Sasha N Oster

Nader N Abazarnia

Tannaz Harirchian

Michael Stephens Martin

An embodiment includes an apparatus comprising: a semiconductor die; package molding that is molded onto and conformal with a first die surface of the semiconductor die and at least two sidewalls of the semiconductor die, the package molding including: (a)(i) a first surface contacting the semiconductor die, (a)(ii) a second surface opposite the first surface, and (a)(iii) an aperture that extends from the first surface to the second surface; and a polymer substantially filling the aperture; wherein the package molding includes a first thermal conductivity (watts per meter kelvin (W/(m&#xb7;K)) and the polymer includes a second thermal conductivity that is greater than the first thermal conductivity. Other embodiments are described herein.

Thermal management of molded packages

A method and system are provided for generating vehicle alignment reports. Preferred aspects of the present invention comprise receiving at a computer a plurality of alignment characteristics in an electronic format directly from a vehicle alignment auditing machine, receiving at the computer alignment session information, and outputting the alignment characteristics and alignment session information via computer network to a central alignment data repository remote from the computer. An additional aspect of the present invention comprises downloading historical vehicle alignment characteristics, historical alignment session information and predefined alignment specification information via computer network from the central alignment data repository and generating at least one historical alignment report based on the downloaded data.

System and method for generating vehicle alignment reports

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Chandler, AZ, United States of America

Taesha Diggs Beasley