Samsung Electronics Co., Ltd.

Taekwan Cha

Yongwon Cho

An electronic device according to an embodiment of the disclosure may be configured to include a housing including a conductive plate and a non-conductive plate, a reinforcing member disposed at a first part inside the housing and including a groove of a predetermined length, a printed circuit board disposed at a second part different from the first part inside the housing, an antenna module disposed at one surface of the reinforcing member and including a ground layer at the rear surface thereof, and a signal connection member configured to electrically connect the printed circuit board and the antenna module, wherein a part of the signal connection member extends through the groove and is electrically connected to a first area of the ground layer in the groove by using a solder. Other various embodiments are possible.

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Gyeonggi-do, South Korea

Taekwan Cha