Samsung Electronics Co., Ltd.

Taeil Cho

Younghoon Kim

Sungil Cho

Jongwoo Sun

Yongwoo Lee

Dowon Kim

Jaeyong Park

Kyohyeok Kim

Myunggeun Song

Youngjin Noh

Yunhwan Kim

Akira Koshiishi

Masato Horiguchi

Sarah Kim

Changyul Kim

An inspection method includes extracting a first similarity by comparing first data of a first optical signal with reference data of a reference optical signal, generating a first normal distribution of the first similarity, extracting a second similarity by comparing second data of a second optical signal with the reference data of the reference optical signal, generating a second normal distribution of the second similarity, and comparing the first normal distribution with the second normal distribution. The extracting of the first similarity includes deriving the first data of the first optical signal.

Inspection method, substrate processing method including the same, and substrate processing device using the substrate processing method

A plasma processing apparatus includes a chamber, a lower and upper electrodes vertically spaced apart from each other in the chamber, a RF transmitting part connected to the lower electrode and configured to supply RF power to the lower electrode, a ground plate spaced downwardly from the lower electrode, and an insulating member laterally surrounding a cavity formed between the lower electrode and the ground plate. The cavity is isolated from a region under the ground plate by the ground plate.

Plasma processing apparatus and method of manufacturing semiconductor device using the same

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Daejeon, South Korea

Taeil Cho