Skhynix Inc.

Omnivision Technologies, Inc.

Taiwan Semiconductor Manufacturing Comp. Ltd.

Taehyung Jung

Hoon Ryu

Jongsik Na

Zheng Yang

Kuoyuan Hsu

Young Suk Kim

Qing Qin

Kwanweon Kim

Sunny Ng

Chia-Ming Chen

Jong-sik Na

Hyunsu Yoon

BokMoon Kang

KeeSoo Kim

Douk Hyoun Ryu

An image sensor has an array of pixels configured in multiple blocks; each block coupled to a separate analog-to-digital converter (ADC) to provide digitized image data. The ADCs feed digitized images into an image RAM; and the image RAM feeds digitized images to an alignment buffer in a first pixel order. The alignment buffer provides digitized images to an image processor in a second pixel order different from the first pixel order. In an embodiment, the alignment buffer uses a multiport RAM. In another embodiment, the alignment buffer uses first and second alignment buffer RAMs, writing one alignment buffer RAM while reading the other alignment buffer RAM to provide image data to the image processor. In embodiments, the alignment buffer provides digitized images in an order selectable between a full resolution and a reduced resolution order, and selectable between a right-to-left and left-to-right order.

Configurable interface alignment buffer between DRAM and logic unit for multiple-wafer image sensors

A multiple IC, buffered, image sensor has a first IC with pixels, selection transistors, and interconnect coupling selected pixels with first inter-die bond pads that convey image data to a second IC having logic and ADCs. The ADCs having inputs coupled to selected pixels and outputting through-silicon vias and inter-die bond pads to a third IC coupled to buffer raw image data in DRAM. A method includes capturing images with array pixel IC divided into sub-arrays each coupled to a separate, associated, ADC through inter-die bonds, scanning the sub-arrays and converting the image data to digital image data; and transferring the digital image data over inter-die bonds into buffers in DRAM.

Image sensor having separate, stacked, pixel array, DRAM, and logic/analog-digital converter integrated circuit die

Multiport memory architecture is disclosed herein. An example memory includes an input port, a memory array, and an output port. The input port is coupled to receive data blocks and includes first and second buffers coupled to temporarily store alternate data blocks, and the output port is coupled to provide data blocks from the memory array. The memory array is partitioned into first and second partitions, with the first partition coupled to receive data blocks from the first buffer and the second partition coupled to receive data blocks from the second buffer, and the input port and the memory array are coupled to receive control signals to simultaneously receive a first data block at the first buffer, transfer a second data block from the second buffer to a first address in the second partition, and provide a third data block stored at a third address of the first partition.

Multiport memory architecture for simultaneous transfer

Apparatuses and methods for parity generations in error-correcting code (ECC) memory to reduce chip areas and test time in imaging system are disclosed herein. Memory tests are needed to catch hard failures and soft errors. Random and nondestructive errors are soft errors and are undesirable. Soft errors can be detected and corrected by the disclosed ECC which is based on Hamming code. Before data are written into memory, the first parity generator based on the disclosed ECC generates the first parity by calculating the data. The first parity and data are stored into the ECC memory as a composite word. When the previously stored word is fetched from the ECC memory, the second parity generator based on the disclosed ECC is used to generate the second parity. A comparison between the first and second parity leads to a disclosed error mask, which is used to correct a single bit error if the error only happens to a single bit of the fetched data. A minimum distance of three in the disclosed ECC is maintained to make certain that a single bit is corrected on the read data to retrieve the originally stored memory data.

Memory with pattern oriented error correction code

A dynamic random-access memory (DRAM) for use with a display includes a plurality of capacitive elements coupled to store one or more bits of data, and a plurality of switches where at least one individual switch in the plurality of switches is coupled to an individual capacitive element in the plurality of capacitive elements. A plurality of input/output (I/O) bit lines including 32 or more input/output bit lines is coupled to read out the data from the plurality of capacitive elements. A plurality of column select lines is coupled to enable readout of the plurality of capacitive elements.

DRAM core architecture with wide I/Os

A semiconductor device includes a non-volatile memory unit, a data line configured to transfer data sequentially outputted from the non-volatile memory unit, and a shift register unit configured to include a plurality of registers that shift and store the data transferred through the data line in synchronization with a clock. The semiconductor device includes a non-volatile memory unit having an e-fuse array, and transfers the data stored in an e-fuse array to other constituent elements of the semiconductor device that use the data of the e-fuse array in order to have the data stored in the e-fuse array, including diverse setup information and repair information.

Semiconductor device and semiconductor memory device

A semiconductor memory includes a plurality of memory blocks each comprising a plurality of memory cells, and a plurality of charge pumps each located near one of the plurality of memory blocks. In an access to the semiconductor memory, depending on the selected memory block, a subset or all of the plurality of charge pumps are activated in one of a predetermined number of sequences.

Oscillator circuit with location-based charge pump enable and semiconductor memory including the same

A semiconductor memory includes a memory array having memory cells coupled to wordlines and bitlines. Each wordline has a left end and an opposing right end. A first wordline in every two adjacent wordlines has its left end connected to a left row driver and its right end connected to a right clamp circuit, and a second wordline in every two adjacent wordlines has its right end connected to a right row driver and its left end connected to a left clamp circuit, such that when the right clamp circuits are activated, the right clamp circuits clamp the corresponding wordline ends to a predetermined potential, and when the left clamp circuits are activated, the left clamp circuits clamp the corresponding wordline ends to the predetermined potential.

Wordline coupling reduction technique

A semiconductor memory includes a circuit block that is configured to receive a test mode command, a first sense amplifier that is coupled to sense and amplify a state of a first memory cell when enabled, and a second sense amplifier that is coupled to sense and amplify a state of a second memory cell when enabled. In an active cycle, the circuit block generates one or more control signals in response to the test mode command that cause the second sense amplifier to be enabled a predetermined amount of time after the first sense amplifier is enabled.

Storage cell bridge screen technique

A semiconductor memory device selecting a half page based on a particular bit of a row address includes: an input unit for receiving the particular bit; a control signal generation unit for outputting a mode control signal in response to a signal related to a mode for selecting a whole page; first and second mode control units for transferring first and second output signals of the input unit corresponding to the particular bit and its inverse signal; a row precharge pulse generation unit for generating a row precharge pulse enabled in an initial period of a precharge duration; a first driving unit for pull-up/pull-down driving an output terminal corresponding to a first pre-decoding signal; a second driving unit for pull-up/pull-down driving an output terminal corresponding to a second pre-decoding signal; and first and second latch units for latching output signals of the first and second driving units.

Semiconductor memory device

A memory circuit includes at least one memory cell for storing a charge representative of a datum. The memory cell is coupled with a word line and a first bit line. At least one bit line equalization transistor is coupled between the first bit line and a second bit line. A bit line equalization circuit is coupled with the bit line equalization transistor. The bit line equalization circuit is configured for providing a pulse to the bit line equalization transistor to substantially equalize voltages of the first bit line and the second bit line during a standby period before an access cycle of the memory cell.

Memory circuits, systems, and methods for providing bit line equalization voltages

Circuit and method for a gate control output circuit having reduced voltage stress on the devices is disclosed. In a circuit of MOS transistors for supplying an output to control a transfer gate, the output having a high voltage level that exceeds a supply voltage, first and second clamping circuits are provided. The first clamping circuit ensures a voltage between the gate and the source/drain and drain/source of a PMOS transistor that couples a pumped voltage to the output does not exceed a predetermined voltage. The second clamping circuit ensures that the voltage between the gate of an NMOS transistor and the output which is coupled to the drain/source of the NMOS transistor does not exceed a predetermined amount. The clamping circuits prevent gate stress problems on the transistors by ensuring the voltages between the gates and the source/drain and drain/source terminals do not exceed predetermined voltages.

Growing community of inventors

Santa Clara, CA, United States of America

Taehyung Jung