Samsung Electronics Co., Ltd.

Taehyoung Lee

Dongwoo Lee

Myungjun Lee

Gaurav Kumar

Shashank Shrikant Agashe

Byeongsang Kim

Young Hyun Yoon

Jaemoo Choi

Wooram Kim

Kyungwon Yun

Yunje Cho

Jongmin Song

Lakshmi Narayana Pedapudi

Hohyun Lee

Sung Chai Kim

Sangil Im

Priya Ranjan Sinha

Subong Shon

Yeny Yim

Keonho Lee

Namyoung Cho

Avadhut Dipakrao Chaudhari

A scanning electron microscope (SEM) device includes: an electron beam source configured to emit an electron beam; a lens unit disposed between the electron beam source and a stage configured to seat an object including structures having a pattern is seated, and including a scanning coil, the scanning coil configured to generate an electromagnetic field to provide a lens, and an astigmatism adjuster; and a control unit. The control unit is configured to change a working distance between the lens unit and the object to obtain a plurality of original images, obtain a pattern image, in which the structures appear, and a plurality of kernel images, in which a distribution of the electron beam on the object appears, from the plurality of original images, and control the astigmatism adjuster to adjust the focus and the astigmatism of the lens unit using feature values extracted from the plurality of kernel images.

Scanning electron microscope device, semiconductor manufacturing device, and method of controlling semiconductor manufacturing device

A teaching apparatus includes a chamber; an electrostatic chuck in the chamber, the electrostatic chuck including a sidewall surrounding a loading area; an aligner configured to be loaded onto the loading area of the electrostatic chuck; a vision sensor configured to obtain measurement data by measuring separation distances of separation regions between the aligner and the sidewall of the electrostatic chuck and to transmit the measurement data; a transfer robot configured to load the aligner onto a reference position of the loading area and to position the vision sensor above the electrostatic chuck; and controller configured to reset the reference position and to equalize the separation distances based on the measurement data transmitted from the vision sensor.

Teaching apparatus and substrate alignment apparatus using the same

Provided is a method for virtually executing an operation of an energy dispersive x-ray spectrometry (EDS) system in real time production line by analyzing a defect included in a material undergoing inspection based on computer vision, the method including receiving a scanning electron microscope (SEM) image of the material including the defect, extracting an image-feature from the SEM image of the material, classifying the extracted image-feature under a predetermined label, predicting, based on the classified image-feature, an element associated with the defect included in the material and a shape of the predicted element, and grading the defect included in the material based on comparing the predicted element with a predetermined criteria.

Method and system for virtually executing an operation of an energy dispersive X-ray spectrometry (EDS) system in real-time production line

A method of inspecting a semiconductor processing chamber includes providing a vision sensor into the semiconductor processing chamber, aligning the vision sensor on a target in the semiconductor processing chamber, obtaining an object image of the target using an image scanning module of the vision sensor, generating a three dimensional model of the target based on the object image, and obtaining a physical quantity of the target from the three dimensional model. The obtaining of the object image of the target includes projecting a pattern onto the target using an illuminator of the image scanning module, and scanning an image of the target in which the pattern is projected, using a camera of the image scanning module.

Method of inspecting a semiconductor processing chamber using a vision sensor, and method for manufacturing a semiconductor device using the same

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Suwon-si, South Korea

Taehyoung Lee