Samsung Electronics Co., Ltd.

Sungkyunkwan University

Taehyeong Kim

Hyeongmun Kang

Joonah Park

Seungduk Baek

Jungmin Ko

Young Lyong Kim

Yunpyo Hong

Geol Nam

Jaeha Lee

Hyeonjin Shin

Jaesung Lee

Sangwoo Kim

Kyung-Eun Byun

Miyoung Kim

Yohan Lee

Minsu Seol

Dongkyoon Han

Jongkon Bae

Jiyong Kim

Jinhyun Kim

Byungduk Yang

Hanyuool Kim

Jungbae Bae

Seungkyu Choi

Jaehwan Jung

Minseok Shin

Hyeonjun Song

Insup Shin

Jaeyong Ju

Changseob Kim

Hyunjung Nam

Woodong Lee

Hyelim Park

Hwanyoung Choi

Jaebum Park

Dongki Choi

Youngwoo Lim

Pin Zhao

A semiconductor package includes a base structure, a lower semiconductor chip disposed on the base structure, an upper semiconductor chip disposed on the lower semiconductor chip, a connecting structure including a lower pad disposed on the lower semiconductor chip, an upper pad disposed under the upper semiconductor chip, and a connecting bump disposed between the lower pad and the upper pad, a dummy chip disposed on the upper semiconductor chip, an upper adhesive layer including an upper adhesive portion disposed between the upper semiconductor chip and the dummy chip, and an upper protrusion portion disposed at opposite sides of the upper adhesive portion, to surround lower portions of opposite side surfaces of the dummy chip, and a molding layer disposed at opposite sides of the dummy chip, to surround upper portions of the opposite side surfaces of the dummy chip and the upper protrusion portion.

Semiconductor package including a dummy chip

An electronic apparatus includes a camera, a driver, a display, and at least one processor operatively connected to the camera, the driver, and the display. The processor is configured to control the camera to capture an image, identify a user posture included in the captured image, identify at least one parameter among a plurality of parameters related to a user based on the user posture, and control the driver to change a position of the electronic apparatus based on the at least one parameter, and change a posture of the display.

Electronic apparatus for providing screen in posture optimized for user and control method thereof

A semiconductor package includes a base chip; semiconductor chips stacked on the base chip; bumps, a lowermost bump of the bumps disposed between the base chip and a lowermost semiconductor chip of the semiconductor chips, and each of the bumps except the lowermost bump respectively disposed between the semiconductor chips; organic material layers, a lowermost organic material layer of the organic material layers disposed between the base chip and the lowermost semiconductor chip, and each of organic material layers except the lowermost organic material layer respectively disposed between the plurality of semiconductor chips; underfill layers respectively surrounding the plurality of bumps, the underfill layers extending between the base chip and the lowermost semiconductor chip and between the semiconductor chips; and an encapsulant covering the base chip, the semiconductor chips, and the underfill layers.

Semiconductor package including a plurality of semiconductor chips

A method of forming a material film includes providing a non-photosensitive mask on a substrate to expose a partial region of the substrate, forming a material film on the partial region of the substrate using a sputtering process, removing the non-photosensitive mask, and heat-treating the substrate and the material film from which the non-photosensitive mask is removed under a first gas atmosphere. The material film includes a transition metal and a chalcogen element. The sputtering process may include an RF magnetron sputtering process. The heat treatment may be performed at a higher temperature than a temperature of the forming the material film.

Method of forming material layer

Disclosed is a semiconductor package comprising a first semiconductor chip and at least one second semiconductor chip on the first semiconductor chip. The second semiconductor chip includes first and second test bumps that are adjacent to an edge of the second semiconductor chip and are on a bottom surface of the second semiconductor chip. The first and second test bumps are adjacent to each other. The second semiconductor chip also includes a plurality of data bumps that are adjacent to a center of the second semiconductor chip and are on the bottom surface of the second semiconductor chip. A first interval between the second test bump and one of the data bumps is greater than a second interval between the first test bump and the second test bump. The one of the data bumps is most adjacent to the second test bump.

Semiconductor package including test bumps

An electronic apparatus is provided. The electronic apparatus includes a camera, a Light Detection And Ranging (LiDAR) sensor, and a processor configured to track an object based on a plurality of images photographed by the camera sequentially, wherein, to track the object based on the plurality of images, the processor is configured to, based on the object being identified in a first image from among a plurality of images and subsequently, not being identified in a second image after the first image, control a photographing direction of the camera based on scanning information obtained by the LiDAR sensor.

Electronic apparatus and controlling method thereof

An electronic device with a rollable display may include the operations of: obtaining global burn-in information and local burn-in information according to a designated sampling period; on the basis of the result of analyzing the global burn-in information, predicting whether burn-in will at least partially occur in the entire area of a display area; when burn-in is predicted to at least partially occur in a boundary area, generating a first compensation map including pieces of local compensation data calculated to correspond to m block areas of the boundary area, respectively; when burn-in is predicted to at least partially occur in an area remaining after excluding the boundary area from the entire area, generating a second compensation map including pieces of global compensation data calculated to correspond to n block areas of the entire area, respectively; and controlling the rollable display to display image data compensated on the basis of the first compensation map or the second compensation map.

Electronic device and method for predicting and compensating for burn-in of display

A semiconductor package includes a substrate, a plurality of semiconductor devices stacked on the substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the substrate and the plurality of semiconductor devices, and molding resin surrounding the plurality of semiconductor devices. At least one of the underfill fillets is exposed from side surfaces of the molding resin.

Semiconductor package and method of manufacturing the same

Disclosed are semiconductor packages and methods of manufacturing the same. The method of manufacturing a semiconductor package may include providing a carrier substrate having a trench formed on a first top surface of the carrier substrate, providing a first semiconductor chip on the carrier substrate, mounting at least one second semiconductor chip on a second top surface of the first semiconductor chip, coating a mold member to surround a first lateral surface of the first semiconductor chip and a second lateral surface of the at least one second semiconductor chip, and curing the mold member to form a mold layer. The trench may be provided along a first edge of the first semiconductor chip. The mold member may cover a second edge of a bottom surface the first semiconductor chip.

Semiconductor package including mold layer having curved cross-section shape

An electronic apparatus is provided. The electronic apparatus includes a camera; a memory configured to store at least one instruction; and at least one processor configured to execute the at least one instruction to: detect at least one object included in an image captured by the camera; identify information on an engagement of each of the at least one object with the electronic apparatus; obtain gesture information of each of the at least one object; obtain a target object from among the at least one object based on an operation status of the electronic apparatus, the information on the engagement of each of the at least one object, and the obtained gesture information of each of the at least one object; identify a function corresponding to gesture information of the target object; and execute the identified function.

An electronic device is provided. The electronic device includes a display for outputting a screen and a processor operatively connected to the display. The processor is configured to receive a user input associated with movement of a screen output on the display, detect a screen movement speed corresponding to the user input associated with the screen movement, determine an amount of screen tilt compensation corresponding to the screen movement based on the screen movement speed, when the screen movement speed is included in a first interval, and keep the amount of screen tilt compensation based on the screen movement speed constant, when the screen movement speed is included in a second interval faster than the first interval.

Method for compensating for screen movement of display and electronic device for supporting the same

Growing community of inventors

Suwon-si, South Korea

Taehyeong Kim