Samsung Electronics Co., Ltd.

Taehwan Oh

Sangjin Kim

Kwangsub Yoon

Woojeong Shin

Minchul Jun

Changseok Han

Taehoi Park

Byeongcheol Choi

Sangmin An

Nakhee Seong

Haengjin Lee

A method of manufacturing a multi-chip package (MCP) is provided. The MCP includes a first type semiconductor chip, a second type semiconductor chip, and a memory controller configured to control the second type semiconductor chip. The method includes mounting the first type semiconductor chip and the memory controller on a substrate, mounting the second type semiconductor chip on the first type semiconductor chip, forming a mold layer to cover the first and second type semiconductor chips and the memory controller, performing a function test on the first type semiconductor chip and simultaneously determining whether a crack defect occurred in the second type semiconductor chip. The crack defect of the second type semiconductor chip is determined when a current measured in a low power mode test of the second type semiconductor chip is greater than or equal to a test reference value.

Test method of storage device implemented in multi-chip package (MCP) and method of manufacturing an MCP including the test method

A resist coating apparatus including a resist supplying system; a resist filtering system having a first filter, a second filter, and a pump between the first filter and the second filter; and a resist dispensing system, wherein the first filter includes a plurality of first unit filters connected in parallel.

Resist filtering system having multi filters and apparatus having the resist filtering system

Growing community of inventors

Suwon-si, South Korea

Taehwan Oh