Samsung Electronics Co., Ltd.

Lg Display Co., Ltd.

Samsung Display Co., Ltd.

Lg Electronics Inc.

Lg Innotek Co., Ltd.

Other

Korea University Research and Business Foundation

Jinwoo Engineering Co., Ltd.

Taehwan Kim

JungSun Baek

Byungyong Kim

Kihuk Lee

DeukSu Lee

Jonghwan Lee

Hwajoong Jung

Sunmi Lee

Jaechoon Kim

Boram Lee

Ji-Hyun Park

Minjoo Kim

Sungguk An

Hyoeun Kim

Heungkyu Kwon

Sunkyoung Seo

Wonil Lee

Hyungjin Rho

Kyungsuk Oh

Kwangseok Byon

Min-Ok Na

Bongchan Kim

Jaeheung Park

Sanguk Han

Jiseong Yang

Sangwon Kim

Junghwan Choi

Jangwoo Lee

Jongbo Shim

Kyung Suk Oh

Jongsun Park

Jae Choon Kim

In-Hwan Lee

Ji Hwang Kim

Youngbae Kim

SungHyun Cho

Sangil Kim

Yong-Il Kim

Kyunglack Kim

Eunhye Lee

Hyeonchul Im

Donggeun Chang

Shunghun Woo

Suhwan Moon

Kyohyuck Choo

Minkyung Lee

Miyoung Do

Ilho Kim

Shinkwon Park

Changkeun Park

Byungkwon Kang

Sanggu Kim

Jeonggi Yun

Jaehoon Jeong

HungKun Ahn

Seokjae Lee

Eungchang Lee

Hyunjung Song

Seokjoon Hong

Jonghan Park

Gyeongmin Kim

EunHye Lee

Taeoh Ahn

Seungjin Park

SunMi Lee

Doyoung Kim

Manho Kim

Yonghwan Choi

Sungeun Jo

Minsuk Choi

Yungcheol Kong

Seunggeol Ryu

Jongseong Kim

HyeonChul Im

Gyuseog Hong

Yongil Kim

Young-Deuk Kim

Soyoung Noh

Younsik Park

Jinwoo Nam

Sunghoon Jang

Sungho Roh

Hyungjung Seo

Youngdeuk Kim

Kwangsub Byun

Byunghun Choi

Sungjin Son

Chaeyoung Lee

Yunho Jang

Hyunglak Ma

Byungho Choi

Hyunyoung Lim

A semiconductor package includes; a package substrate, an interposer disposed on the package substrate, semiconductor chips mounted on the interposer, a molding member on the interposer and surrounding the semiconductor chips, a first sealing member on the molding member, and a heat dissipation member on the package substrate and covering the interposer, the semiconductor chips, and the first sealing member, wherein the heat dissipation member includes a lower structure contacting an upper surface of the package substrate, and an upper structure on the lower structure, extending over the first sealing member, and including a microchannel and a micropillar on the microchannel.

Semiconductor package and cooling system

A system for verifying an integrated circuit includes a tracing module configured to: trace a specified path based on the specified path on which a timing analysis will be performed among a plurality of signal transfer paths within the integrated circuit and a netlist of the integrated circuit at a transistor level, generate a list of nets listing names of nets in the specified path based on the netlist and information on the specified path, declare design constraints for the specified path based on the list of the nets, and generate parasitic data for the net based on the list of the nets. The system further includes an analysis module configured to perform a timing analysis for the specified path based on the design constraints and the parasitic data.

Methods and systems for verifying integrated circuits

A display apparatus for a vehicle is disclosed. A display apparatus for a vehicle according to an embodiment of the present disclosure includes: an organic light emitting diode (OLED) panel; a driving controller to output a driving signal; a first temperature detector in a first area of a rear surface of the OLED panel; a second temperature detector in a second area of the rear surface of the OLED panel; and a signal processing device to perform a first degradation compensation mode or a second degradation compensation mode based on a difference between a first temperature and a second temperature, wherein the signal processing device controls a luminance compensation value in the second degradation compensation mode to be greater than a luminance compensation value in the first degradation compensation mode. Accordingly, degradation may be reduced in an adaptive manner based on the temperature of each area of the panel.

Display apparatus for vehicle

An electronic apparatus may include: a video processor configured to output a video frame; a graphic processor configured to output a graphic frame; a mixer; and a processor which may be configured to: control the mixer to generate and output a first composite frame based on the video frame and the graphic frame, generate a second composite frame, which comprises a video area corresponding to the video frame and a graphic area corresponding to the graphic frame in a displayed image, and in which the video area and the graphic area have undergone image effect processing, based on an event of the image effect processing, and control the mixer to output the second composite frame.

Electronic device and control method thereof

Disclosed is a camera module. The camera module includes a lens assembly including a lens and an image stabilization assembly including a moving member including a first substrate and an image sensor electrically connected to the first substrate, the image stabilization assembly being connected to the lens assembly wherein an optical axis is at least partially aligned with the image sensor. The image stabilization assembly is configured to move the moving member in at least one direction perpendicular to the optical axis such that the optical axis is aligned with a specified position on the image sensor.

Camera module including image stabilization assembly and electronic device including the camera module

A semiconductor package includes a first semiconductor chip, a second semiconductor chip stacked on the first semiconductor chip, and a plurality of third semiconductor chips sequentially stacked on the second semiconductor chip, in which a horizontal width of each of the first semiconductor chip and the second semiconductor chip is greater than a horizontal width of each of the plurality of third semiconductor chips, and the first semiconductor chip and the second semiconductor chip are connected to each other through direct contact of a bonding pad.

Semiconductor package comprising heat spreader

Embodiments of the present disclosure provide a spin orbit torque device-based processing-in-memory device that includes a digital logic gate using a current switching and voltage controlled magnetic anisotropy (VCMA) effect of a spin orbit torque device capable of being used as a memory element, and increases the overall system energy efficiency by designing a memory capable of performing an MAC operation to reduce the number of data migration between a memory and an operator.

Processing-in-memory device based on spin orbit torque device

Discussed is a touch display device that can include a substrate including an active area and a non-active area, a transistor disposed on the substrate, a sub-pixel electrically connected to the transistor, and including an organic light emitting diode, an encapsulation layer disposed on the organic light emitting diode, a planarization layer disposed on the encapsulation layer, and a plurality of touch electrodes disposed between the encapsulation layer and the planarization layer, the plurality of touch electrodes including an open area. The planarization layer can include a thickness variation at the open area of the plurality of touch electrodes.

Touch display device

A semiconductor package includes a first semiconductor chip including first through electrodes and having a first hot zone in which the first through electrodes are disposed; a heat redistribution chip disposed on the first semiconductor chip, having a cool zone overlapping the first hot zone in a stacking direction with respect to the first semiconductor chip, and including first heat redistribution through electrodes disposed outside of an outer boundary of the cool zone and electrically connected to the first through electrodes, respectively; a second semiconductor chip disposed on the heat redistribution chip, having a second hot zone overlapping the cool zone in the stacking direction, and including second through electrodes disposed in the second hot zone and electrically connected to the first heat redistribution through electrodes, respectively; and a first thermal barrier layer disposed between the first hot zone and the cool zone, wherein the first through electrodes are electrically connected to the second through electrodes by bypassing the cool zone via the first heat redistribution through electrodes.

Semiconductor package and method of manufacturing the same

Disclosed is a transparent display device comprising a substrate including a transmission area and a non-transmission area including a light emission area in which a light emitting element is disposed, a touch sensor disposed over the transmission area of the substrate, a touch sensor line disposed over the non-transmission area of the substrate and extended in a first direction, a touch sensor connection line extending in a second direction, a touch sensor contact portion disposed in the transmission area and configured to electrically connect the touch sensor and the touch sensor connection line to each other, and a touch sensor bridge pattern disposed between the touch sensor contact portion and the touch sensor connection line.

Transparent display device

A semiconductor package may include vertically-stacked semiconductor chips and first, second, and third connection terminals connecting the semiconductor chips to each other. Each of the semiconductor chips may include a semiconductor substrate, an interconnection layer on the semiconductor substrate, penetration electrodes connected to the interconnection layer through the semiconductor substrate, and first, second, and third groups on the interconnection layer. The interconnection layer may include an insulating layer and first and second metal layers in the insulating layer. The first and second groups may be in contact with the second metal layer, and the third group may be spaced apart from the second metal layer. Each of the first and third groups may include pads connected to a corresponding one of the first and third connection terminals in a many-to-one manner. The second group may include pads connected to the second connection terminal in a one-to-one manner.

Semiconductor package

A display panel and a display device capable of reducing peeling due to a decrease in interlayer adhesion by direct contact of a color filter with a first insulating layer are provided.

Display panel and display device

An electronic device including a camera module is provided. The camera module includes a lens assembly including a lens, a lens holder in which the lens assembly is fixedly disposed, a sensor carrier that includes an image sensor at least partially aligned with an optical axis of the lens and a circuit board electrically connected with the image sensor and that moves in a first axial direction perpendicular to the optical axis and a second axial direction perpendicular to the optical axis and the first axial direction, a fixed substrate adjacent to the sensor carrier and fixed in a specified position, and a connecting member that extends from the circuit board to the fixed substrate and that extends to surround at least three interconnected edges of the circuit board when viewed in a direction of the optical axis.

Camera having movable image sensor and electronic device including the same

Disclosed is a technology of preferentially forming an ohmic contact layer and a conductor layer before separating a nanorod light emitting diode (LED) from a substrate, thereby being capable of omitting a heat treatment process performed at high temperature after aligning the nanorod LED, and, accordingly, preventing electrical short while maximizing the quantum efficiency of the nanorod LED and increasing a selection range of a material constituting a light emitting diode (LED) display. More particularly, the nanorod LED includes a first semiconductor layer; a multi-quantum well structure layer; a second semiconductor layer; and a conductor layer formed on at least one semiconductor layer of the first semiconductor layer and the second semiconductor layer, wherein a length and shape of the conductor layer are controlled such that the multi-quantum well structure layer is disposed between two electrodes of the electrode pattern on which the conductor layer is to be aligned.

Nanorod light emitting diode and method of fabricating the same

A semiconductor package includes a package substrate, a lower semiconductor device arranged on the package substrate and including first through electrodes, first lower connection bumps arranged between the package substrate and the lower semiconductor device and electrically connecting the package substrate to the first through electrodes, a connecting substrate arranged on the package substrate and including second through electrodes, second lower connection bumps arranged between the package substrate and the connecting substrate and electrically connecting the package substrate to the second through electrodes, and an upper semiconductor device arranged on the lower semiconductor device and electrically connected to the first through electrodes and the second through electrodes.

Growing community of inventors

Seoul, South Korea

Taehwan Kim