Samsung Electronics Co., Ltd.

Taehee Han

Youngsik Hur

Youngkwan Lee

Sunghwan Kim

Kiseok Lee

Yoonyoung Choi

Yonghoon Kim

Jiseok Hong

Seunguk Han

Jiyoung Ahn

Seoryong Park

Yuntae Lee

An integrated circuit device is provided. The integrated circuit device includes: a bit line on a substrate, the bit line including a lower conductive layer and an upper conductive layer; an insulating capping pattern on the bit line; and a main insulating spacer on a sidewall of the bit line and a sidewall of the insulating capping pattern, the main insulating spacer including an extended portion that is convex toward the upper conductive layer.

Integrated circuit device having a bit line and a main insulating spacer with an extended portion

A semiconductor package includes: a frame having a cavity and including a wiring structure connecting first and second surfaces of the frame; a first connection structure on the first surface of the frame and including a first redistribution layer connected to the wiring structure; a first semiconductor chip on the first connection structure within the cavity; an encapsulant encapsulating the first semiconductor chip and covering the second surface of the frame; a second connection structure including a second redistribution layer including a first redistribution pattern and first connection vias; and a second semiconductor chip disposed on the second connection structure and having connection pads connected to the second redistribution layer.

Semiconductor package having a redistribution layer for package-on-package structure

A semiconductor package includes a core layer formed of a ferromagnetic material, and includes a frame passing through the core layer and having a through-hole, a semiconductor chip disposed in the through-hole of the frame, and having an active surface on which a connection pad is disposed, and an inactive surface opposite to the active surface, an encapsulant covering at least a portion of the semiconductor chip, and a first connection structure including a first redistribution layer disposed on the active surface of the semiconductor chip and electrically connected to the connection pad.

Semiconductor package

Growing community of inventors

Suwon-si, South Korea

Taehee Han