Lg Innotek Co., Ltd.

Samsung Electronics Co., Ltd.

Lg Innotek

Samsung Display Co., Ltd.

Sungkyunkwan University

Miwon Co., Ltd.

Tae Young Choi

Dong Nyung Lim

Sung Ho Kim

Jihoo Kim

Cheonjoo Kim

Seok Jin Kang

Hwa Young Kim

Han Gyoul Kim

Kyung Il Kong

Do Hwan Kim

Cheon Joo Kim

Keun Tak Joo

Sang Hoon Lee

Il Yeong Kang

Sungho Hong

Ji Hoo Kim

Sung Ku Kang

Dong Soo Kim

Chan Hyung Jung

Ki Soo Kwon

Sang Won Lee

Keun Kyu Song

Jung Park

Seung Hwan Cho

Bo Sung Kim

Jae Jin Kim

Seung Yeon Lee

Won Jin Son

Jong Tae Park

Jung Ha Hwang

Jung Sung Kim

Seung Hyuk Lee

Jang Gu Oh

Chang Su Park

Kwang Hee Lee

Jae Hyun Kim

Chul Soo Yoon

Sang Kyun Lee

Won Jae Joo

Sung Woo Choi

Nae-eung Lee

Jin Hee Lee

Woo Jung Park

Jong Won Jeon

Sung Hak Jo

Jung Eun Yoon

E Nam Hwang

Hong K Choi

Hong Rhym

Byung L Lim

Sun Yeol Choi

A capacitor structure includes: a first substrate having a first electrode part provided on one surface thereof; a second substrate having a second electrode part provided on a surface thereof, which faces the first substrate; and a dielectric layer provided between the first substrate and the second substrate, wherein a Poisson's ratio of the first substrate or the second substrate is different from a Poisson's ratio of the dielectric layer. The capacitor structure has a substantially constant capacitance even when the capacitor structure is exposed to external strain.

Capacitor structure, display device having capacitor structure, and manufacturing method of capacitor structure

A light source unit disclosed in an embodiment of the invention includes: a first cover having an open region at an upper portion and a recess in which a lower portion is opened; a second cover coupled to the lower portion of the first cover; a light source module disposed between the first and second covers and having a circuit board and a light emitting device on the circuit board; a waterproof film disposed on the light emitting device and facing an upper surface of the circuit board; and first and second gaskets on the upper surface of the circuit board. The first cover and the second cover are coupled to each other by protrusions and grooves and are bonded to each other by a bonding portion.

Light source unit

A lighting device may be provided that includes: a heat sink which includes a base and a member extending from the base; a light source module which is disposed on a lateral surface of the member; and a reflector which is disposed on the member and has a disposition recess exposing the light source module, wherein the at least two light source modules are provided and the light source module includes a terminal plate which electrically connects the at least two light source modules, and wherein the terminal plate is disposed on the reflector.

Lighting device having reflectors for indirect light emission

There is provided a red phosphor that may include a nitride represented by a formula of (SrBaEu)SiN, wherein 0&#x3c;x&#x3c;0.7, and 0&#x3c;y&#x3c;0.1. The red phosphor may emit light having a peak wavelength in a range of 600 nm to 630 nm when irradiated by an excitation source and the excitation source may be a blue light source having a dominant wavelength in a range of 420 nm to 470 nm.

Red phosphor, white light emitting apparatus, display apparatus, and lighting apparatus

A semiconductor light emitting device includes: a package body having a cavity, and having a first wiring electrode and a second wiring electrode disposed on a bottom surface of the cavity; a light emitting diode (LED) chip having a first surface with a first electrode and a second electrode thereon, a second surface, and lateral surfaces, the LED chip being mounted in the cavity such that the first surface faces the bottom surface, a wavelength conversion film on the second surface of the LED chip, and including a first wavelength conversion material, and a reflective resin portion in the cavity that surrounds the LED chip.

Semiconductor light emitting device

A light emitting device package includes a package body having a mounting region including a mounting surface for a light emitting device, a groove portion, and a bottom surface lower than the mounting surface, and a lead frame supported by the package body, a portion of the lead frame being disposed on the bottom surface and a portion of the lead frame being exposed by the groove portion. The light emitting device has a first plane on which an electrode pad is disposed, a second plane opposite the first plane, and a third plane disposed between the first plane and the second plane to connect the first plane to the second plane. The light emitting device is to be disposed in the mounting region such that the first plane is in contact with the mounting surface and the electrode pad is in the groove portion.

Light emitting device package and method of manufacturing the same

A lighting device includes a heat sink including a first heat radiation part and a second heat radiation part, a light source module including a substrate disposed on the first heat radiation part of the heat sink, and a light emitting device disposed on the substrate; and a power supply unit which is disposed within the second heat radiation part of the heat sink and supplies power to the light source module.

Lighting device

The light-emitting module according to one embodiment comprises first to Nth light-emitting element packages (wherein N is a positive integer greater than or equal to 1), which are connected in series to one another, and a current level regulator for regulating the level of current flowing through the Nth light-emitting element package. Each of the first to Nth light-emitting element packages comprises a light-emitting cell comprising a plurality of sub-cells, which comprise at least one light-emitting element and are connected in series or parallel to one another, and a flicker control unit, which is connected between the plurality of sub-cells and selectively forms the path of current flowing through the light-emitting cell according to the level of an external driving voltage. At least one of the first to Nth light-emitting element packages further comprises a first current control resistor connected to the output of the light-emitting cell.

Light-emitting module

A light emitting module includes a plurality of light emitting device packages configured to be sequentially turned on or off according to the level of external drive voltage and connected to one another in series. Each of the plurality of light emitting device packages includes a light emitting cell having at least one light emitting device, and an on/off controller configured to control to turn the light emitting cell on or off.

Light emitting module

A lighting device may be provided to include a heat sink which includes a receiving recess and a top surface including a hole; a light source module which includes a substrate disposed on the heat sink, a light emitting device disposed on the substrate and a pad disposed on the substrate; a power supplier which is disposed in the receiving recess of the heat sink and includes a projection outputting a power signal for driving the light source module; and a connector which is coupled to the hole of the heat sink, includes a contacting part electrically connected to the pad of the light source module, and is electrically connected to the projection of the power supplier.

A lighting device may be provided that includes: a heat sink; a light source module which is disposed on the heat sink, includes a substrate having at least one hole, and includes a plurality of light emitting devices disposed on a top surface of the substrate; a power supply unit which is disposed within the heat sink and includes a support plate and a plurality of parts disposed on the support plate; and a soldering portion which connects the substrate and the support plate. The support plate includes an extended substrate which is disposed in the hole of the substrate. The extended substrate includes a through-portion which has passed through the hole of the substrate. The soldering portion electrically connects the through-portion of the extended substrate and the top surface of the substrate.

A lighting device includes a heat sink for dissipating heat from a light source. The heat sink is located between an inner case and an outer case, and a power controller is located in the inner case. The light source may include one or more light emitting diodes.

A light emitting module includes a body, first to M(wherein, M is an integer of 2 or greater) light emitting devices provided on the body to be spaced apart from each other, and a turn-on controller controlling the first to Mlight emitting devices to turn on. An m(1&#x2266;m&#x2266;M) light emitting device among the first to Mlight emitting devices comprises first to N(wherein, N is an integer of 2 or greater) light emitting cells connected to each other in series. An n(1&#x2266;n&#x2266;N) light emitting cell among the first to Nlight emitting cells includes at least one light emitting structure, and the turn-on controller simultaneously turns on or turns off the nlight emitting cells of the first to Mlight emitting devices.

Light emitting module and lighting unit including the same

A lighting device includes a heat sink including a first heat radiation part and a second heat radiation part; a light source module including a substrate disposed on the first heat radiation part, and a light emitting device disposed on the substrate; and a power supply unit which is disposed within the second heat radiation part and supplies power to the light source module. The second heat radiation part includes an inner portion receiving the power supply unit therewithin, an outer portion enclosing the inner portion, and a first receiver disposed between the inner portion and the outer portion. The first heat radiation part includes an upper portion which is disposed on the inner portion of the second heat radiation part and on which the substrate of the light source module is disposed, and a lower portion disposed in the first receiver of the second heat radiation part.

An organic thin film transistor substrate and a method of manufacturing the organic thin film transistor substrate capable of preventing overflow of an organic semiconductor layer. An organic thin film transistor substrate comprises a gate line formed on the substrate, a data line intersecting the gate line, a thin film transistor connected to the gate line and the data line and including an organic semiconductor layer, a pixel electrode connected to the thin film transistor, an organic protective layer protecting the thin film transistor, a first bank-insulating layer providing filling areas in the organic gate insulating layer and the organic semiconductor layer, and a second bank-insulating layer providing the filling area of the organic semiconductor layer together with the first bank-insulating layer and formed on a source electrode and a drain electrode of the thin film transistor.

Organic thin film transistor substrate and method of manufacturing the same

Growing community of inventors

Seoul, South Korea

Tae Young Choi