Skhynix Inc.

Hyundai Transys Incorporated

Intel Corporation

Hideep Inc.

Hyundai Powertech Co., Ltd.

Samsung Electro-Mechanics Co., Ltd.

Suzhou Lekin Semiconductor Co., Ltd.

Other

Hynix Semiconductor Inc.

Lg Innotek Co., Ltd.

Sungkyunkwan University

Psk Inc.

Samsung C&t Corporation

Samsung Display Co., Ltd.

Sk Microworks Solutions Co., Ltd.

Tae Yong Lee

Seung Hun Lee

Seung-Kyu Lee

Hyung Dong Lee

Beom Seok Lee

Hwan Jun Zang

Woongrae Kim

Jung Hee Ryu

Myoung Sub Kim

Bon Kee Kim

Myung Kyun Kwak

Seung Yun Lee

Woo Tae Lee

Ki Bum Kim

Sung Woo Han

Sang Sic Yoon

Ki Won Lee

Ic Su Oh

Sun Ki Cho

Bok Gyu Min

Jong Hoon Kim

Sang Youl Lee

Dae Won Kim

Young Ho Kim

Ji Hyun Ka

Sang Jun Park

Young Ki Lee

Ji Hyung Moon

Sang Jin Park

Ji Hyun Park

Tae Won Lee

Geun Ho Choi

Sang Hyun Shin

Yong Gyeong Lee

Ji Man Hong

Hyeong Seok Choi

Chung Song Kim

Young Gyun Kim

Chung Yuen Won

Jeong Kyu Park

Hwan Hee Lee

Jiman Hong

Sang Hoon Shin

Se Yeon Jung

Jae Myun Kim

Deok Ki Hwang

Yong Hyok Ji

Kyoo Choong Cho

Ji Sun Han

Se Yeob Kim

Byung Jick Cho

Ho Jun Moon

Sang Hyun Ban

Hye Jung Choi

Myung Jun Jin

Jun Ho Lee

Bong Jin Seo

Si Jung Yoo

Boo Ho Jung

Yang Hee Kim

Da Un Nah

Yeon Ho Kim

Han Kyu Lee

Min Ho Heo

Byung Hak Jeong

Jae Hun Jeong

Yoo Jong Lee

Jong Hyun Choi

Yong Jae Choe

Seok Man Hong

Sung Mook Kim

Cheol Ho Heo

Won Lee

Chae Sung Lee

Kwang Soo Choi

Bum Doo Park

Ki Bum Sung

Hyo Eun Kang

Jae Woong Jeong

Sang Rock Park

Yong Han Jeon

Jae Joon Ahn

Min Je Park

Chang Weon Lee

Jong Hoon Lee

Eun Kyu Choi

Ki Ho Seo

Su Il Jin

Jongjin Lee

Bum Joon Park

Sunwoong Yim

Min Sik Kang

Joon Ki Hong

Se Uk Cheon

Rak Hun Choi

Tae Seung Han

Hyo Gil Cha

Jung Tae Jeong

Seon Dong Kwak

Sun Young Kwon

Proposed is a transmission including a casing unit, a housing unit coming into contact with the casing unit, an input shaft support integrally formed with the housing unit and having a lubricant flow path, a lubricant flowing through the lubricant flow path, and a coupling portion coupling the casing unit and the housing unit to each other.

Transmission

An auxiliary power supply includes an auxiliary power storage configured to store power that is input to the auxiliary power supply and a control circuit, wherein the control circuit is configured to charge, for a reference time amount after the power is input to the auxiliary power supply, the auxiliary power storage by a first current source having a preset peak current level, determine, after the reference tune amount, that the auxiliary power supply is in a slow charging state when a voltage level that is charged to the auxiliary power storage by the first current source for the reference time amount is lower than a reference voltage level, and increase, in response to the slow charging state, the peak current level to charge the auxiliary power storage by a second current source having the increased peak current level that is greater than the preset peak current level.

Auxiliary power supply, operating method of the auxiliary power supply and storage device including the auxiliary power supply

Provided is a power transmission apparatus for a hybrid vehicle, the power transmission apparatus including a connecting shaft having an edge portion connected to a mass by a connecting plate, the connecting shaft being coupled to an outer side of a first rotor shaft connected to a first rotor of a first motor, and a drive plate positioned adjacent to a crankshaft while facing the connecting shaft, the drive plate being configured to connect the mass and the crankshaft.

Power transmission apparatus for hybrid vehicle

A method for manufacturing an electronic device including a semiconductor memory may include forming a first carbon electrode material, surface-treating the first carbon electrode material to decrease a surface roughness of the first carbon electrode material, and forming a second carbon electrode material on the treated surface of the first carbon electrode material. The second carbon electrode material may have a thickness that is greater than a thickness of the first carbon electrode material.

Electronic device and method for manufacturing electronic device

An engine connection structure for a hybrid transmission includes: a connecting mechanism having an edge connected with a mass by a connecting plate and connected to a counter-rotor shaft; and a drive plate being opposite to the connecting mechanism, positioned at a crankshaft, and connecting the mass and the crankshaft to each other.

Engine connection structure for hybrid transmission

A stack package is disclosed. A first semiconductor die and a supporter are disposed on a package substrate. The supporter may include a second side facing a first side of the first semiconductor die having a substantially inclined surface. A second semiconductor die is stacked on the first semiconductor die and on the supporter. An encapsulant layer is formed to fill a portion between the supporter and the first semiconductor die.

Stack packages including supporter

An embodiment relates to a surface emitting laser device and a light emitting device including the same. The surface emitting laser device according to an embodiment may comprise: a substrate; a first reflective layer arranged on the substrate; an active layer arranged on the first reflective layer; an aperture layer arranged on the active layer and comprising an opening; a second reflective layer arranged on the active layer; a transparent electrode layer arranged on the second reflective layer; and a metal electrode layer arranged on the transparent electrode layer. The transparent electrode layer may comprise a first area perpendicularly overlapping the opening and multiple second areas extending from the first area. The multiple second areas may be arranged outside the opening along the circumferential direction of the opening and spaced apart from each other. The multiple second areas may be arranged and spaced apart from each other so as to correspond to the circumference of the opening. The metal electrode layer may electrically contact the second reflective layer between the multiple second areas.

Surface emitting laser device and light emitting device including the same

The present invention provides an assembly structure of a hybrid transmission including an engine clutch retainer provided with an assembly hole; a coupling member assembled through the assembly hole; and a sealing cover configured to seal the assembly hole.

Assembly structure of hybrid transmission

The present technology includes a power supply and a method of operating the same. The power supply includes a main power supply configured to receive external power and output a charge voltage and main power, and an auxiliary power supply including a capacitor array configured to charge auxiliary power using the charge voltage and output the auxiliary power. The auxiliary power supply is configured to periodically repeat a discharge operation and a sub charge operation on the capacitor array when the charging of the capacitor array is started.

Auxiliary power supply including capacitor array and method of operating the same

In a power train of an automatic transmission, a first carrier is integrally configured with a single pinion that is engaged with a first sun gear and a first ring gear, a second carrier is integrally configured with a single pinion that is engaged with a second sun gear and a second ring gear, a third carrier is integrally configured with a single pinion that is engaged with a third sun gear and a third ring gear, and a fourth carrier is integrally configured with a single pinion that is engaged with a fourth sun gear and a fourth ring gear, and in which a reverse shift position is implemented by transmitting a reverse drive of a motor through an input shaft to the same power transmission path as a first shift position.

Power train of automatic transmission

An electronic device includes a semiconductor memory including material layers each including one or more low-resistance areas and one or more high-resistance areas, insulating layers stacked alternately with the material layers and including protrusions extending more than the material layers, conductive pillars passing through the insulating layers and the low-resistance areas, conductive layers located between the protrusions, and variable resistance layers interposed between the low-resistance areas and the conductive layers.

A semiconductor package includes at least one semiconductor chip disposed in such a way that an active surface with chip pads faces a redistribution layer, vertical interconnectors extending in a vertical direction from the chip pads toward the redistribution layer, wherein each of the vertical connectors has a first end portion that is connected to a corresponding chip pad and a second end portion that is disposed on an opposite end of each vertical interconnector in relation to the first end portion, and a molding layer covering the semiconductor chip and the vertical interconnectors while exposing a surface of each of the second end portions of the vertical interconnectors, wherein the redistribution layer is formed over the molding layer, the redistribution layer having a redistribution land that is in contact with the surface of the second end portion, and wherein a width of the surface of the second end portion is greater than a width of an extension portion between the first end portion and the second end portion of each vertical interconnector.

Semiconductor package including vertical interconnector

A power transmission device for a hybrid vehicle may include: an engine part; a transfer part configured to transfer power of the engine part; a motor part configured to provide power to the transfer part, and driven when power is applied thereto; and a plurality of torsion damper parts disposed between the engine part and the motor part, and connected in series.

Power transmission device for hybrid vehicle

Growing community of inventors

Gyeonggi-do, South Korea

Tae Yong Lee