Ams Sensors Singapore Pte. Ltd.

Tae Yong Ahn

Kyu Won Hwang

Sai Mun Chan

Hartmut Rudmann

Optoelectronic modules, such as imaging cameras, proximity sensors, range cameras, structured-light/pattern generators, and image projectors, and methods for their manufacture, are disclosed. The optoelectronic modules exhibit particularly small dimensions. The optoelectronic modules include an optical assembly, an intermediate substrate, and a base substrate. The optical assembly includes a flange portion. An adhesive layer between the flange portion and the intermediate substrate, and an additional adhesive layer between the intermediate substrate and the base can be substantially non-transmissive to light and can resist dimensional changes dues to moisture absorption, for example.

Optoelectronic modules and methods for manufacturing the same

Optoelectronic modules include overmolds that support an optical assembly and, in some case, protect wiring providing electrical connections between an image sensor and a printed circuit board (PCB) or other substrate. The disclosure also describes wafer-level fabrication methods for making the modules.

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Singapore, Singapore

Tae Yong Ahn