Samsung Electronics Co., Ltd.

Tae Woo Kang

Wang Byung Chae

Hyeon Cheol Park

Kyoung-Min Lee

Hee Seok Lee

Yun Hyeok Im

Yeong Seok Kim

Kyung Hoon Kim

Hyeong Joon Seo

Sung Hee Lee

Kwang Ho Choi

Mun Sub Kim

Jin Yong Mo

Il Yong Cho

Tae Il Kim

Sung Goo Kim

Hyun Wuk Kang

Seung Ho Hong

Kyo Seung Kim

Ji-Ho Baek

Youn Sang Jang

Tae Sung Choi

Han Suk Lee

Hyeon U Park

Ji Ho Baek

The semiconductor package including a first semiconductor package including a first semiconductor package substrate, and a first semiconductor chip on the first semiconductor package substrate, an interposer disposed on the first semiconductor package is provided. Interposer electrically connects the first semiconductor package with an external semiconductor package, and has first and second sides opposed to each other. The second side is located between the first side and the first semiconductor package substrate, a first recess is formed in the second side of the interposer. The first recess has side walls extended from the second side toward the first side of the interposer and an upper surface connected to the side walls and the upper surface of the first recess faces the first semiconductor chip and a via in the interposer. The via does not transmit an electrical signal between the first semiconductor package and the external semiconductor package.

Semiconductor package

An outdoor unit of an air conditioner having an improved structure to efficiently cool a heating unit of electronic parts therein, a cooling unit applied to the outdoor unit, and a method for manufacturing the cooling unit are provided. The outdoor unit of an air conditioner includes a case, a compressor for compressing a refrigerant, a condenser for condensing a refrigerant discharged from the compressor, electronic parts arranged in the case; and a cooling unit arranged to cool the electronic parts, wherein the cooling unit comprises a heat radiation member arranged to receive and cool down heat produced from the electronic parts, and to come into contact with at least a part of a cooling pipe in which the refrigerant flows, and a plurality of heat transfer fins formed at least some part of the heat radiation member.

Outdoor unit of air conditioner, cooling unit applied to the outdoor unit, and method for manufacturing the cooling unit

In an air-conditioning system, a gaseous refrigerant remaining in a reservoir can be discharged from the reservoir even when a cooling operation has started and the reservoir is being filled with a liquid refrigerant. Therefore, the reservoir can be filled with the liquid refrigerant at a faster speed.

Air-conditioning system

Provided are an outdoor unit of an air conditioner that detects snow that piles up on the outdoor unit of the air conditioner and a method of controlling the same. When a detection device is installed in the outdoor unit and snow piles up in a snow cover detection area included in the detection device, it is detected using an optical sensor whether snow cover occurs. A value detected by the optical sensor is transmitted to a controller, and the controller compares the value with a default value, and when the controller receives a value different from the default value, the controller controls a fan driving unit to drive a fan. Wind generated by driving the fan removes snow that piles up in the snow cover detection area, a fan guard and a discharge port to prevent the fan from malfunctioning due to accumulated snow.

Outdoor unit of air conditioner and method of controlling the same

Growing community of inventors

Suwon-si, South Korea

Tae Woo Kang