Samsung Electronics Co., Ltd.

Furex Co., Ltd.

Tae-weon Suh

Kyoung-sei Choi

Pyoung-Wan Kim

Seung-Kon Mok

Byoung-rim Seo

Yoon-young Choi

Chang-soo Jin

Provided is an image sensor package that includes a transparent protection cover for protecting a plurality of unit pixels each including a microlens. The image sensor package includes a substrate which has a first surface and a second surface that are opposite to each other, and includes a sensor array region including a plurality of unit pixels formed in the first surface and a pad region including a pad arranged in the vicinity of the sensor array region, a plurality of microlenses formed on the plurality of unit pixels, respectively, at least two transparent material layers covering the plurality of microlenses, and a transparent protection cover attached onto the plurality of microlenses with the at least two transparent material layers interposed therebetween.

Image sensor package

Growing community of inventors

Ansan-si, South Korea

Tae-weon Suh