Growing community of inventors

Uiwang-si, South Korea

Tae Wan Kim

Average Co-Inventor Count = 6.22

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 0

Tae Wan KimDong Hun Kang (4 patents)Tae Wan KimJung Min Choi (2 patents)Tae Wan KimChang Ki Hong (2 patents)Tae Wan KimJong Il Noh (2 patents)Tae Wan KimJeong Hwan Jeong (2 patents)Tae Wan KimYong Sik Yoo (2 patents)Tae Wan KimGo Un Kim (2 patents)Tae Wan KimYoung Chul Jung (1 patent)Tae Wan KimYong Soon Park (1 patent)Tae Wan KimYoung Nam Choi (1 patent)Tae Wan KimYong Kuk Kim (1 patent)Tae Wan KimHaruki Nojo (1 patent)Tae Wan KimTae Wan Kim (4 patents)Dong Hun KangDong Hun Kang (7 patents)Jung Min ChoiJung Min Choi (4 patents)Chang Ki HongChang Ki Hong (4 patents)Jong Il NohJong Il Noh (4 patents)Jeong Hwan JeongJeong Hwan Jeong (3 patents)Yong Sik YooYong Sik Yoo (2 patents)Go Un KimGo Un Kim (2 patents)Young Chul JungYoung Chul Jung (3 patents)Yong Soon ParkYong Soon Park (3 patents)Young Nam ChoiYoung Nam Choi (2 patents)Yong Kuk KimYong Kuk Kim (2 patents)Haruki NojoHaruki Nojo (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Samsung Sdi Co., Inc. (3 from 7,636 patents)

2. Cheil Industries Inc. (1 from 787 patents)


4 patents:

1. 10723916 - Organic film CMP slurry composition and polishing method using same

2. 10287468 - CMP slurry composition for organic film and polishing method using same

3. 10150890 - CMP slurry composition for polishing copper and polishing method using the same

4. 9593260 - CMP slurry composition for polishing copper, and polishing method using same

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as of
12/6/2025
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